A method and a device for encasing gemstones, such as diamonds, in glass. In order for their optical effects and appearance to be maximized, the gemstones are placed at a defined position and at a defined orientation. A suction cannula is provided for that purpose with an opening to fit the gemstone and to hold the gemstone by vacuum. Guide elements, such as spirals or meshes, are carried on the suction cannula so as to assure even distancing from the walls of the glass tube into which the gemstone is inserted.

A method and a device for encasing gemstones, such as diamonds, in glass. In order for their optical effects and appearance to be maximized, the gemstones are placed at a defined position and at a defined orientation. A suction cannula is provided for that purpose with an opening to fit the gemstone and to hold the gemstone by vacuum. Guide elements, such as spirals or meshes, are carried on the suction cannula so as to assure even distancing from the walls of the glass tube into which the gemstone is inserted.

The present invention relates to a composite material, particularly a composite material for ceramic tiles, stone cladding, surface tops (e.g. worktops), and the like. The composite materials are typically derived from waste products. The composite materials of the present invention are formed from a glass component and a non-glass mineral component (e.g. ceramics and/or glaze). Generally the composite materials do not require any binders (especially synthetic binders) to hold the materials together. Therefore, the composite materials and products made therefrom are typically recyclable.

The present invention relates to a composite material, particularly a composite material for ceramic tiles, stone cladding, surface tops (e.g. worktops), and the like. The composite materials are typically derived from waste products. The composite materials of the present invention are formed from a glass component and a non-glass mineral component (e.g. ceramics and/or glaze). Generally the composite materials do not require any binders (especially synthetic binders) to hold the materials together. Therefore, the composite materials and products made therefrom are typically recyclable.

A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

A sealed structure which has high sealing capability and whose border can be slim is provided. The sealed structure includes a pair of substrates whose respective surfaces face each other with a space therebetween, and a glass layer which is in contact with the substrates, defines a space between the substrates, and has at least one corner portion and side portions in continuity with the corner portion. The width of the corner portion of the glass layer is smaller than or equal to that of the side portion of the same. The sealed structure may comprise a highly reliable light-emitting element including a layer containing a light-emitting organic compound provided between a pair of electrodes.

A method and a device for hermetically encapsulating components using at least one gas discharge lamp, an inorganic material that is transparent for light and a light-absorbing inorganic medium, are provided. With a suitable selection, inorganic materials or inorganic media guarantee a very low level of permeability for oxygen, water vapor and reactive gases in contrast to organic materials or organic media. The encapsulation occurs in a time period of less than one second. In addition, the average temperature of the component only increases slightly, such that even components with temperature-sensitive regions can be encapsulated.

A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.