Provided is a sheet member including a sheet-shaped substrate with a transmissive property including a first surface and a second surface, a colored layer, and a phosphorescent layer containing a phosphorescent material. In the sheet member, the colored layer and the phosphorescent layer are arranged adjacent to at least the first surface. Further, the sheet member includes, at least partially, at least either one of a part where the colored layer is arranged more adjacent to the substrate than the phosphorescent layer, or a part where the colored layer is arranged on the substrate and the phosphorescent layer is not arranged.

Techniques for controlling optical behavior of a multi-view display apparatus comprising a first layer comprising first optical elements and a second layer comprising second optical elements. The techniques include obtaining a plurality of scene views; obtaining information specifying a model of the multi-view display apparatus; obtaining information specifying at least one blurring transformation; and generating actuation signals for controlling the multi-view display apparatus to concurrently display a plurality of display views corresponding to the plurality of scene views, the actuation signals comprising first actuation signals for controlling the first optical elements and second actuation signals for controlling the second optical elements, the generating comprising: generating the first actuation signals and the second actuation signals based, at least in part, on the plurality of scene views, the information specifying the model of the multi-view display apparatus, and the information specifying the at least one blurring transformation.

This disclosure relates to advanced image signal processing technology including encoded signals and digital watermarking. One claim is directed to a container comprising: a 3004 or 3003 aluminum alloy shell, the shell comprising an outer surface and an inner surface; a first layer of transparent ink printed on the outer surface as a flood within a first region; a second layer of the transparent ink printed over the first layer of transparent ink within the first region, in which the second layer of the transparent ink is printed to include a plurality of holes without any transparent ink printed therein; an opaque ink printed within the plurality of holes of the second layer of transparent ink on first layer of transparent ink within the first region, in which: i) the outer surface/first layer/second layer, and ii) the outer surface/first layer/opaque ink comprise a spectral reflectance difference at a machine-vision wavelength in the range of 8%-35%, and in which the plurality of holes are arranged in a 2-dimensional pattern according to a machine-readable signal, the 2-dimensional pattern being machine-readable from imagery captured of the first region. Of course, other containers, methods, packages, objects, systems, technology and apparatus are described in this disclosure.

The card comprises a first translucent or transparent substrate layer, preferably in PVC, and a second substrate layer, and a cracked layer of ink between the two substrate layers so as to allow the second substrate layer to show through the cracks of the layer of ink. The cracked layer of printing ink comprises mirror-effect ink, that reflects light through the first translucent or transparent substrate layer. The cracking of the layer of ink is achieved when the card is manufactured by laminating it.

The card comprises a first translucent or transparent substrate layer, preferably in PVC, and a second substrate layer, and a cracked layer of ink between the two substrate layers so as to allow the second substrate layer to show through the cracks of the layer of ink. The cracked layer of printing ink comprises mirror-effect ink, that reflects light through the first translucent or transparent substrate layer. The cracking of the layer of ink is achieved when the card is manufactured by laminating it.

A method for fabricating a micro resistance layer and a method for fabricating a micro resistor are provided. The method for fabricating a micro resistance layer includes: providing a substrate; forming a first resistance layer on the substrate by using a screen printing process or a sputtering process; dividing the first resistance layer into second resistance layers, wherein each one of the product regions includes a second resistance layer, and an area of each one of the product regions is smaller than 0.4*0.2 mm.sup.2; and trimming the second resistance layer of each one of the product regions according to a predetermined resistance value to enable the pattern of each one of the second resistance layers to correspond to the predetermined resistance value. The method for fabricating a micro resistor uses the method for fabricating a micro resistance layer for fabrication of the micro resistor.

It is an object of the present invention to improve visibility for observation with naked eyes or for camera shooting without spoiling the appearance during marking inside a. transparent medium using a laser. By irradiating an inside of a transparent medium with a laser, the present invention forms a micro-denatured region in each of a first layer and a second layer inside the medium. The micro-denatured regions in the respective layers are arranged out of alignment with each other on a two-dimensional plane (refer to FIG. 1).

It is an object of the present invention to improve visibility for observation with naked eyes or for camera shooting without spoiling the appearance during marking inside a. transparent medium using a laser. By irradiating an inside of a transparent medium with a laser, the present invention forms a micro-denatured region in each of a first layer and a second layer inside the medium. The micro-denatured regions in the respective layers are arranged out of alignment with each other on a two-dimensional plane (refer to FIG. 1).

A semiconductor device includes: a package including: a heat dissipating body comprising a metal, an insulting part surrounding the heat dissipating body, one or more semiconductor laser elements disposed on the heat dissipating body, at least one outer metal layer that is located on a lower surface of the insulting part and is spaced from a lower surface of the heat dissipating body; a mounting substrate including: at least one first metal pattern located at an upper surface of the mounting substrate, and a second metal pattern located at the upper surface of the mounting substrate; at least one first bonding member located between the at least one outer metal layer and the first metal pattern; and a second bonding member located between the lower surface of the heat dissipating body and the second metal pattern, wherein the second bonding member comprises a metal material.

Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.