C01G19/00

INORGANIC OXIDE PARTICLES COATED WITH SILANE COMPOUND HAVING NITROGEN-CONTAINING RING AND COATING COMPOSITION

An inorganic oxide particles which have a minute particle diameter at which no interference fringes occur in a coating film and high transparency can be secured even when applied to a high refractive index substrate, and in which excitation by ultraviolet radiation is almost completely suppressed, a coating composition containing such particles, and an optical member having a cured film formed from the coating composition. Inorganic oxide particles obtained by bonding an organosilicon compound having a nitrogen-containing heterocyclic group to the surface of modified metal oxide colloid particles (C) having an average particle diameter of 2 to 100 nm, which include metal oxide colloid particles (A) having an average primary particle diameter of 2 to 60 nm as nuclei and with the nuclei surface coated with a coating composed of inorganic oxide colloid particles (B) having an average primary particle diameter of 1 to 4 nm.

Chalcogen-containing compound, its preparation method and thermoelectric element comprising the same

A chalcogen-containing compound of the following Chemical Formula 1 which exhibits excellent phase stability even at a low temperature, particularly at a temperature corresponding to an operating temperature of a thermoelectric element, and also exhibits a significantly superior power factor and thermoelectric performance index due to its excellent electrical conductivity and low thermal conductivity caused by its unique crystal lattice structure, a method for preparing the same, and a thermoelectric element including the same. [Chemical Formula 1]—V.sub.1-2xSn.sub.4Bi.sub.2-xAg.sub.3xSe.sub.7, wherein V is vacancy and 0<x<0.5.

METHOD FOR PRODUCING INDIUM TIN OXIDE PARTICLES AND METHOD FOR PRODUCING CURABLE COMPOSITION
20210162500 · 2021-06-03 ·

Provided are a method for producing indium tin oxide particles and a method for producing a curable composition, the methods including a step of obtaining a precursor solution including indium and tin by heating indium acetate and tin acetate in a solvent including a carboxylic acid and having 6 to 20 carbon atoms, and a step of obtaining a reaction solution including indium tin oxide particles by dropwise adding the obtained precursor solution to a solvent having a hydroxy group and having 14 to 22 carbon atoms, which has a temperature of 230° C. to 320° C., in which an acetic acid concentration in the precursor solution is in a range of 0.5% by mass to 6% by mass.

Antioxidant for fuel cells and membrane-electrode assembly including the same

Disclosed are an antioxidant for fuel cells and a membrane-electrode assembly including the same. The membrane-electrode assembly may have obtained greatly improved durability by using an antioxidant having a novel composition that may provide excellent antioxidant activity and long-term durability.

Carbon Nanotube Enhanced Silver Paste Thermal Interface Material
20210159144 · 2021-05-27 ·

A high performance, lead free, Ag paste thermal interface material (TIM) for die attachment and substrate bonding in electronic packaging includes: (i) multiscale silver particles, (ii) metal-coated carbon nanotubes (CNTs), (iii) a polymer, and (iv) a liquid carrier. The multiscale silver particles and metal-coated carbon nanotubes, which function as hybrid filler components, are uniformly dispersed within the TIM composition. The sintered TIM exhibits high density, high mechanical strength, and high thermal conductivity. The components of the liquid carrier including the solvent, binder, surfactants, and thinner are completely evaporated or burned off during sintering. Sintering of the TIM can be conducted at a relatively low temperature, without or with very low (<0.1 MPa) pressure, in open air and without vacuum or inert gas protection. The TIM can be utilized in substrate bonding not only on conventional metal-plated surfaces but also bare Cu substrate surfaces.

Carbon Nanotube Enhanced Silver Paste Thermal Interface Material
20210159144 · 2021-05-27 ·

A high performance, lead free, Ag paste thermal interface material (TIM) for die attachment and substrate bonding in electronic packaging includes: (i) multiscale silver particles, (ii) metal-coated carbon nanotubes (CNTs), (iii) a polymer, and (iv) a liquid carrier. The multiscale silver particles and metal-coated carbon nanotubes, which function as hybrid filler components, are uniformly dispersed within the TIM composition. The sintered TIM exhibits high density, high mechanical strength, and high thermal conductivity. The components of the liquid carrier including the solvent, binder, surfactants, and thinner are completely evaporated or burned off during sintering. Sintering of the TIM can be conducted at a relatively low temperature, without or with very low (<0.1 MPa) pressure, in open air and without vacuum or inert gas protection. The TIM can be utilized in substrate bonding not only on conventional metal-plated surfaces but also bare Cu substrate surfaces.

Luminescent component

Described are luminescent components with excellent performance and stability. The luminescent components comprise a first element including first luminescent crystals from the class of perovskite crystals, embedded a first polymer P1 and a second element comprising a second solid polymer composition, said second polymer composition optionally comprising second luminescent crystals embedded in a second polymer P2. Polymers P1 and P2 differ and are further specified in the claims. Also described are methods for manufacturing such components and devices comprising such components.

POROUS OXIDE SEMICONDUCTOR PARTICLES

Porous oxide semiconductor particles have a connected structure in which porous primary particles having an aggregate of crystallites composed of an oxide semiconductor are connected to each other and have a specific surface area of 60 m.sup.2/g or more. The porous oxide semiconductor particles have preferably a pore diameter of 1 nm or more and 20 nm or less. The porous oxide semiconductor particles have preferably a tap density of 0.005 g/cm.sup.3 or more and 1.0 g/cm.sup.3 or less. The oxide semiconductor is preferably SnO.sub.2 or SnO.sub.2 doped with at least one element selected from the group consisting of Nb, Sb, W, Ta, and Al.

Articles with patterned coatings

Embodiments of a article including include a substrate and a patterned coating are provided. In one or more embodiments, when a strain is applied to the article, the article exhibits a failure strain of 0.5% or greater. Patterned coating may include a particulate coating or may include a discontinuous coating. The patterned coating of some embodiments may cover about 20% to about 75% of the surface area of the substrate. Methods for forming such articles are also provided.

Fine fluorescent-material particles, process for producing fine fluorescent-material particles, thin fluorescent-material film, wavelength conversion film, wavelength conversion device, and solar cell
10934483 · 2021-03-02 · ·

A luminescent substance particle includes BaSnO.sub.3:Zn having a perovskite-type structure, a content of Zn (zinc) being more than 0.0% by mass and less than 8.0% by mass. Alternatively, a luminescent substance particle includes BaSnO.sub.3:Mg having a perovskite-type structure, a content of Mg (magnesium) being more than 0.0% by mass and less than 0.1% by mass.