Electronic device components that include a glass portion and a ceramic or a glass ceramic portion are disclosed. The ceramic or glass ceramic portions of the component may be located to provide desired performance characteristics to the component, which may be an enclosure component. In addition, regions of compressive stress may be formed within the glass portion, the glass ceramic portion, or both to further adjust the performance characteristics of the component. Electronic devices including the components and methods for making the components are also provided.

An interlayer film for laminated glass that has a one-layer structure or a two or more layer-structure includes a first layer containing a thermoplastic resin. The first layer may have a glass transition temperature of 10° C. or lower and the inter layer film may have an equivalent stiffness of 2.4 MPa or greater at 25° C.

An interlayer film for laminated glass that has a one-layer structure or a two or more layer-structure includes a first layer containing a thermoplastic resin. The first layer may have a glass transition temperature of 10° C. or lower and the inter layer film may have an equivalent stiffness of 2.4 MPa or greater at 25° C.

Materials that seamlessly transition from opaque to transparent or translucent, such as advanced geopolymer-based ceramics to glass structures, which can be directly and seamlessly bonded without the use of an intermediate adhesive or use of a frame are disclosed. That is, a GP-based ceramic to glass structure can be bonded directly and seamlessly and without any mechanical joints, connective tissue or adhesives such as caulking or epoxy. Such ceramic to glass materials can be prepared by sintering an engineered geopolymer with glass to form the geopolymer-based advanced ceramic-glass structure in which the interface is visually abruptly or in which the material is a graded composition with a controlled transition from one material to the other.

Materials that seamlessly transition from opaque to transparent or translucent, such as advanced geopolymer-based ceramics to glass structures, which can be directly and seamlessly bonded without the use of an intermediate adhesive or use of a frame are disclosed. That is, a GP-based ceramic to glass structure can be bonded directly and seamlessly and without any mechanical joints, connective tissue or adhesives such as caulking or epoxy. Such ceramic to glass materials can be prepared by sintering an engineered geopolymer with glass to form the geopolymer-based advanced ceramic-glass structure in which the interface is visually abruptly or in which the material is a graded composition with a controlled transition from one material to the other.

In some embodiments, a process comprises fixing a first portion of a flexible glass substrate into a first fixed shape with a first rigid support structure and attaching a first display to the first portion of the flexible glass substrate or to the first rigid support structure. After fixing the first portion and attaching the first display, and while maintaining the first fixed shape of the first portion of the flexible glass substrate and the attached first display, cold-forming a second portion of the flexible glass substrate to a second fixed shape and fixing the second portion of the flexible glass substrate into the second fixed shape with a second rigid support structure.

A joint joins an alloy member to a ceramic member via a glass joining agent, which is joined to the alloy member by a material bonded joint and to the ceramic member by a further material bonded joint. The glass joining agent is made of a glass having a melting point below 800° C.; a coefficient of thermal expansion of at least 9-10.sup.−6 K.sup.−1 and a bismuth content of at least 10%. The alloy member has a coefficient of thermal expansion of at least 9-10.sup.−6 K.sup.−1. The ceramic member has a maximum coefficient of thermal expansion of 8-10.sup.−6 K.sup.−1. The material bonded joint defines a mixing region that is a partial region of the ceramic member, and the bismuth content in the mixing region is higher than that of the ceramic member outside the mixing region.

A gas adsorbent is placed on at least a surface of a first plate on one side in a thickness direction thereof or a surface of a second plate on one side in a thickness direction thereof. The gas adsorbent has a shape with relatively raised and lowered parts arranged alternately. The gas adsorbent is placed along a sealant that joins the first and second plates.

Embodiments of a vehicle interior component and methods of forming the same are disclosed. The vehicle interior component includes a frame with a support surface and having an opening formed in the support surface. A glass substrate is provided that includes a first major surface, a second major surface facing the support surface, and a minor surface between the first and second major surfaces and defining a thickness of the glass substrate. An adhesive at least partially fills the opening and adheres the glass substrate to the frame. The adhesive in the opening acts to secure the glass substrate and adhesive to the frame.

A method and a device for hermetically encapsulating components using at least one gas discharge lamp, an inorganic material that is transparent for light and a light-absorbing inorganic medium, are provided. With a suitable selection, inorganic materials or inorganic media guarantee a very low level of permeability for oxygen, water vapor and reactive gases in contrast to organic materials or organic media. The encapsulation occurs in a time period of less than one second. In addition, the average temperature of the component only increases slightly, such that even components with temperature-sensitive regions can be encapsulated.