C01G3/00

3-dimensional NOR string arrays in segmented stacks
11180861 · 2021-11-23 · ·

A memory structure formed above a semiconductor substrate includes two or more modules each formed on top of each other separated by a layer of global interconnect conductors. Each memory module may include a 3-dimensional array of memory transistors organized as NOR array strings. Each 3-dimensional array of memory transistors is provided vertical local word lines as gate electrodes to the memory transistors. These vertical local word lines are connected by the layers of global interconnect conductors below and above the 3-dimensional array of memory transistors to circuitry formed in the semiconductor substrate.

3-dimensional NOR string arrays in segmented stacks
11180861 · 2021-11-23 · ·

A memory structure formed above a semiconductor substrate includes two or more modules each formed on top of each other separated by a layer of global interconnect conductors. Each memory module may include a 3-dimensional array of memory transistors organized as NOR array strings. Each 3-dimensional array of memory transistors is provided vertical local word lines as gate electrodes to the memory transistors. These vertical local word lines are connected by the layers of global interconnect conductors below and above the 3-dimensional array of memory transistors to circuitry formed in the semiconductor substrate.

The Preparation Method of 3D Printing-Based YBCO Superconducting Twisted Wire

The present disclosure relates to a method for preparing high-temperature superconducting yttrium barium copper oxide (YBCO) wire by 3D-printing, this method is divided into the following four steps: firstly, preparing a nano-level superconducting powder precursor; and then, preparing a printing paste with suitable viscosity and supporting characteristics; after that, using a CAD 3D modeling, exporting STL format model data and slicing by a professional software; implementing one-step preparing strands with low AC loss by twisting the print nozzle. Finally, the printed twisted wire is formed into a practical superconducting twisted cable through the processes such as plastic removal process, crystallizing process, oxygen supplementing process and assembling process in order. The present disclosure firstly provides an application for applying high temperature superconducting material to direct ink writing 3D-printing technology. By preparing micro/nano level superconducting core filaments based on 3D-printing, the diameter of the core filaments could be reduced, and thereby a material-structure integrative design could be implemented. The present disclosure simplifies the preparation of high temperature superconducting wires, improves the current-carrying capacity and the production efficiency of the high temperature super conducting wires, and reduces the production cost.

COPPER NANOCLUSTERS, THYMINE-MODIFIED HYALURONIC ACID AND POLY(COPPER NANOCLUSTERS), METHOD FOR PREPARING THE SAME, AND APPLICATION THEREOF

Copper nanoclusters (CuNCs), thymine-modified hyaluronic acid (TMHA), and poly(copper nanoclusters) (PCuNCs) are disclosed. In certain embodiments, the TMHA is represented by formula I, wherein the degree of substitution of theymine in the HA is in a range of 1-50%, and wherein n for GlcA-GlcNAc repeats is an integer, from 10 to 10,000.

Techniques For Cryogenic Radiation Enhancement Of Superconductors And Related Systems And Methods
20220005614 · 2022-01-06 ·

A superconductor having improved critical current density when exposed to high-energy neutron radiation and high magnetic fields, such as found in a compact nuclear fusion reactor, and a method of making the same are described. According to some aspects, the method includes, prior to deployment in the exposure environment, irradiating a polycrystalline superconductor with ions and/or neutrons at a cryogenic temperature to create “weak” magnetic flux pinning sites, such as point defects or small defect clusters. Irradiation temperature is chosen, for example as a function of the superconducting material, so that irradiation creates the beneficial flux pinning sites while avoiding detrimental widening of the boundaries of the crystalline grains caused by diffusion of the displaced atoms. Such a superconductor in a coated-conductor tape is expected to be beneficial when used as a toroidal field coil in a fusion reactor when cooled well below its critical temperature.

Cryogenic radiation enhancement of superconductors

Disclosed are a superconductor having improved critical current density when exposed to high-energy neutron radiation and high magnetic fields, such as found in a compact nuclear fusion reactor, and a method of making the same. The method includes, prior to deployment in the exposure environment, irradiating a polycrystalline (e.g. cuprate) superconductor with ionic matter or neutrons at a cryogenic temperature to create “weak” magnetic flux pinning sites, such as point defects or small defect clusters. Irradiation temperature is chosen, for example as a function of the superconducting material, so that irradiation creates the beneficial flux pinning sites while avoiding detrimental widening of the boundaries of the crystalline grains caused by diffusion of the displaced atoms. Such a superconductor in a coated-conductor tape is expected to be beneficial when used, for example, as a toroidal field coil in a fusion reactor when cooled well below its critical temperature.

PREPARATION METHOD FOR ELECTRONIC-GRADE COPPER CHLORIDE DIHYDRATE

The present disclosure relates to the technical field of preparation of copper chloride, and in particular to a method of preparing an electronic-grade copper chloride dihydrate, which mainly includes the following steps: dissolving a copper salt in a first hydrochloric acid solution to obtain a copper salt solution; performing two solid-liquid separations for the copper salt solution to obtain a filtrate; wherein, the two solid-liquid separations do not have sequence and include an adhesive separation and a co-precipitation separation; the adhesive separation is a solid-liquid separation performed by adding a waste PCB board powder and continuously stirring; the co-precipitation separation is a solid-liquid separation performed by adding tin chloride compound and continuously stirring; adding a second hydrochloric acid into the filtrate and adjusting pH and then performing evaporation concentration to a supersaturated solution, adding copper chloride seed crystal and then performing cooling crystallization and centrifugal separation.

Purification process for the preparation of non-carrier added copper-64

Compositions comprising high levels of high specific activity copper-64, and process for preparing said compositions. The compositions comprise from about 2 Ci to about 15 Ci of copper-64 and have specific activities up to about 3800 mCi copper-64 per microgram of copper. The processes for preparing said compositions comprise bombarding a nickel-64 target with a low energy, high current proton beam, and purifying the copper-64 from other metals by a process comprising ion exchange chromatography or a process comprising a combination of extraction chromatography and ion exchange chromatography.

PURIFICATION PROCESS FOR THE PREPARATION OF NON-CARRIER ADDED COPPER-64

Compositions comprising high levels of high specific activity copper-64, and process for preparing said compositions. The compositions comprise from about 2 Ci to about 15 Ci of copper-64 and have specific activities up to about 3800 mCi copper-64 per microgram of copper. The processes for preparing said compositions comprise bombarding a nickel-64 target with a low energy, high current proton beam, and purifying the copper-64 from other metals by a process comprising ion exchange chromatography or a process comprising a combination of extraction chromatography and ion exchange chromatography.

PURIFICATION PROCESS FOR THE PREPARATION OF NON-CARRIER ADDED COPPER-64

Compositions comprising high levels of high specific activity copper-64, and process for preparing said compositions. The compositions comprise from about 2 Ci to about 15 Ci of copper-64 and have specific activities up to about 3800 mCi copper-64 per microgram of copper. The processes for preparing said compositions comprise bombarding a nickel-64 target with a low energy, high current proton beam, and purifying the copper-64 from other metals by a process comprising ion exchange chromatography or a process comprising a combination of extraction chromatography and ion exchange chromatography.