Provided is a metallic decoration film, having a protective layer, an anchor layer, a metal deposition layer, and a bonding layer. The metal deposition layer comprises indium, the protective layer comprises a first mixed resin layer and a second mixed resin layer, the second mixed resin layer is provided on the anchor layer side, the first mixed resin layer comprises a vinylidene fluoride-based resin and an acrylic acid ester-based resin, the second mixed resin layer comprises a vinylidene fluoride-based resin and an acrylic acid ester-based resin, a solid content concentration ratio (% by mass) of the vinylidene fluoride-based resin to the acrylic acid ester-based resin in the first mixed resin layer is 75:25 to 60:40, and a solid content concentration ratio (% by mass) of the vinylidene fluoride-based resin to the acrylic acid ester-based resin in the second mixed resin layer is 15:85 to 60:40.

Provided are a conductive laminate capable of achieving both high transmittance and low electric resistance, and various optical devices equipped with the same. A conductive laminate (1) includes a first transparent material layer (3), a metal layer (4) mainly composed of silver, and a second transparent material layer (5) laminated on at least one surface of a transparent substrate (2) in this order from the side of the transparent substrate (2), wherein the first transparent material layer (3) is composed of a zinc-free metal oxide, the second transparent material layer (5) is composed of a zinc-containing metal oxide, and the metal layer (4) has a thickness of 7 nm or more.

Laminated glass for vehicle includes a region with a breaking stress measured by a method described in ISO 1288-5 (2016) of 100 MPa or more and 600 MPa or less. A percentage of the region is greater than or equal to 90% of a see-through region.

Laminated glass for vehicle includes a region with a breaking stress measured by a method described in ISO 1288-5 (2016) of 100 MPa or more and 600 MPa or less. A percentage of the region is greater than or equal to 90% of a see-through region.

A semiconductor device includes a substrate, a conductive layer, a nitride mask layer, a carbon mask layer and an anti-reflective coating stack. The conductive layer is disposed on the substrate. The nitride mask layer is disposed on the conductive layer, wherein the nitride mask layer has a first stress. The carbon mask layer is disposed on the nitride mask layer, wherein the carbon mask layer has a second stress and a difference between the second stress and the first stress is smaller than 200 MPa. The anti-reflective coating stack is disposed on the carbon mask layer.

A substrate bonding method which enables forming a precision fine space using a method that is simpler and easier than conventional methods; and a laminated body production method that uses the substrate bonding method. This substrate bonding method includes disposing a first substrate on a photoresist pattern formed on a support film so as to bring the first substrate into contact with a surface of the photoresist pattern located on the side opposite to the support film, and pressure-bonding the support film, the photoresist pattern, and the first substrate; releasing the bonded support film after the pressure-bonding; and disposing a second substrate on the photoresist pattern so as to bring the second substrate into contact with the surface of the photoresist pattern located on the side opposite to the first substrate, and pressure-bonding the first substrate, the photoresist pattern, and the second substrate.

A method of forming a flexible packaging film includes providing a first web including a polymer sealant layer, the first web having a first major surface and a second major surface opposite the first major surface. A second web including a polymer outer layer is provided, the second web having a third major surface and a fourth major surface opposite the third major surface. An adhesive layer is applied to the second major surface and the first web is laminated to the third major surface. Prior to laminating the first web to the second web, one or more slits are formed in the second web.

A method of forming a flexible packaging film includes providing a first web including a polymer sealant layer, the first web having a first major surface and a second major surface opposite the first major surface. A second web including a polymer outer layer is provided, the second web having a third major surface and a fourth major surface opposite the third major surface. An adhesive layer is applied to the second major surface and the first web is laminated to the third major surface. Prior to laminating the first web to the second web, one or more slits are formed in the second web.

Porous, binderless ceramic surface modification materials are described, and applications of use thereof. The ceramic surface material is in the form of an interconnected network of porous ceramic material on a substrate. The ceramic material may include a metal oxide, a metal hydroxide, and/or hydrates thereof, or a metal carbonate or metal phosphate, on a substrate surface. The substrate may be in the form of a metal or polymer particulate, powder, extrudate, or flakes.

Sheet comprising a flexible support and a coating at least partially covering at least one face of the support, the support being made of a support material exhibiting dielectric properties, the coating being made of a coating material different from the support material and exhibiting magneto-dielectric properties or dielectric properties.