A process of forming a sintered article includes heating a green portion of a tape of polycrystalline ceramic and/or minerals in organic binder at a binder removal zone to a temperature sufficient to pyrolyze the binder; horizontally conveying the portion of tape with organic binder removed from the binder removal zone to a sintering zone; and sintering polycrystalline ceramic and/or minerals of the portion of tape at the sintering zone, wherein the tape simultaneously extends through the removal and sintering zones.

A glass powder is a glass powder comprising vanadium-tellurium-silver, which has a softening temperature of 230-330° C. and a median particle size of 1-2 μm; when the glass powder is applied to the silver paste, the requirement that the silver paste is sintered at the temperature of 230-400° C. can be met, and a firm three-dimensional network structure can be formed in the glass system after the silver paste is sintered, and the welding tension of a front silver electrode can be improved; the addition of other metal elements to the glass powder can enable the network structure of the glass powder to be more compact and complete and ensure the stability of the glass powder; the prepared silver paste can be sintered at a temperature of 230-400° C.

There is disclosed an article which is formed of a solid-phase or liquid-phase sintered product of a metal powder, ceramic powder or glass powder. For manufacturing the article, an extrudable mixture which contains the material powder and a thermoplastic binder is shaped into a continuous filament suitable for use in fused filament 3D printers. The printed object is then invested in plaster or other castable refractory. The invested object is then subjected to heating. The heating process burns off the thermoplastic binder and sinters the powders of metal, glass or ceramic, leaving a pure metal, glass or ceramic object.

The extrudable mixture is produced by preparing a material powder, preparing thermoplastic binder, blending the material powder and the thermoplastic binder together. The most preferable extrudable mixture contains 80 to 92% by weight of metal powder, 8 to 20% by weight of thermoplastic binder, and 0.0 to 0.1% unavoidable impurities. The extrudable mixture is then extruded into a continuous filament suitable for use in various 3d printing hardware.

A mixed silver powder and a conductive paste comprising the powder are disclosed. The mixed silver powder is obtained by mixing two or more spherical silver powders having different properties from each other. The mixed powder may minimize the disadvantages of the respective types of the two or more powders and maximize the advantages thereof, thereby improving the characteristics of products. In addition, by comprehensively controlling the particle size distribution of surface-treated mixed silver powder and the particle diameter and specific gravity of primary particles, a high-density conductor pattern, a precise line pattern, and the suppression of aggregation over time can be simultaneously achieved.

A dielectric tape suitable for use in an electronic device is provided. A dielectric slip composition comprises an organic vehicle and a dielectric glass composition comprising at least about 20 wt % and no more than about 50 wt % silicon dioxide, based upon 100% total weight of the glass composition, at least about 10 wt % and no more than about 50 wt % alkali metal oxides, based upon 100% total weight of the glass composition, and at least about 1 wt % and no more than about 10 wt % of at least one transition metal oxide. A method of forming an electronic device is also provided. The method includes the steps of applying at least one dielectric tape to at least one non-planar surface of a substrate, and subjecting the at least one dielectric tape to one or more thermal treatment steps to form a dielectric layer.

A composition for packaging an electronic device comprises a matrix and an adsorption material having a water vapor adsorption capability, and the adsorption material includes attapulgite and/or zeolite. By adding attapulgite and/or zeolite which have an adsorption effect to modify the formulation of the frit, the compositions for packaging an electronic device can effectively reduce the influence of water vapor on the electronic device, thereby effectively extending the lifetime of the packaged electronic device.

Certain example embodiments relate to improved seals for glass articles. Certain example embodiments relate to a composition used for sealing an insulted glass unit. In certain example embodiments the composition includes vanadium oxide, barium oxide, zinc oxide, and at least one additional additive. For instance, another additive that is a different metal oxide or different metal chloride may be provided. In certain example embodiments, a vacuum insulated glass unit includes first and second glass substrates that are sealed together with a seal that includes the above-described composition.

The present invention pertains to a glass characterized by: containing 72-82% of Li.sup.+, 0-21% of Si.sup.4+, and 0-28% of B.sup.3+ in terms of cation %; and containing at least 70% and less than 100% of O.sup.2− and more than 0% and at most 30% of Cl.sup.−, containing at least 94% and less than 100% of O.sup.2− and more than 0% and at most 6% of S.sup.2−, or containing at least 64% and less than 100% of O.sup.2−, more than 0% and at most 30% of Cl.sup.−, and more than 0% and at most 6% of S.sup.2−, in terms of anion %.

Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.

Colored CTE modifiers may be added to a glass frit system to modify the CTE of a resulting fired enamel. The CTE modifier is colored. The colored CTE modifier may include a modified Pseudo-Brookite type material having a formula Al.sub.2TiO.sub.5, where Al and/or Ti are partially substituted with one or more coloring ions including Fe, Cr, Mn, Co, Ni, and Cu; a modified Cordierite type material having a formula Mg.sub.2Al.sub.4Si.sub.5O.sub.18, wherein Mg and/or Al is partially substituted with one or more of the coloring ions; a Perovskite type material having a formula Sm.sub.1−xSr.sub.xMnO.sub.3−δ, where x=0.0-0.5 and δ=0.0-0.25, or a modified version of the Perovskite type material wherein Sr is partially substituted with Ba and/or Ca; a modified magnesium pyrophosphate type material having a formula Mg.sub.2P.sub.2O.sub.7 wherein Mg is substituted with Co and/or Zn ions; or combinations thereof.