A polishing agent for a synthetic quartz glass substrate, containing polishing particles and water includes ceria particles as base particles, and composite oxide particles of cerium and at least one rare earth element selected from trivalent rare earth elements other than cerium are supported on surfaces of the base particles. This provides a polishing agent for a synthetic quartz glass substrate, the polishing agent having high polishing rate and being capable of sufficiently reducing generation of defects due to polishing.

A polishing agent for a synthetic quartz glass substrate, containing polishing particles and water includes ceria particles as base particles, and composite oxide particles of cerium and at least one rare earth element selected from trivalent rare earth elements other than cerium are supported on surfaces of the base particles. This provides a polishing agent for a synthetic quartz glass substrate, the polishing agent having high polishing rate and being capable of sufficiently reducing generation of defects due to polishing.

Provided is a wavelength conversion member that can be readily adjusted in chromaticity and can be increased in productivity and a production method for the wavelength conversion member. A wavelength conversion member 1 having a first principal surface 1a and a second principal surface 1b opposed to each other includes a glass matrix 2 and phosphor particles 3 disposed in the glass matrix 2, wherein concentrations of the phosphor particles 3 in the first principal surface 1a and in the second principal surface 1b are higher than concentrations of the phosphor particles 3 in surface layer bottom planes 1c and 1d located 20 μm inward from the first principal surface 1a and 20 μm inward from the second principal surface 1b, respectively.

Embodiments of an enclosure including a substrate having an anti-fingerprint surface are disclosed. The anti-fingerprint surface may include a textured surface, a coated surface or a coated textured surface that exhibits a low fingerprint visibility, when a fingerprint is applied to the anti-fingerprint surface. In one or more embodiments, the enclosure exhibits any one of the following attributes (1) radio, and microwave frequency transparency, as defined by a loss tangent of less than 0.03 and at a frequency range of between 15 MHz to 3.0 GHz; (2) infrared transparency; (3) a fracture toughness of greater than 0.6 MPa.Math.m.sup.1/2; (4) a 4-point bend strength of greater than 350 MPa; (5) a Vickers hardness of at least 450 kgf/mm.sup.2 and a Vickers median/radial crack initiation threshold of at least 5 kgf; (6) a Young's Modulus in the range from about 50 GPa to about 100 GPa; and (7) a thermal conductivity of less than 2.0 W/m° C.

Embodiments of an enclosure including a substrate having an anti-fingerprint surface are disclosed. The anti-fingerprint surface may include a textured surface, a coated surface or a coated textured surface that exhibits a low fingerprint visibility, when a fingerprint is applied to the anti-fingerprint surface. In one or more embodiments, the enclosure exhibits any one of the following attributes (1) radio, and microwave frequency transparency, as defined by a loss tangent of less than 0.03 and at a frequency range of between 15 MHz to 3.0 GHz; (2) infrared transparency; (3) a fracture toughness of greater than 0.6 MPa.Math.m.sup.1/2; (4) a 4-point bend strength of greater than 350 MPa; (5) a Vickers hardness of at least 450 kgf/mm.sup.2 and a Vickers median/radial crack initiation threshold of at least 5 kgf; (6) a Young's Modulus in the range from about 50 GPa to about 100 GPa; and (7) a thermal conductivity of less than 2.0 W/m° C.

Devised are a supporting substrate capable of contributing to an increase in density of a semiconductor package and a laminate using the supporting substrate. A supporting glass substrate of the present invention includes a polished surface on a surface thereof and has a total thickness variation of less than 2.0 μm.

Devised are a supporting substrate capable of contributing to an increase in density of a semiconductor package and a laminate using the supporting substrate. A supporting glass substrate of the present invention includes a polished surface on a surface thereof and has a total thickness variation of less than 2.0 μm.

A glass manufacturing apparatus includes a support configured to hold a glass including a first flat portion, a second flat portion, and a curved portion connecting one side of the first flat portion and one side of the second flat portion. The support includes a first flat surface supporting the first flat portion, a second flat surface facing the first flat surface and supporting the second flat portion, and a curved surface connecting the flat surface to the second flat surface and supporting the curved portion.

A glass manufacturing apparatus includes a support configured to hold a glass including a first flat portion, a second flat portion, and a curved portion connecting one side of the first flat portion and one side of the second flat portion. The support includes a first flat surface supporting the first flat portion, a second flat surface facing the first flat surface and supporting the second flat portion, and a curved surface connecting the flat surface to the second flat surface and supporting the curved portion.

Systems and methods for displaying art in a manner which resists tipping from external forces while preserving artistic impression are disclosed. An art piece includes an inner core extending from a bottom of a display portion and an outer stabilizing core formed about the inner core. A base includes a recess located within a housing. The recess is configured to snugly receive the stabilizing core. A number of illumination devices are located within the recess and electrically connected to a power supply for illuminating the art piece. In some embodiments, holes may be formed in the base for fastening the base to a surface.