A resin composition is provided. The resin composition comprises the following components: (A) a halogen-free epoxy resin; (B) a hardener; and (C) a phosphorus-containing phenolic resin of the following formula (I):

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wherein m, n, 1, R.sub.1, and R.sub.2 are as defined in the specification.

Curable prepregs possessing enhanced ability for the removal of gases from within prepregs and between prepreg plies in a prepreg layup prior to and/or during consolidation and curing. Each curable prepreg is a resin-impregnated, woven fabric that has been subjected to a treatment to create an array of openings in at least one major surface. Furthermore, the location of the openings is specific to the weave pattern of the fabric.

The invention provides a method for pre-curing an adhesive layer bonding a first component to a second component. The adhesive layer is heated by treating an adhesive layer component as heating the first component with a pair of electrodes that are in electrical contact with a surface of the first component, the pair of electrodes applying a predetermined electrical current (I.sub.1, I.sub.2) to the first component. The invention further provides an arrangement for pre-curing a layer of adhesive.

A composite of metal and carbon-fiber-reinforced plastic according to the present invention comprising a predetermined metal member, a resin layer positioned at a surface of at least part of the metal member and containing an inorganic filler having a thermal conductivity of 20 W/(m.Math.K) or more, and carbon fiber reinforced plastic positioned on the resin layer and containing a predetermined matrix resin and carbon reinforcing fiber present in the matrix resin, the carbon reinforcing fiber being at least one of pitch-based carbon reinforcing fiber having a thermal conductivity of 180 to 900 W/(m.Math.K) in range or PAN-based carbon reinforcing fiber having a thermal conductivity of 100 to 200 W/(m.Math.K) in range, a content of the inorganic filler in the resin layer being 10 to 45 vol % in range with respect to a total volume of the resin layer, a number density of the inorganic filler present in a region of a width X ?m from an interface of the resin layer and the carbon fiber reinforced plastic in a direction of the resin layer being 300/mm.sup.2 or more, where X ?m is an average particle size of the inorganic filler.

A cured product of a resin composition according to the present invention includes at least silsesquioxane. When the average thermal expansion coefficient of the cured product at 30 to 200? C. is expressed as ?1 [K.sup.?1], at least one of requirements ?1/?2?10 and (?1??2).sup.2?10.sup.8?0.4 is satisfied, where a reference value ?2 is 350?10.sup.?6 [K.sup.?1] or less. In the cured product, an absorbance derived from a siloxane bond, an absorbance derived from a hydrocarbon group, and an absorbance derived from a hydroxy group are respectively expressed as Ia, Ib, and Ic, the absorbances being determined by attenuated total reflection using a Fourier transform infrared spectrophotometer. In this case, requirements 0.09?Ia/Ib?3.0 and 0.04?Ic/Ib?1.0 are satisfied.

The present invention relates to a surface-modifying sheet including a release sheet and a surface-modifying layer, in which the surface-modifying layer contains a polymeric component and an oligomer component, the oligomer component has a weight average molecular weight (Mw) of 100 to 7,000, a HSP distance (Ra) between the oligomer component and a bisphenol A type glycidyl ether is 7.5 or more, and the oligomer component is contained in an amount of 0.1 to 30 parts by mass with respect to 100 parts by mass of the polymeric component, and relates to a laminate, a surface-modified member and a coated article using the surface-modifying sheet, a method for producing the surface-modified member, and a method for producing the coated article.

Curable prepregs possessing enhanced ability for the removal of gases from within prepregs and between prepreg plies in a prepreg layup prior to and/or during consolidation and curing. Each curable prepreg is a resin-impregnated, woven fabric that has been subjected to a treatment to create an array of openings in at least one major surface. Furthermore, the location of the openings is specific to the weave pattern of the fabric.

A resin composition according to the present invention contains a cyanate compound (A). Further, the resin composition according to the present invention contains a maleimide compound (B) and/or an epoxy resin (C); and primary hexagonal boron nitride particles (D) having an average aspect ratio of 4 to 10.

A cooler includes: a base to which an object to be cooled is attached; and a fin which is fixed to a surface of the base, the fin including a plurality of graphite sheets laminated in the fin, the graphite sheet having a thermal conductivity higher in an in-plane direction than in an out-plane direction, wherein the fin is fixed to the base at end faces of the plurality of graphite sheets.

A hybrid softening strip for controlling stresses in a joint at low temperatures includes a layer of sacrificial material that can be tailored to fit the softening strip in the joint after the softening strip has been bonded to a structure.