A method of forming a through hole in a glass substrate is provided. The method includes irradiating a surface of a glass substrate with a mid-infrared or far-infrared laser to form a pilot hole including a plurality of cracks extending radially outward from the pilot hole. The pilot hole is etched to expand a diameter of the pilot hole to at least encompass the plurality of cracks to form a through hole having a through hole entry diameter of about 200 micrometers to about 1.5 millimeters.

A shielding mesh to counter scattered ionizing radiation is provided. The shielding mesh includes a plate, arrangement of depressions, a mesh of trenches, and an x-ray-absorbing material. The plate has a first side and a second side opposite the first side. The arrangement of depressions are in the plate and are open toward the second side. The mesh of trenches are in the plate and are open toward the first side. The x-ray-absorbing material is in the mesh of trenches. The mesh of trenches and arrangement of depressions are configured so that a wall of the plate remains between the arrangement of depressions and the mesh of trenches.

A manufacturing method of a glass article having an organic film includes irradiating a first main surface of a glass plate having the first main surface and a second main surface, opposite each other, with a laser light of a first laser, to form an in-plane void region, in which voids are arrayed, on the first main surface, and internal void arrays, including voids arrayed from the in-plane void region to the second main surface, in the glass plate; depositing the organic film on the first main surface or the second main surface of the glass plate; and irradiating and scanning the first main surface or the second main surface, on which the organic film was deposited, with a laser light of a second laser, along the in-plane void region, to separate the glass article from the glass plate along the in-plane void region.

A method for manufacturing an optical metasurface is configured to operate in a given working spectral band. The method comprises: obtaining a 2D array of patterns, each comprising one or more nanostructures forming dielectric elements that are resonant in said working spectral band, said nanostructures being formed in at least one photosensitive dielectric medium; exposing said 2D array to a writing electromagnetic wave having at least one wavelength in said photosensitivity spectral band, said writing wave having a spatial energy distribution in a plane of the 2D array that is a function of an intended phase profile, so that each pattern of the 2D array produces on an incident electromagnetic wave having a wavelength in the working spectral band, a phase variation corresponding to a refractive index variation experienced by said pattern during said exposure.

An anti-reflective glass, a preparation method and an application thereof are provided. The anti-reflective glass comprises a glass matrix, at least one surface of the glass matrix is provided with an undulating hill morphology layer, which forms a whole piece with the glass matrix, the hill morphology layer consists of a plurality of irregularly distributed hill raised micro-structures along a Z-axis direction. The present anti-reflective glass has hill morphology surface which can significantly reduce the light reflectivity and increase the light transmittance, the perspective effect of the light is improved; the preparation method simplifies the etching process effectively, and the condition is controllable, the undulating hill morphology formed on the glass surface by etching is effectively ensured, and the optical performance is stable.

An anti-reflective glass, a preparation method and an application thereof are provided. The anti-reflective glass comprises a glass matrix, at least one surface of the glass matrix is provided with an undulating hill morphology layer, which forms a whole piece with the glass matrix, the hill morphology layer consists of a plurality of irregularly distributed hill raised micro-structures along a Z-axis direction. The present anti-reflective glass has hill morphology surface which can significantly reduce the light reflectivity and increase the light transmittance, the perspective effect of the light is improved; the preparation method simplifies the etching process effectively, and the condition is controllable, the undulating hill morphology formed on the glass surface by etching is effectively ensured, and the optical performance is stable.

In a method for removing an organic adhesive from a glass carrier in a semiconductor manufacturing process, the glass carrier is placed into a process chamber. The glass carrier is rotated and heated sulfuric acid is applied or sprayed onto the glass carrier. Ozone is introduced into the process chamber. The ozone diffuses through the sulfuric acid to the organic adhesive on the surface of the glass carrier. The sulfuric acid and the ozone chemically react with the organic adhesive and remove it from the glass carrier.

A colored sapphire material and methods for coloring sapphire material using lasers are disclosed. The method for coloring the sapphire material may include positioning the sapphire material over an opaque substrate material, exposing the opaque substrate material to a laser beam passing through the sapphire material to impact the substrate material, and inducing a chemical change in a portion of the sapphire material exposed to the laser beam. The method may also include creating a visible color in the portion of the sapphire material as a result of the chemical change. The colored sapphire material may include a first transparent portion, and a second, colored portion substantially surrounded by the first portion. The second, colored portion may have a chemical composition different than that of the first portion.

An aluminosilicate glass having a composition according to the following formula (I):

(100−(1+a.sub.1+b.sub.1).Math.x)SiO.sub.2.Math.(x)Al.sub.2O.sub.3.Math.(a.sub.1.Math.x)MO.Math.(b.sub.1.Math.x)R (wt %)  (I)

in which MO is alkaline earth metal oxide, the alkaline earth metal M being one or more of Mg, Ca, Sr, and Ba, R comprises alkali metal oxide, the alkali metal being one or more of Li, Na, and K, x is at least 15, a.sub.1 is at least 0.35, b.sub.1 is at least 0.55, and wherein the product of a.sub.1 and b.sub.1 is at least 0.22.

A through electrode substrate includes a substrate having a through hole extending through between a first face and a second face, a diameter of the through hole not having a minimum value inside the through hole; and a conductor arranged inside the through hole, wherein the through hole has a shape having a value obtained by summing a first to an eighth inclination angle at a first to an eighth position, respectively, of an inner face of the through hole of 8.0° or more, each of the first to the eighth inclination angle is an angle of the inner face with respect to a center axis of the through hole, and the first to the eighth position correspond to positions at distances of 6.25%, 18.75%, 31.25%, 43.75%, 56.25%, 68.75%, 81.25%, and 93.75%, respectively, from the first face in a section from the first face to the second face.