Patent classifications
C03C13/00
Glass material with low dielectric constant attributable to high weight percentage of boron trioxide
A glass material with a low dielectric constant attributable to a high weight percentage of boron trioxide includes at least one component for forming the main constructure of the glass material, a fluxing component, a reinforcing component, and a modifier; wherein the at least one component for forming the main constructure of the glass material includes silicon dioxide (SiO.sub.2); the fluxing component includes boron trioxide (B.sub.2O.sub.3); the reinforcing component includes aluminum oxide (Al.sub.2O.sub.3); and the modifier includes calcium oxide (CaO). The glass material is characterized in that it has a boron trioxide (B.sub.2O.sub.3) content by weight of 30%-40%, which is higher than those in the prior art; a calcium oxide (CaO) content by weight of 1%-6%, which is lower than those in the prior art; and consequently a lower dielectric constant and a lower dissipation factor of the glass material than those in the prior art can be obtained.
Fibers treated with polymerization compounds and fiber reinforced composites made therefrom
Methods of making fiber reinforced composite articles are described. The methods may include treating fibers with a sizing composition that includes a polymerization compound, and introducing the treated fibers to a pre-polymerized composition. The combination of the treated fibers and pre-polymerized composition may then undergo a temperature adjustment to a polymerization temperature at which the pre-polymerized composition polymerizes into a plastic around the fibers to form the fiber-reinforced composite article. Techniques for introducing the treated fibers to the pre-polymerized composition may include pultrusion, filament winding, reactive injection molding (RIM), structural reactive injection molding (SRIM), resin transfer molding (RTM), vacuum-assisted resin transfer molding (VARTM), long fiber injection (LFI), sheet molding compound (SMC) molding, bulk molding compound (BMC) molding, a spray-up application, and/or a hand lay-up application, among other techniques.
Fibers treated with polymerization compounds and fiber reinforced composites made therefrom
Methods of making fiber reinforced composite articles are described. The methods may include treating fibers with a sizing composition that includes a polymerization compound, and introducing the treated fibers to a pre-polymerized composition. The combination of the treated fibers and pre-polymerized composition may then undergo a temperature adjustment to a polymerization temperature at which the pre-polymerized composition polymerizes into a plastic around the fibers to form the fiber-reinforced composite article. Techniques for introducing the treated fibers to the pre-polymerized composition may include pultrusion, filament winding, reactive injection molding (RIM), structural reactive injection molding (SRIM), resin transfer molding (RTM), vacuum-assisted resin transfer molding (VARTM), long fiber injection (LFI), sheet molding compound (SMC) molding, bulk molding compound (BMC) molding, a spray-up application, and/or a hand lay-up application, among other techniques.
Glass fiber composition, glass fiber and composite material thereof
A composition for producing a glass fiber, including the following components with corresponding percentage amounts by weight: SiO.sub.2: 57.4-60.9%; Al.sub.2O.sub.3: greater than 17% and less than or equal to 19.8%; MgO: greater than 9% and less than or equal to 12.8%; CaO: 6.4-11.8%; SrO: 0-1.6%; Na.sub.2O+K.sub.2O: 0.1-1.1%; Fe.sub.2O.sub.3: 0.05-1%; TiO.sub.2: lower than 0.8%; and SiO.sub.2+Al.sub.2O.sub.3: lower than or equal to 79.4%. The total weight percentage of the above components in the composition is greater than 99%. The weight percentage ratio of Al.sub.2O.sub.3+MgO to SiO.sub.2 is between 0.43 and 0.56, and the weight percentage ratio of CaO+MgO to SiO.sub.2+Al.sub.2O.sub.3 is greater than 0.205. The composition can significantly increase the glass modulus, effectively reduce the glass crystallization rate, secure a desirable temperature range (ΔT) for fiber formation and enhance the refinement of molten glass, thus making it particularly suitable for high performance glass fiber production with refractory-lined furnaces.
