The present disclosure relates to a method of making a lensed connector in which a glass ferrule has holes within the body of the glass ferrule, and the glass ferrule is subsequently processed to form lens structures along the ferrule.

The present disclosure relates to a method of making a lensed connector in which a glass ferrule has holes within the body of the glass ferrule, and the glass ferrule is subsequently processed to form lens structures along the ferrule.

An additively manufactured electronics packaging assembly including a build substrate formed from a plurality of additively printed layers. One or more additively printed electrical interconnects can be positioned within the plurality of layers. The assembly can include an electronics housing built along the build substrate. The electronics housing can include one or more additively printed walls extending around a component cavity and a housing lid enclosing and sealing the cavity. One or more additively printed electrical circuits can be included within the component cavity, which can be electrically connected with the additively printed electrical interconnects. One or more electronic components can be positioned within the cavity and can be electrically connected to the additively printed electrical interconnects. The additively printed electrical circuits can be used to indicate a leak in the additively manufactured electronics packaging assembly.

An additively manufactured electronics packaging assembly including a build substrate formed from a plurality of additively printed layers. One or more additively printed electrical interconnects can be positioned within the plurality of layers. The assembly can include an electronics housing built along the build substrate. The electronics housing can include one or more additively printed walls extending around a component cavity and a housing lid enclosing and sealing the cavity. One or more additively printed electrical circuits can be included within the component cavity, which can be electrically connected with the additively printed electrical interconnects. One or more electronic components can be positioned within the cavity and can be electrically connected to the additively printed electrical interconnects. The additively printed electrical circuits can be used to indicate a leak in the additively manufactured electronics packaging assembly.