A substrate assembly includes a first substrate, a second substrate and a bonding member. The first substrate includes a first surface-modified region having a functionality different from that of a remainder region of the first substrate. The second substrate includes a second surface-modified region connected to the first surface-modified region through a physical interaction and having a functionality different from that of a remainder region of the second substrate. The first and second substrates cooperatively define a space therebetween. The bonding member is disposed within said space to bond said first and second substrates together. A method for bonding substrates is also disclosed.

A semiconductor package includes a first die having a first surface, a first conductive bump over the first surface and having first height and a first width, a second conductive bump over the first surface and having a second height and a second width. The first width is greater than the second width and the first height is substantially identical to the second height. A method for manufacturing the semiconductor package is also provided.

An optical module includes a mirror unit having a movable mirror portion, a magnet portion configured to generate a magnetic field acting on the movable mirror portion, and a package accommodating the magnet portion. The magnet portion has a Halbach structure including a first magnet applied with a force in a first direction, and a second magnet applied with a force in a second direction. The package has a bottom walls portion, a side wall portion, and a restriction portion configured to restrict movement of the second magnet in the second direction. The movable mirror portion is disposed in a space formed by the restriction portion.

An optical module includes a mirror unit having a movable mirror portion, a magnet portion configured to generate a magnetic field acting on the movable mirror portion, and a package accommodating the magnet portion. The magnet portion has a Halbach structure including a first magnet applied with a force in a first direction, and a second magnet applied with a force in a second direction. The package has a bottom walls portion, a side wall portion, and a restriction portion configured to restrict movement of the second magnet in the second direction. The movable mirror portion is disposed in a space formed by the restriction portion.

Disclosed a MEMS assembly and a manufacturing method thereof. The manufacturing method comprises: forming a groove on a sensor chip; forming a bonding pad on a circuit chip; bonding the sensor chip and the circuit chip together to form a bonding assembly; performing a first dicing process at a first position of the sensor chip to penetrate through the sensor chip to the groove; performing a second dicing process at a second position of the sensor chip to penetrate through the sensor chip and the circuit chip, for obtaining an individual MEMS assembly by singulating the bonding assembly, wherein location of the groove corresponds to a position of the bonding pad, and an opening is formed in the sensor chip to expose the bonding pad when the second dicing process is performed. The method uses two dicing process respectively achieving different depths to expose the bonding pad of the sensor chip and singulate the MEMS assembly, respectively, to improve yield and reliability.

A method of processing a double sided wafer of a microelectromechanical device includes spinning a resist onto a first side of a first wafer. The method further includes forming pathways within the resist to expose portions of the first side of the first wafer. The method also includes etching one or more depressions in the first side of the first wafer through the pathways, where each of the depressions have a planar surface and edges. Furthermore, the method includes depositing one or more adhesion metals over the resist such that the one or more adhesion metals are deposited within the depressions, and then removing the resist from the first wafer. The method finally includes depositing indium onto the adhesion metals deposited within the depressions and bonding a second wafer to the first wafer by compressing the indium between the second wafer and the first wafer.

A MEMS package is provided. The MEMS package includes a metallization layer, a planarization structure, a MEMS device structure, a cap structure and a pressure adjustment element. The planarization structure has an inner sidewall defining a first cavity exposing the metallization layer. The MEMS device structure is bonded to the planarization structure. The MEMS device structure includes a movable element over the first cavity. The cap structure is bonded to the MEMS device structure and has an inner sidewall defining a second cavity facing the movable element. The pressure adjustment element is disposed in the second cavity.

A semiconductor device structure is provided. The semiconductor device structure includes a first substrate including a first face and a second face opposite the first face. A second substrate is bonded to the first face of the first substrate such that the second face of the first substrate faces away from the second substrate. One or more recesses are arranged in the second face of the first substrate and are configured to compensate for thermal expansion or thermal contraction.

A method of manufacturing a micro flow path device includes: arranging a cover film on a surface of a base film on which an electrode pattern made of a metallic thin film has been formed and obtaining a flow path forming laminate; punching the obtained flow path forming laminate along a shape of a flow path so as to cut a part of the electrode pattern and forming a punched portion in which at least a pair of opposite electrodes are exposed to a part of the punched cut surface; and disposing a first planar member, defining a bottom surface of the flow paths on a back surface side of the flow path forming laminate on which the punched portion has been formed and disposing a second planar member defining a top surface of the flow path on a front surface side of the flow path forming laminate.

A method of manufacturing a micro flow path device includes: arranging a cover film on a surface of a base film on which an electrode pattern made of a metallic thin film has been formed and obtaining a flow path forming laminate; punching the obtained flow path forming laminate along a shape of a flow path so as to cut a part of the electrode pattern and forming a punched portion in which at least a pair of opposite electrodes are exposed to a part of the punched cut surface; and disposing a first planar member, defining a bottom surface of the flow paths on a back surface side of the flow path forming laminate on which the punched portion has been formed and disposing a second planar member defining a top surface of the flow path on a front surface side of the flow path forming laminate.