A laminated body pressing apparatus, which can restrain damage of a first outer ridge portion or a second outer ridge portion of a positive electrode plate during roller-pressing and can restrain damage of a strip-shaped first separator of a strip-shaped negative electrode body on a positive electrode plate side, includes a first press roller, a second press roller disposed parallel to the first press roller and spaced apart from the first press roller by a roller gap, and a metal plate feeding unit to feed a strip-shaped metal plate extending in a conveyance direction to the roller gap. The apparatus roller-presses the positive electrode plate and the strip-shaped negative electrode body by the first press roller and the second press roller in a state where the strip-shaped metal plate fed by the metal plate feeding unit is placed on the positive electrode plate placed on the strip-shaped negative electrode body.

A binding machine that binds objects with a tape, the binding machine includes a staple magazine unit configured to accommodate a plurality of staples, a main handle, a clincher arm configured to approach a leading staple of the plurality of staples and a clincher configured to bend the leading staple. The clincher has, on a surface thereof, a first groove that extends in an acute angle direction with respect to an axial direction of a rotation shaft of the clincher arm and has a first groove length and a first groove width, and a second groove that extends in an acute angle direction with respect to the axial direction of the rotation shaft of the clincher arm and has a second groove length and a second groove width. The second groove is disposed offset with respect to the first groove in a width direction of the first groove.

A bonding system includes a surface modifying apparatus configured to modify a bonding surface of a first substrate and a bonding surface of a second substrate; a surface hydrophilizing apparatus configured to hydrophilize the modified bonding surface of the first substrate and the modified bonding surface of the second substrate; a bonding apparatus configured to perform bonding of the hydrophilized bonding surface of the first substrate and the hydrophilized bonding surface of the second substrate in a state that the bonding surfaces face each other; and a cleaning apparatus configured to clean, before the bonding is performed, a non-bonding surface of, between the first substrate and the second substrate, at least one which is maintained flat when the bonding is performed, the not-bonding surface being opposite to the bonding surface.

A bonding system includes a surface modifying apparatus configured to modify a bonding surface of a first substrate and a bonding surface of a second substrate; a surface hydrophilizing apparatus configured to hydrophilize the modified bonding surface of the first substrate and the modified bonding surface of the second substrate; a bonding apparatus configured to perform bonding of the hydrophilized bonding surface of the first substrate and the hydrophilized bonding surface of the second substrate in a state that the bonding surfaces face each other; and a cleaning apparatus configured to clean, before the bonding is performed, a non-bonding surface of, between the first substrate and the second substrate, at least one which is maintained flat when the bonding is performed, the not-bonding surface being opposite to the bonding surface.

This application provides a composite film for a cable wrapping layer and a preparation method for the same. The composite film for the cable wrapping layer includes a PE film layer, a PET film layer laminated at the PE film layer, an aluminum foil layer laminated at the PET film layer, and a bonding layer arranged between the PET film layer and the aluminum foil layer. The PE film layer is made of raw materials having the following parts by weight: 40-45 parts of LLDPE with a melt index of 0.9-1.1 g/10 min and a density of 0.920-0.922 g/cm.sup.3, 35-40 parts of m-LLDPE with a melt index of 1.9-2.1 g/10 min and a density of 0.917-0.920 g/cm.sup.3 and 15-25 parts of ethylene-vinyl acetate copolymer.

A composite component includes a reinforcement bonded to a base component by a bond formed by, or reinforced with, a localized coupling in the base component. The bond may be formed by ultrasonic additive manufacturing. The localized coupling may include a compression of the base component, a weld in the base component, or a heat affected zone of the weld. Where the bond is formed by the localized coupling, the localized coupling encompasses the reinforcement. Where the bond is reinforced with the localized coupling, the localized coupling may encompass the reinforcement, or be arranged at an inside radius of a turn in the reinforcement. The reinforcement results in the composite component having enhanced properties such as lower density, increased strength, stiffness, or energy absorption capabilities.

An economical, efficient, and effective formation of a high resolution pattern of conductive material on a variety of films by polymer casting. This allows, for example, quite small-scale patterns with sufficient resolution for such things as effective microelectronics without complex systems or steps and with substantial control over the characteristics of the film. A final end product that includes that high resolution functional pattern on any of a variety of substrates, including flexible, stretchable, porous, biodegradable, and/or biocompatible. This allows, for example, highly beneficial options in design of high resolution conductive patterns for a wide variety of applications.

As described above, one or more aspects of the present disclosure provide articles having structural color, and methods of making articles having structural color.

A composite fabric includes a nonwoven fabric layer having non-bonded areas and a structured film layer discontinuously bonded to the nonwoven fabric layer. The discontinuously bonded nonwoven fabric layer and the structured film layer share an overlapping area with at least one set of coincident bond sites. The discontinuously bonded nonwoven fabric does not have another bonding pattern in the overlapping area distinct from the at least one set of coincident bond sites. A method of forming a composite fabric is also described. The method includes forming a fiber layer including a mat of at least partially unconsolidated fibers, positioning a structured film layer and the fiber layer such that they overlap, and discontinuously bonding the mat into a discontinuously bonded nonwoven fabric while simultaneously bonding the structured film layer to the nonwoven fabric layer. An apparatus for forming a composite fabric is also described.

A method of evaluating a laminate formed of two or more layers bonded to each other includes an image obtaining step of obtaining a two-dimensional image of the laminate; a detecting step of detecting air-pocket corresponding regions from a two-dimensional image; a characteristic value obtaining step of determining a characteristic value related to areas of the air-pocket corresponding regions; and an evaluation step of evaluating the laminate based on the characteristic value. is a method of evaluating a laminate.