B32B2457/00

PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE LAYER, PRESSURE-SENSITIVE ADHESIVE SHEET, OPTICAL MEMBER, AND TOUCH PANEL

An object of the present invention is to provide a pressure-sensitive adhesive composition that enables a pressure-sensitive adhesive layer to be formed, wherein the pressure-sensitive adhesive layer has a low dielectric constant, is excellent in level difference conformability and transparency while maintaining adhesive strength and adhesion reliability at high temperatures, and suitable for laminating a metal mesh film and the like. The pressure-sensitive adhesive composition of the present invention contains an acrylic polymer (A), a mixture of monomer components constituting the acrylic polymer (A) or a partially polymerized product of a mixture of monomer components constituting the acrylic polymer (A), and a hydrogenated polyolefinic resin (B) that exhibits liquid flowability at 25° C. The pressure-sensitive adhesive composition comprises a branched-chain alkyl group having 10 to 24 carbon atoms as a monomer component. The hydrogenated polyolefinic resin (B) has a number average molecular weight (Mn) of 1000 to 5000 and a polydispersity (Mw/Mn) of 2.0 or less. The hydrogenated polyolefinic resin (B) contains at least one selected from the group consisting of a hydrogenated polyolefin and a hydrogenated polyolefin polyol. The pressure-sensitive adhesive composition comprises 3 to 35 parts by weight of the hydrogenated polyolefinic resin (B) based on 100 parts by weight of the acrylic polymer (A).

Molded article and production method therefor
11697274 · 2023-07-11 · ·

A molded product having both small specific gravity and high stiffness and also suffering few sink marks is described along with a method for the production thereof, where the molded product includes a porous body (A) integrated with an injection molded body (B), the porous body (A) having an apparent density of 0.05 to 0.8 g/cm.sup.3, the average thickness (tA) of the porous body (A) and the average thickness (tB) of the injection molded body (B) satisfying the relation tA≥3×tB, and the injection molded body (B) covering at least one face of the porous body (A).

Composite Cooling Film Comprising an Organic Polymeric Layer, a UV-Absorbing Layer, and a Reflective Metal Layer

A composite cooling film including non-fluorinated organic polymeric layer, a metal layer disposed inwardly of the non-fluorinated organic polymeric layer, and an antisoiling, ultraviolet-absorbing hardcoat layer that is disposed outwardly of the non-fluorinated organic polymeric layer.

Polymer films and electronic devices

In a first aspect, a polymer film includes a polyimide. The polyimide includes one or more dianhydrides and one or more diamines. Each of the dianhydrides and diamines is selected from the group consisting of crankshaft monomers, flexible monomers, rigid rotational monomers, rigid non-rotational monomers, and rotational inhibitor monomers. The polymer film has a D.sub.f of 0.005 or less, a water absorption of 2.0% or less and a water vapor transport rate of 50 (g×mil)/(m.sup.2×day) or less. In a second aspect, a metal-clad laminate includes the polymer film of first aspect and a first metal layer adhered to a first outer surface of the polymer film. In a third aspect, an electronic device includes the polymer film of the first aspect.

PLASMA RESISTANT CERAMIC BODY FORMED FROM MULTIPLE PIECES
20230212082 · 2023-07-06 ·

Disclosed is a joined ceramic body comprising a first ceramic portion comprising a first ceramic, a second ceramic portion comprising a second ceramic, and a joining layer formed between the first ceramic portion and the second ceramic portion. The joining layer has a bond thickness of from 0.5 to 20 um and comprises silicon dioxide having a total impurity content of 20 ppm and less. A method of making the joined ceramic body and a joining material are also disclosed.

ELECTRONIC DEVICE
20230213801 · 2023-07-06 ·

An electronic device is provided. The electronic device includes a backboard, a circuit board disposed on the backboard, a light source disposed on the circuit board, a housing disposed on the backboard, and a panel disposed on the housing. The panel contacts the housing, and the light source and the circuit board are disposed between the panel and the backboard.

LAYERED PRODUCT INCLUDING HIGH TEMPERATURE-RESISTANT TRANSPARENT FILM

Provided is a layered product that uses a high temperature-resistant transparent film having sufficient heat resistance, and that is capable of being mechanically released from an inorganic substrate after various processes are performed on the inorganic substrate since the adhesive strength between the high temperature-resistant transparent film and the inorganic substrate is appropriately weak, and that is less warped along with the inorganic substrate. In this layered product, no adhesive is used between the high temperature-resistant transparent film and the inorganic substrate, the release strength between the high temperature-resistant transparent film and the inorganic substrate is at most 0.3 N/cm, and the warpage amount of the layered product when heated at 300° C. is at most 400 .Math.m.

Glass-based articles with engineered stress profiles and methods of manufacture

Laminated glass-based articles and methods of manufacture are disclosed. A glass-based article includes a glass-based substrate having a first surface and a second surface opposing the first surface defining a substrate thickness (t) in a range of about 0.1 millimeters to 3 millimeters, the glass-based substrate having a compressive region having a first compressive stress CS maximum at the first surface of the glass-based article extending to a depth of compression (DOC) and second local CS maximum at a depth of at least 25 μm from the first surface, wherein the glass-based substrate comprises a glass-based core substrate having a first side and a second side, the glass-based core substrate sandwiched between a glass-based first cladding substrate and a glass-based second cladding substrate, the first cladding substrate and second cladding substrate directly bonded to the first side and the second cladding substrate directly bonded to the second side.

SHEET STRUCTURE INCORPORATING GRAPHITIC MATERIAL, AND METHOD OF MANUFACTURE
20230211579 · 2023-07-06 ·

This specification presents sheets including graphitic materials, including sandwich structures, thermoformed or wet-formed single layer or multilayer structures of graphitic materials, and methods of forming a layer of graphitic material. In accordance with one aspect, the specification presents a multi-layer structure comprising a core layer having a core density between 0.01 and 1 g/cm.sup.3; and a skin layer covering the core layer, the skin layer having at least 10% by weight of a graphitic material, the graphitic material having one or more of graphene oxide, reduced graphene oxide, graphene, graphite oxide, reduced graphite oxide and graphite, the skin layer having a skin density of between 0.5 and 2 g/cm.sup.3 , a thickness ratio of the skin layer to the core layer being of between 1:1000 and 1:1.

Package sealing tape types with varied transducer sampling densities
11551052 · 2023-01-10 ·

A low-cost, multi-function adhesive tape platform with a form factor that unobtrusively integrates one or more transducers and one or more wireless communication devices in an adhesive product system. In an aspect, the adhesive product system integrates transducer and wireless communication components within a flexible adhesive structure in a way that not only provides a cost-effective platform for interconnecting, optimizing, and protecting the constituent components but also maintains the flexibility needed to function as an adhesive product that can be deployed seamlessly and unobtrusively into various applications and workflows, including sensing, notification, security, and object tracking applications, and asset management workflows such as manufacturing, storage, shipping, delivery, and other logistics associated with moving products and other physical objects.