Provided are package-on-package (POP)-type semiconductor packages including a lower package having a first size and including a lower package substrate in which a lower semiconductor chip is, an upper redistribution structure on the lower package substrate and the lower semiconductor chip, and alignment marks. The packages may also include an upper package having a second size smaller than the first size and including an upper package substrate and an upper semiconductor chip. The upper package substrate may be mounted on the upper redistribution structure of the lower package and electrically connected to the lower package, and the upper semiconductor chip may be on the upper package substrate. The alignment marks may be used for identifying the upper package, and the alignment marks may be below and near outer boundaries of the upper package on the lower package.

A method for manufacturing a soft stamp includes providing a substrate having a first electrode and a second electrode, the second electrode being formed at a distance less than 100 nm from the first electrode so that a nanogap Ng is formed between the first and second electrodes; pouring a curable substance over the first and second electrodes and into the nanogap Ng; curing the curable substance to form a soft stamp; and removing the soft stamp from the first and second electrodes. The soft stamp has a nano-feature having a size less than 100 nm.

An operation method of a semiconductor removing apparatus includes moving a semiconductor structure to a stage, wherein the semiconductor structure includes a lower substrate, a cap, and a micro electro mechanical system (MEMS) structure between the lower substrate and the cap, and the cap has a diced portion; pulling, by a clamp assembly, a tape of a tape roll from a first side of the stage to a second side of the stage opposite to the first side, such that the tape is attached to the cap of the semiconductor structure; and pulling, by the clamp assembly, the tape of the tape roll from the second side of the stage back to the first side of the stage, such that the diced portion of the cap separates from the semiconductor structure.

A method for fabricating an imprint master 1 comprises a first forming step of forming micro-protrusion-and-recess structures 23 having a first average pitch on one surface of a substrate 10 and a second forming step of forming main recesses 21 or main protrusions 22 having a second average pitch larger than the first average pitch on the one surface of the substrate 10 having the micro-protrusion-and-recess structures 23 formed thereon, in a manner maintaining a shape of at least a portion of the micro-protrusion-and-recess structures 23 in the main recesses 21 or the main protrusions 22 while the main recesses 21 or the main protrusions 22 are being formed.

A fabrication method of transparent material is a method of processing a thermosetting transparent material including a disposing step of disposing an uncured thermosetting transparent material, a laser beam irradiation step of irradiating the disposed uncured thermosetting transparent material with a laser beam so that cavitation bubbles are generated in the uncured thermosetting transparent material, and a curing step of performing a curing process on the uncured thermosetting transparent material in which the cavitation bubbles are generated.

A micro pick-up array used to pick up a micro device is provided. The micro pick-up array includes a substrate, a pick-up structure, and a soft polymer layer. The pick-up structure is located on the substrate. The pick-up structure includes a cured photo sensitive material. The soft polymer layer covers the pick-up structure. A manufacturing method of a micro pick-up array is also provided.

Method and arrangement for assembling one or more microchips (415; 615; 715; 815; 915; 1015) into one or more holes (422; 722), respectively, in a substrate surface (421; 721) of a separate receiving substrate (420; 720; 820; 1020). The holes (422; 722) of the substrate is for microchip insertion out-of-plane in relation to said substrate surface. Each of said microchips is provided with a ferromagnetic layer (213; 613) of ferromagnetic material. The microchips are placed (503) on said substrate surface (421; 721) and it is applied and moved (504) one or more magnetic fields affecting said ferromagnetic layer (213; 613) of each microchip such that the microchips thereby become out-of-plane oriented in relation to said substrate surface (421; 721) and move over the substrate surface (421; 721) until assembled into said holes (422; 722).

The present invention relates to a method for producing a molded body (10), comprising the following steps: a) providing a molding tool (40) which has at least one receptacle (12) in which at least one material (30) which comprises at least one shape-memory material (31) is introduced, wherein the shape-memory material (31) is present in a first state (111), wherein the material (30) at least partially fills the receptacle (12) of the molding tool (40) in such a manner that said material adjoins at least one surface of the receptacle (12); b) creating a molded body (10) in the receptacle (12) of the molding tool (40) from the material (30), wherein the shape-memory material (31) is present in a second state (112), wherein a form (11) is embossed into the molded body (10) during the second state (112); c) transferring the shape-memory material (31) to a third state (113), wherein the molded body (10) can be deformed during the third state (113) in such a manner that the molded body (10) is demolded from the receptacle (12) of the molding tool (40); and d) at least partially restoring the form (11) of the molded body (10) by transferring the shape-memory material (31) to a fourth state (114), wherein the molded body (10) at least partially resumes the form (11) according to step b) during the fourth state (114).

A method of deposition is disclosed. The method can include dispensing a formable material over a substrate, where the substrate includes a non-uniform surface topography, and where the substrate includes an active zone and an exclusion zone. The method can also include curing the formable material in the exclusion zone to form a circular edge between the exclusion zone and the active zone, contacting the formable material with a superstrate, and curing the formable material in the active zone to form a layer over the substrate, wherein curing is performed while the superstrate is contacting the formable material.

Embodiments of the disclosure provide a method for designing an optical scanning mirror. The method may include receiving an initial set of design parameters for the scanning mirror assembly. The method may also include simulating first scanning mirror oscillation based on the initial set of design parameters to compute an initial non-linear spring constant associated with at least one spring of the scanning mirror assembly. The method may further include adjusting the set of design parameters for the scanning mirror assembly based on a comparison between the initial non-linear spring constant and a target non-linear spring constant. The method may also include outputting the at least one structural alteration to be implemented on the at least one spring. In certain aspects, the initial set of design parameters and the adjusted set of design parameters may be associated with a same mirror oscillation frequency and linear spring constant.