A carrier material has a resin layer arranged on a side of the carrier material. The resin layer includes a formaldehyde resin, a polymer selected from a group containing polyacrylates, polyepoxides, polyesters, polyurethanes, and long-chain silanols, and at least one silane-containing compound of general formula (I), R.sub.a SiX.sub.(4-a), and/or the hydrolysis product thereof, where X is H, OH, or a hydrolyzable residue selected from the group comprising halogen, alkoxy, carboxy, amino, monoalkylamino or dialkylamino, aryloxy, acyloxy, alkylcarbonyl; R is a non-hydrolyzable organic residue R selected from the group comprising alkyl, aryl, alkenyl, substituted and unsubstituted alkynyl, cycloalkyl, which can be interrupted by O or NH; and where R can have a functional group Q selected from a group containing a hydroxy, ether, amino, monoalkylamino, dialkylamino, anilino, amide, carboxy, mercapto, alkoxy, aldehyde, alkylcarbonyl, epoxide, alkenyl, alkynyl, acryl, acryloxy, methacryl, methacryloxy, cyano, and isocyano group, and a is 0-3.

A structural reinforcement for an article including a carrier (10) that includes: (i) a mass of polymeric material (12) having an outer surface; and (ii) at least one fibrous composite insert (14) or overlay (960) having an outer surface and including at least one elongated fiber arrangement (e.g., having a plurality of ordered fibers). The fibrous insert (14) or overlay (960) is envisioned to adjoin the mass of the polymeric material in a predetermined location for carrying a predetermined load that is subjected upon the predetermined location (thereby effectively providing localized reinforcement to that predetermined location). The fibrous insert (14) or overlay (960) and the mass of polymeric material (12) are of compatible materials, structures or both, for allowing the fibrous insert or overlay to be at least partially joined to the mass of the polymeric material. Disposed upon at least a portion of the carrier (10) may be a mass of activatable material (126). The fibrous insert (14) or overlay (960) may include a polymeric matrix.

A semiconductor device and method for fabricating same is disclosed. Embodiments are directed to a semiconductor device and fabrication of same which include a polycrystalline or amorphous substrate. An electrically conductive Ion Beam-Assisted Deposition (IBAD) template layer is positioned above the substrate. At least one electrically conductive hetero-epitaxial buffer layer is positioned above the IBAD template layer. The at least one buffer layer has a resistivity of less than 100 cm. The semiconductor device and method foster the use of bottom electrodes thereby avoiding complex and expensive lithography processes.

A curable composite material having high z-direction electrical conductivity. The curable composite material includes two or more layers of reinforcement carbon fibers that have been infused or impregnated with a curable matrix resin and an interlaminar region containing at least conductive nano-sized particles, e.g. carbon nanotubes, and a light-weight carbon veil. According to another embodiment, the interlaminar region further contains polymeric toughening particles. Methods for fabricating composite materials and structures are also disclosed.

A curable composite material having high z-direction electrical conductivity. The curable composite material includes two or more layers of reinforcement carbon fibers that have been infused or impregnated with a curable matrix resin and an interlaminar region containing at least conductive nano-sized particles, e.g. carbon nanotubes, and a light-weight carbon veil. According to another embodiment, the interlaminar region further contains polymeric toughening particles. Methods for fabricating composite materials and structures are also disclosed.

A heat-treated cord comprising a low modulus yarn core that is wrapped by a plurality of high modulus wrapping yarns that were heat-treated for a time at a temperature and under a load sufficient to provide a free shrinkage of at least 2 percent and a shrinkage force of at least 3 pounds.

The present invention relates to a process for the preparation of a composite for thermal insulation comprising at least layers (L1), (L2) and (LB), the process comprising the steps of providing layer (L1) containing from 25 to 95% by weight of aerogel and from 5 to 75% by weight of fibers and from 0 to 70% by weight of fillers and layer (L2) containing from 25 to 95% by weight of aerogel and from 5 to 75% by weight of fibers and from 0 to 70% by weight of fillers; applying a composition (C1) comprising an inorganic binder on one surface of the layer (L1) or layer (L2) or layer (L1) and (L2), and combining layer (L1) and layer (L2) in a manner that composition (C1) is located between layer (L1) and (L2), wherein composition (C1) is applied in the form of a, as well as a composite for thermal insulation comprising at least layers (L1), (L2) and layer (LB) which is located between layers (L1) and (L2) and the use of said composite for thermal insulation.

An organic electroluminescent device having improved emission efficiency includes an anode, an emission layer, an anode-side hole transport layer between the anode and the emission layer and mainly including an electron accepting material, a middle hole transport material layer between the anode-side hole transport layer and the emission layer and including a middle hole transport material, and an emission layer-side hole transport layer between the middle hole transport material layer and the emission layer, adjacent to the emission layer and including an emission layer-side hole transport material represented by the following Formula 1. ##STR00001##

The disclosure describes in some examples a technique that includes the disclosure describes a technique that includes depositing a carbon powder and a resin powder on a surface of a fiber preform, where the fiber preform includes a plurality of fibers and defines interstitial spaces between the plurality of fibers, and vibrating the fiber preform to allow the carbon powder and the resin powder to infiltrate the interstitial spaces between the plurality of fibers of the fiber preform to form an infiltrated preform.

A material for an organic electroluminescent device, represented by Formula 1, and an organic electroluminescent device including the same. The material for an organic electroluminescent device according to an embodiment of the present disclosure may be a triamine derivative in which the nitrogen atoms are connected (e.g., coupled) via the meta ring positions of L.sub.1 and L.sub.2 linkers, which may be represented by Formula 2. ##STR00001##