The recovery of noble metal(s) from noble-metal-containing material is generally described. The noble metal(s) can be recovered selectively, in some cases, such that noble metal(s) is at least partially separated from non-noble-metal material within the material. Noble metal(s) may be recovered from noble-metal-containing material using mixtures of acids, in some instances. In some cases, the mixture can comprise nitric acid and/or another source of nitrate ions and at least one supplemental acid, such as sulfuric acid, phosphoric acid, and/or a sulfonic acid. The amount of nitrate ions within the mixture can be, in some instances, relatively small compared to the amount of supplemental acid within the mixture. In some cases, the recovery of noble metal(s) using the acid mixtures described herein can be enhanced by transporting an electric current between an electrode and the noble metal(s) of the noble-metal-containing material. In some cases, acid mixtures can be used to recover silver from particular types of scrap materials, such as scrap material comprising silver metal and cadmium oxide and/or scrap material comprising silver metal and tungsten metal.

A battery includes a case having a feedthrough port, a feedthrough assembly disposed in the feedthrough port, and a cell stack disposed within the case. The feedthrough port includes an inner conductor and an insulator core separating the inner conductor from the case. The cell stack includes an anode, a cathode, and a separator insulating the anode from the cathode, wherein the anode and cathode are offset from one another. An insulating boot surrounding the cell stack insulates the cell stack from the case. The insulating boot has an opening configured to receive therein the feedthrough assembly, which may include overmolded insulation. The interior surfaces and interior walls of the battery case may be thermal spray-coated with a dielectric material to prevent lithium dendrite formation between cathode and anode surfaces.

A method for producing a noble metal fine particle-supported catalyst includes: a step of mixing a noble metal salt, an alcohol having 1 to 5 carbon atoms, and a support to form a mixture; and a heating step of the mixture at a temperature of 150° C. or higher and 800° C. or lower to produce a noble metal fine particle-supported catalyst.

A method for producing a noble metal fine particle-supported catalyst includes: a step of mixing a noble metal salt, an alcohol having 1 to 5 carbon atoms, and a support to form a mixture; and a heating step of the mixture at a temperature of 150° C. or higher and 800° C. or lower to produce a noble metal fine particle-supported catalyst.

A chalcogen-containing compound of the following Chemical Formula 1 which exhibits excellent phase stability even at a low temperature, particularly at a temperature corresponding to an operating temperature of a thermoelectric element, and also exhibits a significantly superior power factor and thermoelectric performance index due to its excellent electrical conductivity and low thermal conductivity caused by its unique crystal lattice structure, a method for preparing the same, and a thermoelectric element including the same. [Chemical Formula 1]—V.sub.1-2xSn.sub.4Bi.sub.2-xAg.sub.3xSe.sub.7, wherein V is vacancy and 0<x<0.5.

A high performance, lead free, Ag paste thermal interface material (TIM) for die attachment and substrate bonding in electronic packaging includes: (i) multiscale silver particles, (ii) metal-coated carbon nanotubes (CNTs), (iii) a polymer, and (iv) a liquid carrier. The multiscale silver particles and metal-coated carbon nanotubes, which function as hybrid filler components, are uniformly dispersed within the TIM composition. The sintered TIM exhibits high density, high mechanical strength, and high thermal conductivity. The components of the liquid carrier including the solvent, binder, surfactants, and thinner are completely evaporated or burned off during sintering. Sintering of the TIM can be conducted at a relatively low temperature, without or with very low (<0.1 MPa) pressure, in open air and without vacuum or inert gas protection. The TIM can be utilized in substrate bonding not only on conventional metal-plated surfaces but also bare Cu substrate surfaces.

A high performance, lead free, Ag paste thermal interface material (TIM) for die attachment and substrate bonding in electronic packaging includes: (i) multiscale silver particles, (ii) metal-coated carbon nanotubes (CNTs), (iii) a polymer, and (iv) a liquid carrier. The multiscale silver particles and metal-coated carbon nanotubes, which function as hybrid filler components, are uniformly dispersed within the TIM composition. The sintered TIM exhibits high density, high mechanical strength, and high thermal conductivity. The components of the liquid carrier including the solvent, binder, surfactants, and thinner are completely evaporated or burned off during sintering. Sintering of the TIM can be conducted at a relatively low temperature, without or with very low (<0.1 MPa) pressure, in open air and without vacuum or inert gas protection. The TIM can be utilized in substrate bonding not only on conventional metal-plated surfaces but also bare Cu substrate surfaces.

The invention is directed to a composition of metal particles and methods of manufacturing and using the composition in the treatment of microbial infections and cancer. The particles can be nanoparticles having coupled thereto at least one of a surfactant, an antibiotic, and a drug. The particles of the invention achieve enhanced stability, enhanced cytotoxicity, and enhanced antimicrobial activity through novel combinations of metals, surfactants, antibiotics, and drugs.

The invention is directed to a composition of metal particles and methods of manufacturing and using the composition in the treatment of microbial infections and cancer. The particles can be nanoparticles having coupled thereto at least one of a surfactant, an antibiotic, and a drug. The particles of the invention achieve enhanced stability, enhanced cytotoxicity, and enhanced antimicrobial activity through novel combinations of metals, surfactants, antibiotics, and drugs.

A device including a near field transducer, the near field transducer including gold (Au), silver (Ag), copper (Cu), or aluminum (Al), and at least two other secondary atoms, the at least two other secondary atoms selected from: boron (B), bismuth (Bi), indium (In), sulfur (S), silicon (Si), tin (Sn), manganese (Mn), tellurium (Te), holmium (Ho), lutetium (Lu), praseodymium (Pr), scandium (Sc), uranium (U), barium (Ba), chlorine (Cl), cesium (Cs), dysprosium (Dy), europium (Eu), fluorine (F), germanium (Ge), hydrogen (H), iodine (I), rubidium (Rb), selenium (Se), terbium (Tb), nitrogen (N), oxygen (O), carbon (C), antimony (Sb), gadolinium (Gd), samarium (Sm), thallium (Tl), cadmium (Cd), neodymium (Nd), phosphorus (P), lead (Pb), hafnium (Hf), niobium (Nb), erbium (Er), zinc (Zn), magnesium (Mg), palladium (Pd), vanadium (V), zinc (Zn), chromium (Cr), iron (Fe), lithium (Li), nickel (Ni), platinum (Pt), sodium (Na), strontium (Sr), calcium (Ca), yttrium (Y), thorium (Th), beryllium (Be), thulium (Tm), erbium (Er), ytterbium (Yb), promethium (Pm), neodymium (Nd cobalt (Co), cerium (Ce), lanthanum (La), praseodymium (Pr), or combinations thereof.