A device and method for a MEMS device with at least one sensor is disclosed. A thermal element is disposed adjacent the MEMS device to selectively adjust a temperature of the MEMS device. A calibration operation is initiated for the sensor to determine a correction value to be applied to the sensor measurement based on the temperature. The correction value is stored.

A method for forming a functional part in a minute space includes the steps of: filling a minute space with a dispersion functional material in which a thermally-meltable functional powder is dispersed in a liquid dispersion medium; evaporating the liquid dispersion medium present in the minute space; and heating the functional powder and hardening it under pressure.

A method for fabricating three-dimensional microstructures is presented. The method includes: disposing a substantially planar reflow material between two molds; heating the reflow material while the reflow material is disposed between the two molds; and reflowing the reflow material towards the bottom surface of one of the molds by creating a pressure gradient across the reflow material. At least one of molds includes geometrics features that help to shape the reflow material and thereby form a complex three-dimensional microstructure.

A preparation method of a bionic adhesive material with a tip-expanded microstructural array includes the following steps: machining through-holes on a metal sheet; modifying morphology of a through-hole by electroplating, using the metal sheet in step 1 as an electroplating cathode, and arranging the electroplating cathode and an electroplating anode in parallel to prepare a hyperboloid-like through-hole array assembly, fitting a lower surface of the hyperboloid-like through-hole array assembly tightly to an upper surface of a substrate assembly to prepare a through-hole assembly of a mold; and filling the mold assembly with a polymer, curing, and demolding to obtain the adhesive material with the tip-expanded microstructural array.

A method of manufacturing a microarray substrate having improved reliability and mass-production properties uses a vapor of a surface-reforming material, and includes washing a base substrate, supplying the vapor of the surface-reforming material into a container to which the base substrate is provided, and coupling the vapor of the surface-reforming material to a surface of the base substrate to form a self-assembled monolayer.

A method for a MEMS device includes receiving a diced wafer having a plurality devices disposed upon an adhesive substrate and having an associated known good device data, removing a first set of devices from the plurality of devices from the adhesive substrate in response to the known good device data, picking and placing a first set of the devices into a plurality of sockets within a testing platform, testing the first set of integrated devices includes while physically stressing the first set of devices, providing electrical power to the first set of devices and receiving electrical response data from the first set of devices, determining a second set of devices from the first set of devices, in response to the electrical response data, picking and placing the second set of devices into a transport tape media.

A method for manufacturing a molded product with fine structure includes steps of, in a temperature-controlled stamper mold provided with a fine structure including a concavo-convex pattern having a width of 10 nm to 1 μm, forming a thermoplastic molten polymer layer to be in contact with the fine structure 20 of the stamper mold having been kept at a predetermined temperature and holding the thermoplastic molten polymer layer for a predetermined time so as to transfer the fine structure of the stamper mold to the thermoplastic molten polymer layer under gravity.

Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. The control patterns may be part of a library of control patterns.

A mold structure having high-precision multi-dimensional components which includes a first oxide layer superimposed on a top of a first semiconductor substrate; a second oxide layer superimposed on a top of a second semiconductor substrate; integrated designs patterned in at least one of the oxide layers; and the first and second semiconductor substrates bonded to one another into a three dimensional (3D) mold such that the first oxide layer only makes partial contact with the second oxide layer such that a portion of the first oxide layer avoids contact with the second oxide layer, the portion of the first oxide layer directly opposite a surface portion of the second semiconductor substrate that is free of the second oxide, the 3D mold selectively filled with a filling material to form a molded high-precision multi-dimensional component.

Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause phototransistors or electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. A set of micro-object may be analyzed. Geometric properties of the set of micro-objects may be identified. The set of micro-objects may be divided into multiple sub-sets of micro-objects based on the one or more geometric properties and one or more control patterns.