A laser weldable device housing substrate, device housing and related method are provided. The substrate includes a first surface, a second surface opposite the first surface, and a thin inorganic particle layer supported by the first surface. The inorganic particle layer includes a plurality of particles arranged in a layer on the first surface. The particles have an average diameter of less than or equal to 1.0 m, and the inorganic particle layer has an average thickness of less than or equal to 5 m.

A laminated glazing comprising a first ply of glazing material and a second ply of glazing material joined by at least one ply of adhesive interlayer material is disclosed. The first ply of glazing material comprises a sheet of glass having a first composition and the second ply of glazing material comprises a sheet of glass having a second composition different to the first composition. The laminated glazing has (i) a peripheral region extending around the periphery of the laminated glazing, the laminated glazing having a surface compression stress in the peripheral region and (ii) an edge compression, wherein the magnitude of edge compression is greater than the magnitude of the surface compression stress in the peripheral region. A method of making such a laminated is provided. A glass sheet suitable for being incorporated in such a laminated glazing is also disclosed.

A process for producing conductive pastes for forming solar cell electrodes, including a step of measuring binding energies of oxygen in a glass frit by X-ray photoelectron spectroscopy, a step of selecting a glass frit providing an X-ray photoelectron spectrum representing binding energies of oxygen in which the signal intensity of a peak with a peak top at a range from 529 eV to less than 531 eV has a proportion of 40% or more relative to the total of signal intensities from 526 eV to 536 eV, and a step of mixing together a conductive powder, the glass frit and an organic vehicle.

A process of forming a sintered article includes heating a green portion of a tape of polycrystalline ceramic and/or minerals in organic binder at a binder removal zone to a temperature sufficient to pyrolyze the binder; horizontally conveying the portion of tape with organic binder removed from the binder removal zone to a sintering zone; and sintering polycrystalline ceramic and/or minerals of the portion of tape at the sintering zone, wherein the tape simultaneously extends through the removal and sintering zones.

Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.

Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.

The invention relates to a conductive paste comprising from 30 to 97% by weight of electrically conductive particles, from 0 to 20% by weight of a glass frit, from 3 to 70% by weight of an organic medium and from 0.1 to 67% by weight of a silicone oil, each based on the total mass of the paste, wherein the silicone oil has a boiling point or a boiling range in the range between 180 C. and 350 C. The invention further relates to a use of the conductive paste and a process for producing electrodes on a semiconductor substrate using the paste.

A composite powder of the present invention includes a glass powder and a ceramic powder, wherein a content of the glass powder is from 30 vol % to 60 vol %, wherein a content of the ceramic powder is from 40 vol % to 70 vol %, wherein the glass powder includes as a glass composition, in terms of mass %, 10% to 30% of SiO.sub.2, more than 20% to 40% of B.sub.2O.sub.3, 20% to 40% of SrO+BaO, 0% to 10% of Al.sub.2O.sub.3, and 0% to 15% of ZnO, and wherein the composite powder is used for a light reflective substrate.

A composition for solar cell electrodes includes silver powder, a glass frit, and an organic vehicle. The glass frit includes a first glass frit and a second glass frit. The first glass frit includes tellurium (Te) and silver (Ag) in a molar ratio (Te:Ag) of about 75:1 to about 1:25. The second glass frit includes a lead-tellurium-oxide (PbTeO)-based glass frit or a bismuth-tellurium-oxide (BiTeO)-based glass frit and is free from silver (Ag).

Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.