A method for recycling at least one magnet of an electric machine. A subassembly having the magnet is disassembled from the electric machine. In the process, the following steps are provided: carrying out a first thermal treatment of the subassembly at a first temperature, mechanical separation of the magnet from the subassembly, and carrying out a second thermal treatment of the magnet at a second temperature, which is higher than the first temperature, for debinding and/or cleaning of the magnet.

A peeling apparatus peels a protective member off a wafer, the protective member including a resin and a film which is fixed to one surface of the wafer with the resin interposed therebetween. The film has a protrusive marginal side extending radially outwardly beyond an outer circumferential edge of the wafer. A holding unit holds another surface of the wafer with the protective member disposed therebelow. A gripping unit grips the protrusive marginal side of the protective member. A peeling mechanism peels the protective member off the wafer by relatively moving the gripping unit and the holding unit radially inwardly from the outer circumferential edge of the wafer toward the center of the wafer. A camera then captures an image of the wafer, and a decision unit determines whether residue of the resin remains on the wafer from the image captured by the camera.

A system according to the principles of the present disclosure includes at least one bracket and at least one vibrator. The at least one bracket is configured to be mounted to a pallet adjacent to a stack of panels disposed on the pallet. The at least one vibrator is attached to the at least one bracket and configured to induce vibration on the stack of panels to disrupt an adhesive bond between adjacent panels in the stack of panels.

A winder unit is disclosed for use with a cutting wire in cutting out a vehicle glazing panel. The unit is capable of being mounded to the glazing panel and includes first and second winder spools for winding cutting wire. At least one wire wrap around guide element (typically a pulley) is positioned away from the mounting means. The unit may be used in various techniques either alone or with an auxiliary guide arrangement.

A bonding method is disclosed. The bonding method can include providing a first element having a device portion and a first nonconductive bonding material disposed over the device portion of the first element. The bonding method can include providing a second element that includes a carrier. The second element having a substrate and a second nonconductive bonding material disposed over the substrate of the second element. The bonding method can include depositing a release layer between the device portion and the first nonconductive bonding material of the first element or between the substrate and the second nonconductive bonding material of the second element. The bonding method can include directly bonding the first nonconductive bonding material of the first element to the second nonconductive bonding material of the second element without an intervening adhesive. The bonding method can include removing the second element from the first element by transferring thermal energy to the release layer to thereby induce diffusion of gas including volatile species out of the release layer.

A method of manufacturing a display unit including: preparing an optical film; forming a first alignment mark on the optical film; forming a cut-out line, corresponding to a predetermined closed curve layout, on the optical film based on a position of the first alignment mark; preparing a panel having a second alignment mark; aligning the optical film and the panel based on the positions of the first alignment mark and the second alignment mark; and laminating the optical film, after the processing of forming the cut-out line, on the panel.

A method and apparatus for delaminating a polymer film from a carrier plate is disclosed. The carrier plate is at least partially transparent and has deposited on it a pixelated pattern layer of light-absorptive material, upon which is deposited a layer of light-reflective material. A polymer film, which is to be delaminated, is deposited on the light-reflecting material layer. Next, a pulsed light source is utilized to irradiate through the carrier plate from the side opposite the polymer film to heat the light-absorptive material layer. The heated areas of the light-absorptive material layer, in turn, heat the polymer film through conduction at the interface between the light-absorptive material layer and the polymer film, thereby generating gas from the polymer film by its thermal decomposition, which allows the polymer film to be released from the carrier plate.

A separation method allows a carrier substrate and a resin layer to be separated without, for example, breaking the resin layer for use in a final product, such that the resin layer can be rendered easy to handle thereafter. A protection step coats the surface of a resin layer with a protective film. A holding-by-suction step retains by suction the coated resin layer on a suction stage with a flat suction surface. After the back surface of the carrier substrate is supported at or near a first end by a support roller capable of moving from the first end to a second end of the carrier substrate, a peeling step lowers the first end of the carrier substrate while moving the support roller toward the second end, thereby peeling the carrier substrate from the resin layer while bending the carrier substrate at a portion supported by the support roller.

A film peeling apparatus including a peeling unit, a peeling unit position adjusted, and a clamp. The peeling unit has uneven portions at an end portion thereof. The peeling unit is configured to peel off a protection film attached on a display panel. The peeling unit position adjuster is connected to the peeling unit. The peeling unit position adjuster is configured to adjust a position of the peeling unit. The clamp is disposed separately from the peeling unit. The clamp is configured to clamp the peeling unit.

Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.