Disclosed is a circuit material, including dielectric substrate or a circuit subassembly further comprising a conductive layer, that is formed from a precursor composition, wherein the precursor composition comprises, based on the total weight of the precursor composition, thermosetting resin or thermoplastic polymer, optionally monomeric triallyl isocyanurate or triallyl cyanurate, dispersed particles of poly(triallyl isocyanurate) or poly(triallyl cyanurate), and optionally inorganic filler, wherein the circuit material has a D.sub.f of less than 0.0060 at 10 GHz. Also disclosed is a method of manufacturing such a circuit material in which emulsion polymerized particles of poly(triallyl isocyanurate) or poly(triallyl cyanurate) are dispersed in a thermosetting or thermoplastic resin.

A multi-layered laminate for producing membranes for electroacoustic transducers, comprises a first layer of a polyether ether ketone film having a heat of crystallisation of at least 15 J/g, a second layer (of a thermoplastic plastic film having a heat of crystallisation of no more than 5 J/g, and an adhesive layer arranged between the first and second layers. Alternatively, the first and second layers are defined by their shrinkage properties after 15 minutes at 200° C.: the first layer has shrinkage of more than 10% in at least one direction, and the second layer has shrinkage of less than 10% in the longitudinal and transverse directions. A laminate constructed in this manner exhibits lower fold formation when processed using multi-cavity thermoforming. The laminates are useful for the production of membranes for electroacoustic transducers.

Described herein is flooring formed of an eco-friendly material, where the flooring has excellent heat resistance, durability, abrasion resistance and dimensional stability, and is formed of a non-PVC material and thus is recyclable via an extrusion processing at the time of disposal after use. Specifically, eco-friendly flooring is described in which a coating layer, an overlayer having ionomers, a printing layer, at least one middle layer, and at least one underlayer are laminated in order, where the overlayer of the flooring has ionomers, at least one of the middle layer and the underlayer has a thermoplastic polyolefin-based resin, a styrene-based resin, oil, and a filler, the thermoplastic polyolefin-based resin is contained in an amount of 50 to 150 parts by weight with respect to 100 parts by weight of the styrene-based resin, and the styrene-based resin may contain 25 to 45% styrene.

Provided are: a fiber-containing material which has improved strength in an out-of-plane direction without a decrease in strength in an in-plane direction; a method for inserting out-of-plane reinforcement threads; and a method for producing the fiber-containing material. The fiber-containing material contains a base material and out-of-plane reinforcement threads. The base material contains reinforcement fibers extending in a direction along a plane. The out-of-plane reinforcement threads are formed in the base material so as to extend in a direction intersecting the direction along the plane.

To provide a copper-clad laminate which maintains adhesion between a resin film and a conductor layer and which suppresses the occurrence of wrinkles. A copper-clad laminate has a base film containing a thermoplastic resin, an underlying metal layer film-formed on a surface of the base film by a dry plating method, and a copper layer film-formed on a surface of the underlying metal layer. The underlying metal layer has a mean thickness of 0.3 to 1.9 nm. Since the underlying metal layer has a mean thickness of 0.3 nm or more, it is possible to maintain adhesion between the base film and a conductor layer. Since the underlying metal layer has a mean thickness of 1.9 nm or less, it is possible to suppress an increase in the temperature of a film during film-forming of the underlying metal layer, and it is possible to suppress the occurrence of wrinkles.

A multilayer laminate comprising in order, a polymeric film layer capable of withstanding a temperature of at least 200 C for at least 10 min, an adhesive layer having an areal weight of from 2 to 40 gsm capable of activation at a temperature of from 75 to 200 degrees C. and an inorganic refractory layer wherein the refractory layer comprises platelets in an amount at least 85% by weight with a dry areal weight of 15 to 50 gsm and has a residual moisture content of no greater than 10 percent by weight.

A method for joining a first thermoplastic substrate and a second thermoplastic substrate, each including a polyaryletherketone material having a first melting temperature. The method includes co-consolidating a first semicrystalline thermoplastic film with the first thermoplastic substrate to yield a first co-consolidated structure. The first semicrystalline thermoplastic film defines a first bonding surface of the first co-consolidated structure and includes a polyaryletherketone material having a second melting temperature that is less than the first melting temperature. The method further includes co-consolidating a second semicrystalline thermoplastic film with the second thermoplastic substrate to yield a second co-consolidated structure. The second semicrystalline thermoplastic film defines a second bonding surface of the second co-consolidated structure and includes a polyaryletherketone material having a third melting temperature that is less than the first melting temperature. The method further includes fusing the first bonding surface to the second bonding surface. The method yields a stacked structure.

The present invention has an object of providing a molded article of a composite structure obtained by bonding a polar thermoplastic resin, especially polyacetal, with another resin in a simple manner. According to the present invention, a molded article of a composite structure obtained by bonding a polar thermoplastic resin and a resin containing an aliphatic ester structure as a main component to each other in the state where at least a face at which both of the materials contact each other is in a melted state can be provided.

A glass laminate includes a non-glass substrate with a first surface and a second surface opposite the first surface. A glass sheet is laminated to the first surface of the non-glass substrate. A barrier film is laminated to the second surface of the non-glass substrate and includes a first surface adjacent to the non-glass substrate, a second surface opposite the first surface. A thickness of the barrier film can be at most about 0.5 mm. The second surface of the barrier film can define an outer surface of the glass laminate. The barrier film can be a multi-layer barrier film with a metal layer and a polymer layer. An absolute value of a flatness of the glass laminate determined according to European Standard EN 438 after exposure to 23° C. and 90% relative humidity for 7 days can be at most about 3 mm/m.

A multilayer thermoformable film to protect the surface of a workpiece includes an underlayer having first and second faces. The underlayer is made from an adhesive material configured to adhere to the surface of the workpiece by the first face. At least one layer of polymer material is attached to the second face of the adhesive underlayer. The layer of polymer material is resistant to erosion by solid particles and to erosion by liquid particles. It is formed from a polymer material chosen from a polyurethane, a polyether ether ketone and a polyethylene having a very high molecular weight, with a Shore D hardness of between 50 and 65 D. A method of surface protection of the workpiece includes thermoforming the film in a shape adapted to match the shape of at least a portion of the workpiece and applying the film thermoformed onto the surface of the workpiece.