There are provided a lens member, a method of manufacturing the lens member, a communication module, a lens array, and a light-source module, the lens member including a ready-made glass lens added with a mounting portion having a reference face as a plane for reference when the glass lens is mounted on a substrate. A lens member includes a glass ball lens to which sphericity processing has been previously performed, and a resin mounting portion 13 disposed on the glass ball lens. The mounting portion is molded by flowing the resin in a flowable state into a die including the glass ball lens disposed therein. The mounting portion includes a reference face that abuts on a mounting face in a case where the glass ball lens is surface-mounted, provided thereto.

The invention is an adhesive composition comprising a silyl terminated prepolymer having a number molecular weight average (Mn) of about 8,000 to about 80,000 g/mole, a filler, and a silanol condensation reaction catalyst. The silyl terminated prepolymer is comprised of a polymeric backbone of alkylene oxide and at least three urethane groups and at least two terminal groups comprised of a silicon atom having at least two alkoxy silane groups, wherein each silicon atom in the terminal groups is separated from the urethane groups in the polymeric backbone by an amount of alkylene oxide that has a molecular weight of 200 to 15,000 g/mole.

Methods for the production of a semiconductor device are disclosed. In one embodiment, a method may include: (1) mechanically contacting a first substrate (100) having a semiconductor material to a second substrate (200) having a bondable passivation material and contact vias (210) extending through the bondable passivation material; (2) covering the contact vias (210) with an at least high-resistance material (220, 300) on a side facing away from the first substrate (100); (3) applying an electric potential between the at least high-resistance material and the first substrate. The potential has a sufficient level that is functionally sufficient to initiate a bonding process between the bondable passivation material of the second substrate and the semiconductor material of the first substrate.

A composition for sealing inorganic substrates, the composition comprising a glass frit and a filler material, wherein said glass frit comprises: 60 to 85 wt % Bi.sub.2O.sub.3; 3 to 15 wt % ZnO; 2 to 10 wt % B.sub.2O.sub.3; 0.6 to 5 wt % SiO.sub.2; 0.6 to 5 wt % Al.sub.2O.sub.3; and 0.1 to 0.5 wt % of a compound selected from NaF and BaF.sub.2.

A composition for sealing inorganic substrates, the composition comprising a glass frit and a filler material, wherein said glass frit comprises: 60 to 85 wt % Bi.sub.2O.sub.3; 3 to 15 wt % ZnO; 2 to 10 wt % B.sub.2O.sub.3; 0.6 to 5 wt % SiO.sub.2; 0.6 to 5 wt % Al.sub.2O.sub.3; and 0.1 to 0.5 wt % of a compound selected from NaF and BaF.sub.2.

A sealed structure which has high sealing capability and whose border can be slim is provided. The sealed structure includes a pair of substrates whose respective surfaces face each other with a space therebetween, and a glass layer which is in contact with the substrates, defines a space between the substrates, and has at least one corner portion and side portions in continuity with the corner portion. The width of the corner portion of the glass layer is smaller than or equal to that of the side portion of the same. The sealed structure may comprise a highly reliable light-emitting element including a layer containing a light-emitting organic compound provided between a pair of electrodes.

A compound lens assembly and method for making a compound lens assembly useful for deep ultraviolet lithography are described. The compound lens assembly includes a first lens component having an optical surface bonded to an optical surface of a second lens component. The bonding at the interface can be achieved using a hydroxide catalysis bonding technique. The compound lens assembly and process for making same solve problems relating to constringence and/or inherent birefringence known for conventional optical elements used in deep ultraviolet lithography or inspection of wafers or reticles in the DUV.

A compound lens assembly and method for making a compound lens assembly useful for deep ultraviolet lithography are described. The compound lens assembly includes a first lens component having an optical surface bonded to an optical surface of a second lens component. The bonding at the interface can be achieved using a hydroxide catalysis bonding technique. The compound lens assembly and process for making same solve problems relating to constringence and/or inherent birefringence known for conventional optical elements used in deep ultraviolet lithography or inspection of wafers or reticles in the DUV.

An electronic device is provided which can be worn on the body or implanted into the body, such as in the form of a pulse watch and/or a smartwatch and/or an implant. The electronic device includes a photoplethysmographic measuring device. A transmitter diode and a receiver diode are arranged under a window made of glass or glass ceramics. The window is implemented as a compression glass seal and/or as a fiber-optic plate.

Provided is a silicate glass, a method for preparing a silicate glass-ceramics by using the silicate glass, and a method for preparing a lithium disilicate glass-ceramics by using the silicate glass, and more particularly, to a method for preparing a glass-ceramics that has a nanosize of 0.2 to 0.5 μm and contains lithium disilicate and silicate crystalline phases. A nano lithium disilicate glass-ceramics containing a SiO.sub.2 crystalline phase includes: a glass composition including 70 to 85 wt % SiO.sub.2, 10 to 13 wt % Li.sub.2O, 3 to 7 wt % P.sub.2O.sub.5 working as a nuclei formation agent, 0 to 5 wt % Al.sub.2O.sub.3 for increasing a glass transition temperature and a softening point and enhancing chemical durability of glass, 0 to 2 wt % ZrO.sub.2, 0.5 to 3 wt % CaO for increasing a thermal expansion coefficient of the glass, 0.5 to 3 wt % Na.sub.2O, 0.5 to 3 wt % K.sub.2O, and 1 to 2 wt % colorants, and 0 to 2.0 wt % mixture of MgO, ZnO, F, and La.sub.2O.sub.3.