Reversible (relatively weak) anodic bonds permit glass and silicon components to be separated without damaging the components so that they can be reused. To this end, chamfered glass with high aluminum content can be used during the original anodic bonding. Anodic bonding is terminated after complete intimate contact is achieved and while the bond is reversible. The high aluminum content impedes further bond strengthening so that the bond does not become non-reversible via contact bonding. The chamfer provides access near the glass-silicon interface for prying the glass off the silicon to effect debonding without damaging the glass or the silicon. Accordingly, the glass, the silicon, or both may be rebounded (rather than being wastefully disposed).

Reversible (relatively weak) anodic bonds permit glass and silicon components to be separated without damaging the components so that they can be reused. To this end, chamfered glass with high aluminum content can be used during the original anodic bonding. Anodic bonding is terminated after complete intimate contact is achieved and while the bond is reversible. The high aluminum content impedes further bond strengthening so that the bond does not become non-reversible via contact bonding. The chamfer provides access near the glass-silicon interface for prying the glass off the silicon to effect debonding without damaging the glass or the silicon. Accordingly, the glass, the silicon, or both may be rebounded (rather than being wastefully disposed).

Concepts as well as arrangements are suggested, according to which a bond is enabled by anodic bonding between a glass substrate (200) having contact vias (210) and a substrate (100) including a semiconductor. For this purpose, a cover of the contact vias (210) is provided during the anodic bonding method such that process conditions are created that achieve a reliable and robust bonding of the substrates. A high resistance can be provided in the region of the contact vias (210). The arrangement for contacting the semiconductor device to the silicon substrate (100) having at least one contact via (210) extending through the passivation in order to contact a region of the first substrate (100).

A method of joining panels for a vitrine is disclosed. The ends of the panels to be joined are mitered cut and bonded with a suitable adhesive providing adequate adhesion and transparency. The joints are formed to provide a wedge-shape bond gap sufficient to allow application of the adhesive from the outside of the gap through capillary action. The adhesive may be catalyzed or ultraviolet- or light-hardened.

An interlayer film for laminated glass that has a one-layer structure or a two or more layer-structure includes a first layer containing a thermoplastic resin. The first layer may have a glass transition temperature of 10 C. or lower and the inter layer film may have an equivalent stiffness of 2.4 MPa or greater at 25 C.

An interlayer film for laminated glass that has a one-layer structure or a two or more layer-structure includes a first layer containing a thermoplastic resin. The first layer may have a glass transition temperature of 10 C. or lower and the inter layer film may have an equivalent stiffness of 2.4 MPa or greater at 25 C.

Electronic device components that include a glass portion and a ceramic or a glass ceramic portion are disclosed. The ceramic or glass ceramic portions of the component may be located to provide desired performance characteristics to the component, which may be an enclosure component. In addition, regions of compressive stress may be formed within the glass portion, the glass ceramic portion, or both to further adjust the performance characteristics of the component. Electronic devices including the components and methods for making the components are also provided.

Reversible (relatively weak) anodic bonds permit glass and silicon components to be separated without damaging the components so that they can be reused. To this end, chamfered glass with high aluminum content can be used during the original anodic bonding. Anodic bonding is terminated after complete intimate contact is achieved and while the bond is reversible. The high aluminum content impedes further bond strengthening so that the bond does not become non-reversible via contact bonding. The chamfer provides access near the glass-silicon interface for prying the glass off the silicon to effect debonding without damaging the glass or the silicon. Accordingly, the glass, the silicon, or both may be rebounded (rather than being wastefully disposed).

In some embodiments, a process comprises fixing a first portion of a flexible glass substrate into a first fixed shape with a first rigid support structure and attaching a first display to the first portion of the flexible glass substrate or to the first rigid support structure. After fixing the first portion and attaching the first display, and while maintaining the first fixed shape of the first portion of the flexible glass substrate and the attached first display, cold-forming a second portion of the flexible glass substrate to a second fixed shape and fixing the second portion of the flexible glass substrate into the second fixed shape with a second rigid support structure.

A strengthened glass cover for a light fixture includes a glass core layer, a first glass cladding layer fused to a first surface of the glass core layer, and a second glass cladding layer fused to a second surface of the glass core layer. A coefficient of thermal expansion (CTE) of the glass core layer is greater than a CTE of each of the first glass cladding layer and the second glass cladding layer, whereby the glass core layer is in tension and each of the first glass cladding layer and the second glass cladding layer is in compression. A light fixture includes a housing and the cover coupled to the housing.