Patent classifications
B65C1/00
Cut and stack pressure sensitive adhesive substrates and process
A process of producing printed variably imaged labels cut to individual label sheets in a pre-defined sequence of variable information synchronized with the planogram of a retail store for labeling, output from a factory assembly line for unique product labeling or labeling of shipments from a fulfillment or distribution warehouse that all have unique data and follow a planogram or planned sequence. The labels are cut into single sheets using a cutter/stacker and either use a crack and peel liner or a stripped matrix around the label to facilitate easy removal and application. The cutter/stacker processes converted label stock that is either preprinted and die cut and/or variably imaged.
Cut and stack pressure sensitive adhesive substrates and process
A process of producing printed variably imaged labels cut to individual label sheets in a pre-defined sequence of variable information synchronized with the planogram of a retail store for labeling, output from a factory assembly line for unique product labeling or labeling of shipments from a fulfillment or distribution warehouse that all have unique data and follow a planogram or planned sequence. The labels are cut into single sheets using a cutter/stacker and either use a crack and peel liner or a stripped matrix around the label to facilitate easy removal and application. The cutter/stacker processes converted label stock that is either preprinted and die cut and/or variably imaged.