The present invention generally relates to methods and apparatus for processing substrates. Embodiments of the invention include apparatuses for processing a substrate comprising a dynamic heat sink that is substantially transparent to light from a radiant heat source, the dynamic heat sink being positioned near the substrate so the two are coupled. Additional embodiments of the invention are directed to methods of processing a substrate using the apparatuses described.

After a substrate implanted with impurities is heated to a preheating temperature, the front surface of the substrate is heated to a target temperature by irradiating the front surface of the substrate with a flash of light. Further, the flash irradiation is continued to maintain the temperature of the front surface near the target temperature for a predetermined time period. At this time, a flash irradiation time period in the flash heating step is made longer than a heat conduction time period required for heat conduction from the front surface of the substrate to the back surface thereof, and a difference in temperature between the front and back surfaces of the substrate is controlled to be always not more than one-half of an increased temperature from the preheating temperature to the target temperature during the flash irradiation. This alleviates the concentration of stresses resulting from a difference in thermal expansion between the front and back surfaces of the substrate to thereby prevent the cracking of the substrate.

A modular cooking apparatus is disclosed. The modular cooking apparatus includes a housing for containing a first and second interchangeable cooking modules. The first interchangeable cooking module contains a first oven, and the second interchangeable cooking module contains a second oven. The second oven is different from the first oven. The modular cooking apparatus also includes a control panel for receiving cooking inputs, a controller for controlling the first and second interchangeable cooking modules, and a single power plug for receiving electrical power from a wall outlet.

A modular cooking apparatus is disclosed. The modular cooking apparatus includes a housing for containing a first and second interchangeable cooking modules. The first interchangeable cooking module contains a first oven, and the second interchangeable cooking module contains a second oven. The second oven is different from the first oven. The modular cooking apparatus also includes a control panel for receiving cooking inputs, a controller for controlling the first and second interchangeable cooking modules, and a single power plug for receiving electrical power from a wall outlet.

The present invention generally relates to a laser processing systems for thermally processing substrates. The laser processing systems include a shield disposed between an energy source of the laser processing system and a substrate which is to be thermally processed. The shield includes an optically transparent window disposed adjacent to a cavity within the shield. The optically transparent window allows annealing energy to pass therethrough and to illuminate the substrate. The shield also includes one or more gas inlets and one or more gas outlets for introducing and removing a purge gas from the cavity within the shield. The purge gas is utilized to remove volatized or ablated components during thermal processing, and to provide a gas of predetermined composition, such as oxygen-free, to the thermally processed area.

To provide a thermal processing apparatus where a projection area perpendicular to the axis of a sealing structure and attachment structure of heat radiation heater is decreased and a chamber volume is decreased. The apparatus has a chamber for accommodating a workpiece of a thermal processing object, the chamber having a partition wall for partitioning inside from outside of the chamber, a heat radiation heater disposed penetrating the partition wall, wherein the heater has a ring seal arranged on an outer peripheral surface of the extension section, and hermetically sealing the chamber, and a heat blocking plate arranged between the heat radiation unit and the ring seal in the axial direction of the glass tube, for blocking heat radiated from the heat radiation unit to the ring seal, the heat blocking plate having an inner peripheral surface fitting along the extension section.

A lamp assembly for the lamp assembly adapted for use in a substrate thermal processing chamber to heat the substrate to temperatures up to at least about 1100 C. is disclosed. In one embodiment, the lamp assembly comprises a bulb enclosing at least one radiation generating filament attached to a pair of leads, the bulb having an inner surface and an outer surface, a lamp base configured to receive the pair of leads and at least a portion of the bulb having a surface treatment adapted to reflect light away from the lamp base. In another embodiment, a sleeve covers the lamp base, which has a cross-sectional area less than about 1.2 times the cross-sectional area of the bulb.

Conveyer ovens and methods for controlling same. One example conveyor over includes an electronic processor configured to: determine a first duty cycle for a first heating element; determine a second duty cycle for a second heating element; actuate a first relay that controls a current flow to the first heating element based on the first duty cycle to energize the first heating element during a first duty cycle interval; and actuate a second relay that controls a current flow to the second heating element based on the second duty cycle to energize the second heating element during a second duty cycle interval. The second duty cycle interval begins after a delay period from a start of the first duty cycle interval has elapsed.

Conveyer ovens and methods for controlling same. One example conveyor over includes an electronic processor configured to: determine a first duty cycle for a first heating element; determine a second duty cycle for a second heating element; actuate a first relay that controls a current flow to the first heating element based on the first duty cycle to energize the first heating element during a first duty cycle interval; and actuate a second relay that controls a current flow to the second heating element based on the second duty cycle to energize the second heating element during a second duty cycle interval. The second duty cycle interval begins after a delay period from a start of the first duty cycle interval has elapsed.