A control circuit for a cooking oven. The control circuit includes a contactor. The contactor has at least one contact and at least one coil. A relay (such as a solid-state relay) is in series connection with the contactor. A heating element is controlled by the relay and is in series connection with the relay and the contactor. The controller also includes a controller. The controller is configured to bypass the relay and to control power to the at least one coil.

A method for manufacturing a household cooking appliance, in particular an oven, having a muffle defining a cooking chamber, includes the steps of: a) providing the muffle; b) providing a channel for conveying air; c) associating to a rear wall of the muffle a first fan for ventilation of the cooking chamber; d) associating to the channel a second fan for forcing air into the channel; e) associating the channel to an upper wall of the muffle. Step b) includes shearing from a semi-finished product of a metal component of the channel a corresponding portion, so as to define an opening for installation of the second fan. Step c) includes using the portion sheared from the semi-finished product of the metal component of the channel as a bracket for fixing the first fan to the rear wall of the muffle.

An oven includes a cooking enclosure including one or more cooking heater elements, a steam source in the cooking enclosure, and a steam source heater for the steam source. A sensor is responsive to the temperature of the steam source. A fluid reservoir is exterior to the cooking enclosure and a conduit extends from the fluid reservoir to or proximate the steam source. A controller energizes the steam source heater if the temperature of the steam source is below a predetermined threshold and de-energizes the steam source heater if the temperature of the steam source is above the predetermined threshold.

A modular food holding system includes a plurality of individual modularized food holding chambers, each of the plurality of food holding chambers being physically and communicatively removably connected to one another. Each of the food holding chambers includes a food holding cavity and at least one of a heating element and/or a cooling element for heating or cooling the food holding cavity. A chamber base is physically and communicatively removably connected to one of the food holding chambers and operation of at least one food holding chamber is controlled by the chamber base.

A baking pan assembly includes a baking pan including a bottom, a pair of opposing end walls extending upward from the bottom in a vertical direction, and a pair of opposing side walls extending upward from the bottom in the vertical direction, where each of the opposing side walls define an engagement portion having a retaining slot extending downward into the engagement portions and an insert configured to be inserted within the retaining slots of the baking pan

An oven may facilitate heating, curing, and/or drying processes for manufactured items, such as shoe parts, using multiple groups of infrared sources. Each group of infrared sources may comprise a plurality of sources having heating parameters, such as a peak wavelength, power, distance from items to be cured, number of infrared sources, etc. By staging different types of sources throughout an oven, different aspects of the curing process may be performed in an efficient fashion. Further, conditions within the oven such as temperature and relative humidity may be monitored and adjusted to optimize curing conditions.

A cooking appliance in accordance with the present invention includes a base, a container engageable with the base and configured to receive one or more food ingredients, a blade assembly rotatably mounted in the container and a lid engageable with said container. The lid includes a chamber configured to hold a volume of liquid and a heating element for heating the liquid within the chamber to produce steam.

A photodetector element for receiving radiated light from a surface of a semiconductor wafer loses a detection function because the intensity of the received light exceeds a detection limit while a flash lamp emits light. Measurement is not performed during the above-mentioned period, and the intensity of the radiated light from the surface of the semiconductor wafer is measured after the flash lamp stops emitting light and the photodetector element restores the detection function. Then, the temperature of the surface of the semiconductor wafer heated by irradiation with a flash of light is calculated based on the measured intensity of the radiated light. Accordingly, even in a case where intense irradiation is performed in an extremely short period of time, such as flash irradiation, the flash of light does not act as ambient light, which enables to obtain the surface temperature of the semiconductor wafer.

The heat treatment apparatus includes: a processing chamber which accommodates a processing object; a heating unit which heats the processing object accommodated in the processing chamber; a temperature detecting unit which detects an internal temperature of the processing chamber; and a controller which sets a second setting temperature identical to as a temperature detected by the temperature detecting unit when the temperature detected by the temperature detecting unit falls below a predetermined first setting temperature due to an external disturbance; controls the heating unit so that a third setting temperature between the second setting temperature and the first setting temperature becomes identical to the temperature detected by the temperature detecting unit; and controls the heating unit so that the first setting temperature becomes identical to the temperature detected by the temperature detecting unit after the third setting temperature becomes identical to the temperature detected by the temperature detecting unit.