A liner assembly and method for lining a damaged pipe junction between a main and lateral pipe is provided. The liner assembly includes a main liner member and a lateral liner tube. A collar disposed near the juncture between the main liner member and lateral liner tube is impregnated with a liquid hydrophobic or hydrophilic material capable of curing in a flexible or rigid state with the material expanding in the presence of water. The hydrophobic or hydrophilic material can also be applied without the use of the collar. When the liner assembly is pressed against the main and lateral pipes, a portion of the hydrophilic or hydrophobic material is forced into the damaged pipe junction.

The invention relates to the use of an adhesive composition to provide a bonding in a wet environment. The invention also relates to a method for providing a bonding in a wet environment.

The aim of the invention is to propose an edging method that is quick, effective, easy to implement and makes it possible to obtain a lightweight panel. To this end, the aim of the invention is a method for sealingly edging a composite panel comprising; *a step (a) of providing a composite panel of redefined thickness having two planar faces and a side to be edged, and of providing a sealing strip made from a polymer material having a width greater than the thickness of the composite panel, and comprising a first face, referred to as the “inner” face, and a second face, referred to as the “outer” face, in reference to the position of use of same: *a step (b) of applying the strip and an adhesive to the side and to a peripheral portion of the planar faces of the composite panel in such a way that the adhesive is located between the composite panel and the inner face of the strip, which sealingly protects the composite panel against dust, foreign bodies and the absorption of moisture.

A method of repairing a core stiffened structure, including removing a damaged portion of the core stiffened structure; bonding a shelf onto a first core member; bonding a second core member to a shelf; and securing a skin patch over the second core member.

A method of repairing a core stiffened structure, including removing a damaged portion of the core stiffened structure; bonding a shelf onto a first core member; bonding a second core member to a shelf; and securing a skin patch over the second core member.

The method controls a discharging gap suitably and easily, effectively damages an adhesive which is an insulator by a shock wave generated in a discharging gap, and disassembles the composite material into conductors. The method of disassembling the composite material includes: a protrusion formation step S1 of forming an elastic protrusion in a predefined part of a first conductor; a composite material formation step S2 of applying an insulator on a surface of the first conductor on which the protrusion stands and bonding or joining the first conductor and a second conductor facing a protruding end of the protrusion with the insulator to form a composite material 1; and a separation step of applying an electric pulse between the first conductor and the second conductor to damage the insulator, thereby separating the first conductor and the second conductor from each other.

A yield in a separation process is improved. A separation apparatus which enables easy separation in a large-area substrate is provided. The separation apparatus has a function of dividing a process member into a first member and a second member and includes a support body supply unit, a support body hold unit, a transfer mechanism, a direction changing mechanism, and a structure body. The structure body bonds a support body to a surface of the first member. When at least part of the process member is located between the direction changing mechanism and the structure body or the pressure applying mechanism, the shortest distance between the direction changing mechanism and a first plane including the surface of the first member is longer than the shortest distance between the first plane and the structure body or the pressure applying mechanism.

The invention provides machines for removing strips of masking from glazing panes. Also provided are methods of removing strips of masking from glazing panes. One embodiment of a machine for removing strips of masking material from a glazing pane includes a cutting head and a processing station. The processing station can be constructed to retain the glazing pane in a processing position with a first surface of the glazing pane oriented toward the cutting head. The cutting head can be movable in various directions across the masked glazing pane and include cutters to cut strips from the masking material.

A system to manufacture a plurality of dies may include an etching tool, an electrically-conductive-adhesive-composition, a heat-applying-extraction-tool and a porous substrate cooperating with an evacuation component. The etching tool uses an ion beam that is configured to singulate a plurality of dies on a wafer with an ion etching process. The electrically-conductive-adhesive-composition is located between the wafer and a porous substrate carrying the wafer during the ion etching process. The electrically-conductive-adhesive-composition adheres the wafer to the porous substrate to keep the dies in place during the ion etching process. The electrically-conductive-adhesive-composition also aids in conducting electrons away from the wafer as a drain during the ion etching process. The heat-applying-extraction-tool applies heat to an individual die during a handling process of the manufacturing process in order to melt the electrically-conductive-adhesive-composition through the porous substrate to an evacuation component in order to then pick up an individual die singulated from the wafer.

The present disclosure is directed towards systems and methods for transferring graphene from the surface of one substrate to another. In one particular embodiment, the graphene layer is grown on a surface of a first substrate, where the bottom of the first substrate is then affixed to the surface of a second substrate. The second substrate may include material made of a rigid or semi-rigid composition to provide structural support and backing to the first substrate. The graphene layer may then be delaminated from the first substrate and transferred to a target surface, such as the surface of an electronic device or biosensor.