According to one embodiment, a polyisocyanurate foam board is described. The foam board includes a polyisocyanurate core that is produced from: an isocyanate, a polyol, and a phosphorous containing non-halogenated fire retardant. The foam board also includes a facer material that is applied to at least one surface of the polyisocyanurate core. The polyisocyanurate core has an isocyanate index greater than about 200 and is able to forms a sufficiently stable char when exposed to flame conditions to enable the polyisocyanurate core to pass the ASTM E-84 test. The foam board has an initial R-value of at least 6.40 and exhibits an ASTM E1354-11b test performance that is equivalent with or better than a similar foam board having a halogenated fire retardant, such as tris(2-chloroisopropyl)phosphate (TCPP).

A biocompatible structure includes one or more base structures for regeneration of different tissues. Each base structure includes alternately stacked polymer layers and spacer layers. The polymer layer includes a polymer and tissue forming nanoparticles. The polymer includes polyurethane. The tissue forming nanoparticles includes hydroxypatites (HAP) nanoparticles, polymeric nanoparticles, or nanofibers. The spacer layer includes bone particles, polymeric nanoparticles, or nanofibers. The weight percentage of tissue forming nanoparticles to the polymer in the polymer layer in one base structure is different from that in the other base structures. A method of producing the biocompatible structure includes forming multiple base structures stacked together, coating the stacked multiple base structures, and plasma treating the coated structure.

A heat insulation material includes a laminate obtained by stacking fiber layers that include heat-resistant fibers, the fiber layers being bound with a thermosetting resin, wherein the laminate does not include a thermoplastic resin that has a heat-resistant temperature lower than that of the thermosetting resin, or includes only a small amount of a thermoplastic resin that has a heat-resistant temperature lower than that of the thermosetting resin.

Low-profile piezo-electrophoretic films and display films including low profile piezo-electrophoretic films. In some embodiments, the piezoelectric material of the piezo-electrophoretic films can be patterned with high-voltage electric fields after fabrication of the piezo-electrophoretic films. Such films are useful as security markers, authentication films, or sensors. The films are generally flexible. Some films are less than 100 μm in thickness. Displays formed from the films do not require an external power source.

Described herein are polysulfone-based and polyether sulfone-based thin-film nanocomposite (TFNC) membranes produced by solution blow spinning (SBS) technology for forward osmosis applications, including desalination and wastewater treatment. These TFNC membranes exhibit ultra-fast water flux, low reverse salt flux, and fouling resistance.

Systems and methods for radiative cooling and heating are provided. For example, systems for radiative cooling can include a top layer including one or more polymers, where the top layer has high emissivity in at least a portion of the thermal spectrum and an electromagnetic extinction coefficient of approximately zero, absorptivity of approximately zero, and high transmittance in at least a portion of the solar spectrum, and further include a reflective layer including one or more metals, where the reflective layer has high reflectivity in at least a portion of the solar spectrum.

A method for producing a multi-layered wet friction material includes providing a bottom layer, providing a top layer produced independently of the bottom layer from different materials, and bonding the bottom layer to the top layer. The bottom layer and the top layer may be produced from different formulations and supplied as raw papers. A formulation of the top layer may include twenty to sixty percent (20%-60%) filler, ten to forty percent (10%-40%) wood pulp, five to ten percent (5%-10%) aramid, and twenty-five to thirty-five percent (25%-35%) phenolic resin. A formulation of the bottom layer may include ten to fifty percent (10%-50%) filler, ten to forty percent (10%-40%) wood pulp, five to ten percent (5%-10%) aramid, five to fifteen percent (5%-15%) carbon, and twenty-five to thirty-five percent (25%-35%) phenolic resin.

Waterproof engineered floor and wall planks have a veneer layer bonded with a plastic composite core, and an underlayer, preferably an underlayer of cork.

Waterproof engineered floor and wall planks have a veneer layer bonded with a plastic composite core, and an underlayer, preferably an underlayer of cork.

Waterproof engineered floor and wall planks have a veneer layer bonded with a plastic composite core, and an underlayer, preferably an underlayer of cork.