C03C23/00

Sealed devices comprising transparent laser weld regions

Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

Glass vial with increased chemical stability

A glass vial includes a base including a boron-containing multicomponent glass and a vial opening and holds a liquid active pharmaceutical ingredient formulation. The glass vial has a total volume of <4.5 mL. A filling level of the glass vial with the active pharmaceutical ingredient formulation is not more than 0.25 and a concentration of boron ions, measured at a measurement site below a plane of a middle of the glass vial using a concentration depth profile at a depth in a range from 10 to 30 nm, has a value, averaged over the measurements of the concentration depth profile, that has an excess increase of not more than 30% compared to a concentration of boron ions measured using a concentration depth profile at a depth in a range from 10 to 30 nm with a measurement site in the plane of the middle of the glass vial.

METHOD OF REPAIRING GLASS FOR DISPLAY DEVICE
20230022346 · 2023-01-26 ·

A method of repairing a glass of a display device includes disposing the glass including a first surface, a second surface opposite to the first surface, and a scratch formed on the first surface, the scratch facing toward a gravitational direction, disposing a heating plate on the first surface of the glass, and irradiating a laser on the second surface. A transmittance rate of the laser passing through the glass is greater than an absorption rate of the laser being absorbed in the glass. A portion of the laser irradiated to the second surface reaches the heating plate. The laser reaching the heating plate generates heat. Heat is transmitted to the glass. A portion of the glass adjacent to the scratch is melted by the heat. The portion of the melted glass fills the scratch.

GLASS WITH MODIFIED SURFACE REGIONS AND METHODS AND APPARATUSES FOR FORMING THE SAME VIA ELECTRO-THERMAL POLING AND FIELD-ASSISTED ION EXCHANGE

A glass substrate with modified surface regions is disclosed. The glass substrate includes an alkali-containing bulk, a first alkali-depleted region, a second alkali-depleted region, and a first ion-exchanged region. The alkali-containing bulk has a first surface and a second surface with the first and second surfaces on opposite sides. The first alkali-depleted region extends into the alkali-containing bulk from the first surface. The second alkali-depleted region extends into the alkali-containing bulk from the second surface. The first ion-exchanged region extends into the alkali-containing bulk from the first surface. The first alkali-depleted region, the second alkali-depleted region, and the first ion-exchanged region each have a substantially homogenous composition. A method of forming the glass substrate is disclosed. The method includes simultaneously forming the first alkali-depleted region and the first ion-exchanged region in the first surface. The method also includes near-simultaneously forming the second alkali-depleted region in the second surface.

METHOD OF BESSEL BEAM LASER PROCESSING FOR FORMING THROUGH GLASS VIAS
20230227352 · 2023-07-20 ·

A method of Bessel beam laser processing for forming through glass vias is adapted for processing a glass substrate having a thickness of less than or equal to 1000 micrometers. The glass substrate is processed by a Bessel beam laser to form a pilot through via and is etched to enlarge the pilot through via to form a through glass via having a diameter ranging from 25 micrometers to 200 micrometers. The Bessel beam laser has a pulse width ranging from 10 picoseconds to 20 picoseconds and is converted as a Bessel beam passing through the glass substrate to form the pilot through via. The through glass via with a smooth interior surface is formed.

Method For Manufacturing A Multi-Color Dental Restoration

A process for the preparation of multi-coloured dental restorations is described, in which glasses and glass ceramics with various compositions are given the shapes of dental restorations and colour changes are effected in the glasses and glass ceramics by irradiating them with artificial electromagnetic radiation and subjecting them to a heat treatment.

INSTALLATION FOR TREATING GLASS CONTAINERS COMPRISING A CHAMBER FOR METERING TREATMENT SUBSTANCE HAVING A DOUBLE SHUTTER, AND ASSOCIATED METHOD
20230016184 · 2023-01-19 ·

The invention relates to an installation (1) for treating the inner face (6) of the wall (3) of a glass container (2), which wall (3) delimits a receiving cavity (4) and an opening (5) providing access to the cavity (4), the installation (1) comprising a source (12) of a treatment substance (13) and a means (15) for dispensing the treatment substance (13) into the cavity (4) of the container (1), said dispensing means (15) comprising a metering chamber (16) which extends between an inlet orifice (18) and an opposite outlet orifice (19) intended to be positioned above the opening (5) of the container, and also an upper shutter (20) and a lower shutter (21) for the chamber (16), which are positioned in a tiered manner at the inlet orifice (18) and the outlet orifice (19), respectively, of the chamber (16).

Installations and methods for treating glass containers.

INSTALLATION FOR TREATING GLASS CONTAINERS COMPRISING A CHAMBER FOR METERING TREATMENT SUBSTANCE HAVING A DOUBLE SHUTTER, AND ASSOCIATED METHOD
20230016184 · 2023-01-19 ·

The invention relates to an installation (1) for treating the inner face (6) of the wall (3) of a glass container (2), which wall (3) delimits a receiving cavity (4) and an opening (5) providing access to the cavity (4), the installation (1) comprising a source (12) of a treatment substance (13) and a means (15) for dispensing the treatment substance (13) into the cavity (4) of the container (1), said dispensing means (15) comprising a metering chamber (16) which extends between an inlet orifice (18) and an opposite outlet orifice (19) intended to be positioned above the opening (5) of the container, and also an upper shutter (20) and a lower shutter (21) for the chamber (16), which are positioned in a tiered manner at the inlet orifice (18) and the outlet orifice (19), respectively, of the chamber (16).

Installations and methods for treating glass containers.

THROUGH-GLASS VIA-HOLE FORMATION METHOD

A through-glass via-hole formation method includes: forming a hole-shaped deformed region extending in a thickness direction of a glass substrate by irradiating the glass substrate with a laser beam at an energy intensity not exceeding an ablation threshold of the glass substrate; and forming a via-hole through the glass substrate along the deformed region by immersing the glass substrate in an etching solution such that the deformed region is etched and removed, wherein an etching solution having a first concentration is used as the etching solution to allow the via-hole to have a first aspect ratio, and an etching solution having a second concentration greater than the first concentration is used as the etching solution to allow the via-hole to have a second aspect ratio smaller than the first aspect ratio.

GLASS ELECTROCHEMICAL SENSOR WITH WAFER LEVEL STACKING AND THROUGH GLASS VIA (TGV) INTERCONNECTS

A method of forming a glass electrochemical sensor is described. In some embodiments, the method may include forming a plurality of electrical through glass vias (TGVs) in an electrode substrate; filling each of the plurality of electrical TGVs with an electrode material; forming a plurality of contact TGVs in the electrode substrate; filling each of the plurality of contact TGVs with a conductive material; patterning the conductive material to connect the electrical TGVs with the contact TGVs; forming a cavity in a first glass layer; and bonding a first side of the first glass layer to the electrode substrate.