A surface modification sheet (X) of the present invention includes a release sheet (10) and a surface modification layer (20) thereon. The surface modification layer (20) contains a polymer having a side chain containing an ethylenic double bond. The side chain of the polymer preferably includes a unit derived from an isocyanate compound containing the ethylenic double bond.

A glass substrate with a silica film according to the present invention includes a glass substrate and a silica film formed using a silica film-forming composition, in which the composition includes at least one kind selected from the group consisting of a hydrolyzable compound, a hydrolyzate thereof, and a hydrolysis condensation compound thereof, and at least one kind selected from the group consisting of a silica particle and a zirconia particle, the hydrolyzable compound consisting of a tetraalkoxysilane, a compound (compound I) represented by formula I: (R.sub.3-p(L).sub.pSi-Q-Si(L).sub.pR.sub.3-p), optionally a fluoroalkylsilane having a hydrolysable group, and optionally a zirconium compound having a hydrolyzable group, and the contents of the tetraalkoxysilane, the compound I, and the at least one kind selected from the group consisting of a silica particle and a zirconia particle in terms of SiO.sub.2/ZrO.sub.2 fall within specified ranges, respectively.

The present invention is a thermally conductive sheet comprising a plurality of unit layers, each comprising a silicone resin and a thermally conductive filler, the plurality of unit layers being laminated such that the plurality of unit layers are adhered to each other, wherein a volume content of the silicone resin is 32% by volume or less, and a compressive load at a sheet area of 25.4 mm×25.4 mm when the thermally conductive sheet is 30% compressed from a direction perpendicular to an adhesion plane on which the plurality of unit layers are adhered to each other is 7.0 kgf or less. According to the present invention, it is possible to improve the thermal conductivity and enhance the softness of a thermally conductive sheet using a silicone resin as a matrix component and composed of a large number of unit layers laminated as compared with the conventional one.

Multilayer polymer sheets are provided, as well as related methods, systems, and appliances.

The present invention relates to a process for the formation of a structured film, a structured film as such, an article comprising the structured film, a device for the continuous formation of such a structured film and a composite comprising the structured film.

A glass sheet composite includes: two or more sheets; and an intermediate layer between at least a pair of the sheets. At least one of the pair of sheets is a glass sheet. The intermediate layer satisfies all of the following properties: (1) the intermediate layer has a thickness of 20 μm or less, (2) a compressive shear storage modulus at a temperature of 25° C. is 1.0×10.sup.4 Pa or less, and (3) at the temperature of 25° C. and 1 Hz, the compressive shear storage modulus is higher than a compressive shear loss modulus. The glass sheet composite has a loss coefficient at 25° C. of 0.01 or more, and a sheet-thickness-direction longitudinal wave acoustic velocity of 4.0×10.sup.3 m/s or more,

The present disclosure provides a transparent elastic composite film, which includes a first film layer; a thermoplastic polyurethane layer; and a second film layer; wherein the first film layer and the second film layer have a crosslinked network structure; the first film layer includes acrylic resin and aliphatic polyisocyanate, wherein the acrylic resin includes hydroxyl-containing acrylic resin, and a weight ratio of the acrylic resin to the aliphatic polyisocyanate is 1/1 to 1/1.2, and a weight ratio of the hydroxyl-containing acrylic resin to the acrylic resin is 0.1/1 to 0.18/1.

A wafer laminate has an adhesive layer (2) sandwiched between a support (1) and a wafer (3), with a circuit-forming surface of the wafer facing the adhesive layer. The adhesive layer (2) includes a light-shielding resin layer (2a), an epoxy-containing siloxane skeleton resin layer (2b), and a non-silicone thermoplastic resin layer (2c).

Multilayer polymer sheets are provided, as well as related methods, systems, and appliances.

An anisotropic thermal interface device including plural aligned thermally anisotropic conductive composite layers. Each layer has a first thermal conductivity in a first direction and a second, larger thermal conductivity in a second direction. The aligned thermally anisotropic conductive composite layers extend substantially parallel to each other in the first direction and include 45-95 weight percent graphite flakes aligned in the second direction. The thermally anisotropic conductive composite layers have a binder including a branched siloxane. The thermally anisotropic conductive composite layers are adhered to adjacent thermally anisotropic conductive composite. The thermally anisotropic conductive composite layers have a second thermal conductivity of 25 to 45 W/mK. The anisotropic thermal interface device has an arithmetic average surface roughness of 5 to 20 μm and a tensile strength of 50 to 130 KPa.