According to the invention, the compositions and methods provide for the complete removal of labels, synthetic glues and/or adhesives from a plurality of surfaces through the use of an aqueous or non-aqueous basic organic solvent and/or an amidine, optionally in combination with surfactants, chelants, acidulants and/or additional bottle wash additives. Beneficially, the compositions and methods are suitable for use at lower temperatures and pH conditions, along with under caustic-free and/or reduced caustic conditions to effectively remove such labels, synthetic glues and/or adhesives from a surface within less than about 30 minutes.

Provided is an automatable peeling apparatus for peeling a protective sheet from a prepreg sheet. This peeling apparatus 2 is equipped with a loading unit 11, a prepreg sheet conveying unit 12, a leading end position detection unit 13, air spraying units 14, 15, a peeling state detection unit 16, protective sheet gripping/conveying units 17, 18, an extraction unit 19, and a control unit 20. The control apparatus 20 controls the loading unit 11, the prepreg sheet conveying unit 12, the leading end position detection unit 13, the air spraying units 14, 15, the peeling state detection unit 16, the protective sheet gripping/conveying units 17, 18, and the extraction unit 19. The first spraying mechanism 14 sprays first air onto the front of the end face of the prepreg sheet. The second spraying mechanism 15 sprays second air and fourth air onto the peeling boundary of the protective sheet.

A device for transferring electronic component, comprising: an energy source used to project an energy beam; a first frame used to carry a carrier loaded with electronic component; a second frame used to carry a substrate for receiving the aforesaid electronic component; a beam splitting element arranged between the first frame and the energy source; and a focusing device arranged between the first frame and the beam splitting element. The present invention also relates to a method of transferring electronic component. The device for transferring electronic component and the method for transferring electronic component of the present invention can be applied in the manufacturing process of display.

A film peeling device includes a chamber, a lower stage disposed on a first wall of the chamber, first to fourth grippers capable of peeling first to fourth sides of a film by gripping the first to fourth sides of the film attached to an object disposed on the lower stage and an upper stage disposed on a second wall of the chamber facing the first wall of the chamber and capable of extending in a first direction in which the object is disposed.

A pad removal method includes affixing a first end of a pad guide to a first location of a pad. The method further includes affixing a second end of the pad guide to a second location of the pad. The method further includes moving the first end from a first position, a first distance from the second location, to a second position, a second distance from the second location, wherein the first distance is greater than a diameter of the pad, and the second distance is less than the width of the pad.

A plant for laminating cardboard, and in particular corrugated cardboard, by an adhesive plastics film, is provided. The plant has a supply station configured to supply a succession of single rough cardboard sheets in a feeding direction, an application station arranged in the sheet feeding direction and having an application roller configured to unwrap and apply the adhesive plastics film to a rough cardboard sheet so that the adhesive plastics film adheres to each rough cardboard sheet of the succession of rough cardboard sheets to form a succession of coated cardboard sheets and to advance each coated cardboard sheet of the succession of coated cardboard sheets in the feeding direction. A method for laminating cardboard, and in particular corrugated cardboard, using an adhesive plastics film is also provided.

The present invention provides a semiconductor chip delamination apparatus for peeling off a protective film attached to one surface of a semiconductor chip, the apparatus comprising: a stage unit (400) on which a ring frame, having the semiconductor chip to which the protective film is attached, arranged thereon is mounted; and a fluid delamination unit (1000) for discharging and spraying a delamination actuating fluid for peeling off, from the semiconductor chip, at least the protective film arranged on one surface of the semiconductor chip.

A device that is a handheld circular heating element for use in the construction industry is described. Specifically the device is useful for applying heat uniformly to a two-piece membrane for separation of the outer layer to allow the inner layer to be exposed. The device includes a handle, an electrical supply, an on/off switch and a heating element. The device uses electricity to heat the heat-emitting burner of the heating element, which is then placed next to the membrane. As the membrane is warmed, the two layers of the membrane are able to be separated, which exposes the inner membrane.

A laminated body includes: a supporting base material; an adhesive layer; a metal layer; and a substrate in this order. The metal layer contains at least one metal selected from the group consisting of copper, titanium, palladium, gold, nickel, tungsten, and molybdenum. The metal layer preferably contains at least one metal selected from the group consisting of copper, titanium, palladium, gold, and nickel.

The present invention provides an electrical debonding type adhesive sheet capable of producing a joined body in which a voltage can be stably applied to an electrical debonding type adhesive layer. An electrical debonding type adhesive sheet according to a first embodiment of the present invention includes a first adhesive layer, a substrate for voltage application including an electroconductive layer and a base layer, and a second adhesive layer in this order, and has a first protrudent part, in which the first adhesive layer and the substrate for voltage application extend and protrude with respect to the second adhesive layer, and a second protrudent part, in which the substrate for voltage application extends from the first protrudent part and protrudes with respect to the first adhesive layer.