The present invention is directed to an acoustical baffle that has use in vehicle interiors, such as an interior headliner. In particular, the baffle can provide improved acoustics while maintaining a desired airflow resistance and can be configured to provide for different sound attenuation characteristics at selected locations of the baffle construction.

An adhesive structure is provided, which includes a plastic substrate, and an adhesive layer on the plastic substrate. The adhesive layer includes a releasable adhesive. The adhesive layer has a Young's modulus of 5 MPa to 14 MPa and an adhesive force to glass of 200 gf/25 mm to 2000 gf/25 mm. The adhesive structure can be used to transfer a device.

A sheet production line comprises: a calender for laminating and calendaring a sheet blank; a first conveying mechanism arranged at a discharge end of the calender and used for carrying and conveying a semi-finished sheet product output from the calender, where the first conveying mechanism is a traction conveying mechanism; a section cutting mechanism arranged behind the discharge end of the calender in a traveling direction of the semi-finished sheet product; and a second conveying mechanism arranged at a discharge end of the section cutting mechanism in a traveling direction of the sheet sections, where the second conveying mechanism is a non-traction conveying mechanism.

Tear and heat resistant foams used in packaging, protective packaging bags and related methods are provided. The tear and heat resistant foam can include a nonwoven substrate, a polyethylene film, and a base layer of polyethylene foam joined together by applying at least one of heat or heat and pressure to the top nonwoven substrate, the polyethylene film and the polyethylene foam to heat the first surface of the top nonwoven substrate to a temperature that is above the melting point of polyethylene film but below the melting point of top nonwoven substrate. The temperature of the polyethylene film rises causing the polyethylene film to melt and bind the top nonwoven substrate to the polyethylene foam to form the heat and tear resistant packaging foam.

An apparatus includes a product substrate having a transfer surface, and a semiconductor die defined, at least in part, by a first surface adjoined to a second surface that extends in a direction transverse to the first surface. The transfer surface includes ripples in a profile thereof such that an apex on an individual ripple is a point on a first plane and a trough on the individual ripple is a point on a second plane. The semiconductor die is disposed on the transfer surface between the first plane and the second plane such that the second surface of the semiconductor die extends transverse to the first plane and the second plane.

A process for placing a circuit array on a sheet having adhesive during a pick and place operation in which a vacuum is used during its placement to minimize air bubbles between the adhesive layer and the circuit array.

The present invention discloses a polyimide-based composite carbon film with high thermal conductivity and a preparation method therefor. The preparation method includes: uniformly coating the surface of a polyimide-based carbon film with an aqueous graphene oxide solution, and then covering the same with another polyimide-based carbon film uniformly coated with an aqueous graphene oxide solution; repeating such operation; after the polyimide-based carbon films are dried, bonding the polyimide-based carbon films by means of graphene oxide so as to form a thick film; bonding the polyimide-based carbon films more tightly by means of further low-temperature hot pressing; and finally, obtaining a thick polyimide-based carbon film with high thermal conductivity by repairing defects by means of low-temperature heating pre-reduction and high-temperature and high-pressure thermal treatment. The thick polyimide-based carbon film with high thermal conductivity has a thickness greater than 100 μm and an in-plane thermal conductivity of even reaching 1700 W/mK or above.

A method for fabricating wetsuit garment including wetsuits, boots and gloves for water sports uses, comprising preparation of at least a substantially elastic joining member made of hot melt adhesive, and joining at least two interconnected panels of rubber foam or sponge by the substantially elastic joining member to cover and seal the seam between the two interconnected panels for firmly bonding the two interconnected panels for making a strong, elastic and flexible wetsuit garment.

This invention relates a compostable lid for sealing a beverage capsule or a beverage pad wherein the lid comprises a natural-fiber based support obtainable by: (i) providing a first fibrous base sheet comprising natural fiber material sensitive to a gelatinizing agent; (ii) treating the first base sheet with a gelatinizing agent to give a treated first fibrous base sheet comprising gelatinized material; (iii) providing a second fibrous base sheet; (iv) contacting the treated first fibrous base sheet and the second base sheet with each other; (v) causing at least partial migration of the gelatinized material from the treated first fibrous base sheet into the second fibrous base sheet to give a multilayer product; and (vi) neutralizing and/or washing the product thus obtained and then drying it.

Disclosed is a preparation method for a copper clad laminate comprising: (1) dissolving a polymer in an organic solvent, heating and stirring to obtain a pre-impregnation liquid; (2) impregnating a liquid crystal polymer cloth in the pre-impregnation liquid, and drying to obtain a liquid crystal polymer impregnated cloth; and (3) laminating the liquid crystal polymer impregnated cloth and a copper foil to prepare the copper clad laminate, wherein the polymer in step (1) is at least one selected from the group consisting of fully aromatic polyesteramide, epoxy resin, and polyimide; and the liquid crystal polymer cloth in step (2) is prepared from a liquid crystal polymer having a melting point greater than 280° C., a dielectric constant less than 3.2, and a dielectric loss tangent angle less than 0.0025. The preparation method for the copper clad laminate has a simple preparation process and a low manufacturing cost.