A device source wafer includes a wafer substrate, devices formed on or in the wafer substrate at a location on the wafer substrate, and test structures disposed on the wafer substrate connected to some but not all of the devices. The devices include a first device disposed at a first location and a second device disposed at a second different location on the wafer substrate. The test structures include at least a first test structure connected to the first device and a second test structure connected to the second device. The first test structure is adapted to measuring a characteristic of the first device and the second test structure is adapted to measuring the characteristic of the second device. An estimated characteristic of unmeasured devices is derived from the first and second device locations and measured characteristics and the device is selected based on the estimated characteristic.

The present disclosure provides a method for processing a substrate that can maintain a production amount even when a production model is changed. The method for processing a substrate comprises: disposing the substrate on a levitation stage; measuring a distance between the substrate and an inkjet head module; and changing a discharging speed of ink to be discharged from the inkjet head module based on the measured distance.

A color conversion panel includes: a substrate; a plurality of color filters on the substrate; a partition wall on the substrate, and including a first opening, a second opening, a third opening, and a sub-opening; a first color conversion layer disposed in the first opening of the partition wall; a second color conversion layer disposed in the second opening of the partition wall; a transmission layer disposed in the third opening of the partition wall; an additional layer disposed in the sub-opening of the partition wall; and a spacer on the additional layer.

A method for producing a decorative floor covering comprises digitally printing an adhesive on a printing substrate thus generating an adhesive layer forming an at least one-dimensionally patterned decorative motif. The adhesive is a radiation-curable composition, preferably essentially free from non-reactive solvents and/or from photoinitiator. The printing substrate includes one of a core structure and a wear layer. After the printing of the adhesive, the adhesive layer on the printing substrate is contacted with the other one of the core structure and the wear layer. The core structure and the wear layer are then attached to each other by electron-beam curing the adhesive layer between them.

A 3D physical unclonable functions (PUF) system produced based on harnessing the out-of-plane crumpling of a layer of 2D material during shrinkage of a substrate carrying such layer. The structural details of the so-formed 3D PUF pattern are extracted from the tags in a layer-by-layer fashion using confocal laser microscopy imaging and then reconstructed to form the 3D PUF keys and stored in the database, serving as a secure anti-counterfeiting PUF that demonstrates encoding capacity in excess of 10.sup.40,000,000. Authentication is performed with a customized trained Siamese neural network framework in a matter of few minutes in a fashion that does not depend on rotation, linear translation, tilt, variations of contrast and/or resolution of the extracted optical images.

Provided herein is a method for forming an image on a dyed synthetic fabric, using a dye-discharge agent, the method is effected by printing an ink composition on the fabric and applying a dye-discharge agent essentially on the same area of the ink composition, wherein applying the dye-discharge agent is effected while the ink composition is still wet (uncured), prior to a curing of the image, and followed by curing the fully formed image, whereas the dye-discharge agent discharged the dye that migrated during the curing step, but not the dyed fabric.

An inkjet printing method may includes a dot pattern printing process of printing a dot pattern group by discharging ink at a preset position of a surface of an object using a nozzle group for forming a dot pattern so that dropped droplets are not in overlap with each other, a connection pattern printing process of printing a connection pattern group by discharging ink at a position between neighboring patterns using a nozzle group for forming a connection pattern so that the same attractive force acts to the neighboring patterns dropped on the surface of the object, and a finishing printing process of finishing a coating of the surface of the object by discharging ink to an area except for neighboring dropped droplets using a nozzle group for finishing so that the same attractive force act to the dropped droplets that are dropped on the surface of the object.

The present invention relates to method of manufacturing a tamper-proof medium for thermal printing, wherein a liquid treatment composition comprising at least one acid is deposited on a substrate which comprises a thermochromic coating layer comprising at least one halochromic leuco dye.

An electronic device includes a housing including a translucent ceramic member; and a printing film provided on the housing, wherein the printing film includes: an adhesive layer provided on the ceramic member; a base layer including a first surface facing the adhesive layer and a second surface opposite to the first surface; a printing layer provided on the first surface or the second surface of the base layer, the printing layer being viewable through the ceramic member and the adhesive layer; and a shielding printing layer facing the second surface of the base layer.

The present invention provides a manufacturing method of a color film substrate and the color film substrate. The manufacturing method includes providing a substrate; forming a first photoresist layer on a first sub-pixel region; forming a quantum dot layer on the substrate, wherein light emission colors of at least two types of quantum dots are respectively different from a light emission color of the first photoresist layer; forming a second photoresist layer and a third photoresist layer on the quantum dot layer in order; and quenching the quantum dot layer to invalidate unshielded quantum dots of the quantum dot layer.