Glass fiber composition, glass fiber and composite material thereof
A composition for producing a glass fiber, including the following components with corresponding percentage amounts by weight: SiO.sub.2: 57.4-60.9%; Al.sub.2O.sub.3: greater than 17% and less than or equal to 19.8%; MgO: greater than 9% and less than or equal to 12.8%; CaO: 6.4-11.8%; SrO: 0-1.6%; Na.sub.2O+K.sub.2O: 0.1-1.1%; Fe.sub.2O.sub.3: 0.05-1%; TiO.sub.2: lower than 0.8%; and SiO.sub.2+Al.sub.2O.sub.3: lower than or equal to 79.4%. The total weight percentage of the above components in the composition is greater than 99%. The weight percentage ratio of Al.sub.2O.sub.3+MgO to SiO.sub.2 is between 0.43 and 0.56, and the weight percentage ratio of CaO+MgO to SiO.sub.2+Al.sub.2O.sub.3 is greater than 0.205. The composition can significantly increase the glass modulus, effectively reduce the glass crystallization rate, secure a desirable temperature range (ΔT) for fiber formation and enhance the refinement of molten glass, thus making it particularly suitable for high performance glass fiber production with refractory-lined furnaces.
Low dielectric glass composition, fibers, and article
Glass compositions and glass fibers having low dielectric constants and low dissipation factors that may be suitable for use in electronic applications and articles are disclosed. The glass fibers and compositions of the present invention may include between 48.0 to 57.0 weight percent SiO.sub.2; between 15.0 and 26.0 weight percent B.sub.2O.sub.3; between 12.0 and 18.0 weight percent Al.sub.2O.sub.3; between 3.0 and 8.0 weight percent P.sub.2O.sub.5; between 0.25 and 7.00 weight percent CaO; 5.0 or less weight percent MgO; and 6.0 or less weight percent TiO.sub.2. Further, the glass composition has a glass viscosity of 1000 poise at a temperature greater than 1350 degrees Celsius and a liquidus temperature greater than 1100 degrees Celsius.
Low dielectric glass composition, fibers, and article
Glass compositions and glass fibers having low dielectric constants and low dissipation factors that may be suitable for use in electronic applications and articles are disclosed. The glass fibers and compositions of the present invention may include between 48.0 to 57.0 weight percent SiO.sub.2; between 15.0 and 26.0 weight percent B.sub.2O.sub.3; between 12.0 and 18.0 weight percent Al.sub.2O.sub.3; between 3.0 and 8.0 weight percent P.sub.2O.sub.5; between 0.25 and 7.00 weight percent CaO; 5.0 or less weight percent MgO; and 6.0 or less weight percent TiO.sub.2. Further, the glass composition has a glass viscosity of 1000 poise at a temperature greater than 1350 degrees Celsius and a liquidus temperature greater than 1100 degrees Celsius.
Energy absorption member
An energy absorption member (21) includes a hollow cylindrical fiber-reinforced composite material including reinforcement fibers (22), in which tensile strength S (GPa), tensile modulus of elasticity M (GPa), and elongation rate E (%) satisfy the following expression (1), and a curable resin composition with which the reinforcement fibers (22) are impregnated. The volume content of the reinforcement fibers (22) in the fiber-reinforced composite material is 30 to 80%.
11.0≤S.sup.2×M.sup.1/8/E.sup.1/2≤22.0 (1)
Energy absorption member
An energy absorption member (21) includes a hollow cylindrical fiber-reinforced composite material including reinforcement fibers (22), in which tensile strength S (GPa), tensile modulus of elasticity M (GPa), and elongation rate E (%) satisfy the following expression (1), and a curable resin composition with which the reinforcement fibers (22) are impregnated. The volume content of the reinforcement fibers (22) in the fiber-reinforced composite material is 30 to 80%.
11.0≤S.sup.2×M.sup.1/8/E.sup.1/2≤22.0 (1)
Low dielectric glass composition, fibers, and article
Glass compositions and glass fibers having low dielectric constants and low dissipation factors that may be suitable for use in electronic applications and articles are disclosed. The glass fibers and compositions of the present invention may include between 48.0 to 58.0 weight percent SiO.sub.2; between 15.0 and 26.0 weight percent B.sub.2O.sub.3; between 12.0 and 18.0 weight percent Al.sub.2O.sub.3; between greater than 0.25 and 3.0 weight percent P.sub.2O.sub.5; between greater than 0.25 and 7.00 weight percent CaO; 5.0 or less weight percent MgO; between greater than 0 and 1.5 weight percent SnO.sub.2; and 6.0 or less weight percent TiO.sub.2. Further, the glass composition has a glass viscosity of 1000 poise at a temperature greater than 1350 degrees Celsius and a liquidus temperature greater than 1000 degrees Celsius.