A01N59/00

Mic reduction with lithium ions

The invention relates to a process for reducing the minimum inhibitory concentration (MIC) of a biocide against at least one strain of bacteria and/or at least one strain of yeast and/or at least one strain of mould in an aqueous preparation. The invention further relates to the use of a water soluble source of lithium ions for reducing the minimum inhibitory concentration (MIC) of a biocide against at least one strain of bacteria and/or at least one strain of yeast and/or at least one strain of mould in an aqueous preparation.

Systems and methods for use of chlorine dioxide in cultivation and post-harvest applications

Systems and methods of use of chlorine dioxide in controlled environmental agriculture settings and postharvest applications are provided. A method can comprise application of gaseous chlorine dioxide at a level effective to prevent microbial proliferation in a setting containing growing plants. A system can comprise a chemical microorganism control agent dispersal system, an airborne microorganism detection system, and a cultivation environment monitor system.

Systems and methods for use of chlorine dioxide in cultivation and post-harvest applications

Systems and methods of use of chlorine dioxide in controlled environmental agriculture settings and postharvest applications are provided. A method can comprise application of gaseous chlorine dioxide at a level effective to prevent microbial proliferation in a setting containing growing plants. A system can comprise a chemical microorganism control agent dispersal system, an airborne microorganism detection system, and a cultivation environment monitor system.

OXIDANT COMPOSITION FOR SUPPRESSING LOSS OF ADHESIVE DURABILITY, AND USE OF SAME

The disclosure relates to a microbicidal composition with excellent action of limiting a decrease in durability of synthetic adhesives as well as high microbicidal action. The microbicidal composition contains 0.03 to less than 1.0 mass % of peracetic acid, 0.045 to less than 1.5 mass % of hydrogen peroxide, and 0.036 mass % or more of glycine.

OXIDANT COMPOSITION FOR SUPPRESSING LOSS OF ADHESIVE DURABILITY, AND USE OF SAME

The disclosure relates to a microbicidal composition with excellent action of limiting a decrease in durability of synthetic adhesives as well as high microbicidal action. The microbicidal composition contains 0.03 to less than 1.0 mass % of peracetic acid, 0.045 to less than 1.5 mass % of hydrogen peroxide, and 0.036 mass % or more of glycine.

OXIDANT COMPOSITION FOR SUPPRESSING LOSS OF ADHESIVE DURABILITY, AND USE OF SAME

The disclosure relates to a microbicidal composition with excellent action of limiting a decrease in durability of synthetic adhesives as well as high microbicidal action. The microbicidal composition contains 0.03 to less than 1.0 mass % of peracetic acid, 0.045 to less than 1.5 mass % of hydrogen peroxide, and 0.036 mass % or more of glycine.

Water treatment

A method treats an aqueous system to inhibit growth of one or more micro-organisms therein and/or to reduce the number of live micro-organisms therein. The method includes adding treatment agents to an aqueous system wherein said treatment agents include (a) a phosphonium compound; and (b) a compound having formula: M(XO.sub.2).sub.n wherein: M is a Group I or Group II metal; X is a halogen; and n is 1 or 2.

Water treatment

A method treats an aqueous system to inhibit growth of one or more micro-organisms therein and/or to reduce the number of live micro-organisms therein. The method includes adding treatment agents to an aqueous system wherein said treatment agents include (a) a phosphonium compound; and (b) a compound having formula: M(XO.sub.2).sub.n wherein: M is a Group I or Group II metal; X is a halogen; and n is 1 or 2.

Surface treatment method for copper or copper alloy, surface treatment liquid for sterilizing copper or copper alloy, and sterilization method using copper or copper alloy treated by said method

The present invention provides a surface treatment method that improves antimicrobial activity of copper or a copper alloy and enhances immediate effects of antimicrobial actions on the surface of the copper or the copper alloy. A surface treatment method for copper or a copper alloy according to the present invention comprises preparing a reducing agent solution containing a biological reducing substance, and treating the surface of the copper or the copper alloy with the reducing agent solution. The present invention also provides a surface treatment liquid for sterilizing copper or a copper alloy, in which the surface treatment liquid contains a biological reducing substance. The present invention also provides a sterilization method that comprises bringing copper or a copper alloy treated by the surface treatment method into contact with a surface of an object to sterilize the surface of the object.

Surface treatment method for copper or copper alloy, surface treatment liquid for sterilizing copper or copper alloy, and sterilization method using copper or copper alloy treated by said method

The present invention provides a surface treatment method that improves antimicrobial activity of copper or a copper alloy and enhances immediate effects of antimicrobial actions on the surface of the copper or the copper alloy. A surface treatment method for copper or a copper alloy according to the present invention comprises preparing a reducing agent solution containing a biological reducing substance, and treating the surface of the copper or the copper alloy with the reducing agent solution. The present invention also provides a surface treatment liquid for sterilizing copper or a copper alloy, in which the surface treatment liquid contains a biological reducing substance. The present invention also provides a sterilization method that comprises bringing copper or a copper alloy treated by the surface treatment method into contact with a surface of an object to sterilize the surface of the object.