Three-dimensional micro devices usable as electromagnetic and magnetomechanical energy converters, as micromagnetic motors or generators, and methods for their production. The three-dimensional micro devices exhibit high efficiency even at dimensions on the microscale and below, and the method for production, as well as mass production, is simple and economical. Moreover, the three-dimensional micro devices at least include one three-dimensional device produced using roll-up technology. This three-dimensional device includes all functional and structural components for full functionality. At least one functional or structural component is an element that is at least partially freely movable at least partially within a surrounding element and is arranged such that it can be rotated at least around one of its axes.

A method of making a flowcell includes bonding a first surface of an organic solid support to a surface of a first inorganic solid support via a first bonding layer, wherein the organic solid support includes a plurality of elongated cutouts. The method further includes bonding a surface of a second inorganic solid support to a second surface of the organic solid support via a second bonding layer, so as to form the flowcell. The formed flowcell includes a plurality of channels defined by the surface of the first inorganic solid support, the surface of the second inorganic solid support, and walls of the elongated cutouts.

A method includes: providing a first substrate on which a plurality of first semiconductor devices is formed; providing a second substrate on which a plurality of second semiconductor devices is formed; and coupling the first and second substrates by contacting respective dummy pads of the first and second substrates, wherein at least one of the dummy pads of the first and second substrates comprises plural peaks and valleys.

A device having both an electronic assembly having an electronic component assembled on a first substrate, and also a body defining a cavity having a first end in fluid flow communication with a fluid, the electronic component extending inside the cavity and the first substrate including a portion in contact with a wall of the cavity. The coefficient of thermal expansion of the material of the first substrate is less than that of the electronic component, and the electronic component is assembled on the first substrate by a brazing type assembly method involving the application of heat. A method of making an electronic assembly. An assembly obtained by the method.

Substrate is produced by using a MEMS technique to form multiple diaphragms in a substrate by forming piezoelectric material layer on one surface of the substrate and thereafter by forming openings in the substrate from the other surface of the substrate; substrate and substrate on which signal detection circuit is formed are aligned to each other using at least one of multiple diaphragms as alignment diaphragm; and substrate and substrate are bonded together.

A microstructure may be provided by forming a metal layer such as a molybdenum layer over a substrate. An aluminum nitride layer is formed on a top surface of the metal layer. A surface portion of the aluminum nitride layer is converted into a continuous aluminum oxide-containing layer by oxidation. A dielectric spacer layer may be formed over the continuous aluminum oxide-containing layer. Contact via cavities extending through the dielectric spacer layer, the continuous aluminum oxide-containing layer, and the aluminum nitride layer and down to a respective portion of the at least one metal layer may be formed using etch processes that contain a wet etch step while suppressing formation of an undercut in the aluminum nitride layer. Contact via structures may be formed in the contact via cavities. The microstructure may include a micro-electromechanical system (MEMS) device containing a piezoelectric transducer.

A micro electro mechanical system (MEMS) includes a circuit substrate, a first MEMS structure disposed over the circuit substrate, and a second MEMS structure disposed over the first MEMS structure.

A package structure and its manufacturing method are provided. The package structure includes a substrate with a recess, and a first MEMS chip, a first intermediate chip, a second MEMS chip and a first capping plate sequentially formed on the substrate. The lower surface of the first MEMS chip has a first sensor or a microactuator. The upper surface of the second MEMS chip has a second sensor or a microactuator. The first intermediate chip has a through-substrate via, and includes a signal conversion unit, a logic operation unit, a control unit, or a combination thereof. The package structure includes at least one of the first sensor and the second sensor.

Provided is a method for bonding panel of a microfluidic element by using a releasing film including preparing a panel having a pattern for a microfluidic channel formed on one surface thereof, preparing a release film coated with silicon nanoparticles on one or both surfaces thereof, plasma-treating one surface of the panel on which the pattern for the microfluidic channel is formed and the surface of the release film, and bonding the panel and the release film by performing heat treatment at a predetermined temperature range in a state in which the plasma-treated panel and the release film are attached to each other.

Nanopore flow cells and methods of manufacturing thereof are provided herein. In one embodiment a method of forming a flow cell includes forming a multilayer stack on a first substrate, e.g., a monocrystalline silicon substrate, before transferring the multilayer stack to a second substrate, e.g., a glass substrate. Here, the multilayer stack features a membrane layer, having a first opening formed therethrough, where the membrane layer is disposed on the first substrate, and a material layer is disposed on the membrane layer. The method further includes patterning the second substrate to form a second opening therein and bonding the patterned surface of the second substrate to a surface of the multilayer stack. The method further includes thinning the first substrate and thinning the second substrate. Here, the second substrate is thinned to where the second opening is disposed therethrough. The method further includes removing the thinned first substrate and at least portions of the material layer to expose opposite surfaces of the membrane layer.