Patent classifications
C03C2205/00
MIXED SILVER POWDER AND CONDUCTIVE PASTE COMPRISING SAME
A mixed silver powder and a conductive paste comprising the powder are disclosed. The mixed silver powder is obtained by mixing two or more spherical silver powders having different properties from each other. The mixed powder may minimize the disadvantages of the respective types of the two or more powders and maximize the advantages thereof, thereby improving the characteristics of products. In addition, by comprehensively controlling the particle size distribution of surface-treated mixed silver powder and the particle diameter and specific gravity of primary particles, a high-density conductor pattern, a precise line pattern, and the suppression of aggregation over time can be simultaneously achieved.
SYSTEM, PROCESS AND RELATED SINTERED ARTICLE
A process of forming a sintered article includes heating a green portion of a tape of polycrystalline ceramic and/or minerals in organic binder at a binder removal zone to a temperature sufficient to pyrolyze the binder; horizontally conveying the portion of tape with organic binder removed from the binder removal zone to a sintering zone; and sintering polycrystalline ceramic and/or minerals of the portion of tape at the sintering zone, wherein the tape simultaneously extends through the removal and sintering zones.
Mixed silver powder and conductive paste comprising same
A mixed silver powder and a conductive paste comprising the powder are disclosed. The mixed silver powder is obtained by mixing two or more spherical silver powders having different properties from each other. The mixed powder may minimize the disadvantages of the respective types of the two or more powders and maximize the advantages thereof, thereby improving the characteristics of products. In addition, by comprehensively controlling the particle size distribution of surface-treated mixed silver powder and the particle diameter and specific gravity of primary particles, a high-density conductor pattern, a precise line pattern, and the suppression of aggregation over time can be simultaneously achieved.
DENSE GLASS-CERAMIC ARTICLES VIA ADDITIVE MANUFACTURE OF GLASS FRIT
A method for forming a glass frit for additive manufacturing includes providing a mixture having at least one silicon (Si) compound, at least one calcium (Ca) compound, and at least one zirconium (Zr) compound; melting the mixture at a temperature of at least 1400° C.; cooling the mixture to room temperature to obtain the glass frit including at least 50 wt. % SiO.sub.2, at least 30 wt. % CaO, and at least 10 wt. % ZrO.sub.2.
GLASS POWDER AND SEALING MATERIAL USING SAME
A glass powder contains, as a glass composition, TeO.sub.2 of 15 mol % to 65 mol %, MoO.sub.3 of 10 mol % to 60 mol %, and P.sub.2O.sub.5 of 1 mol % to 35 mol %, and is substantially free of PbO.
SOLAR CELL
Discussed is a solar cell including a first conductive region positioned at a front surface of a semiconductor substrate and containing impurities of a first conductivity type or a second conductivity type, a second conductive region positioned at a back surface of the semiconductor substrate and containing impurities of a conductivity type opposite a conductivity type of impurities of the first conductive region, a first electrode positioned on the front surface of the semiconductor substrate and connected to the first conductive region, and a second electrode positioned on the back surface of the semiconductor substrate and connected to the second conductive region. Each of the first and second electrodes includes metal particles and a glass frit.
FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE
Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to ta second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.
System, process and related sintered article
A process of forming a sintered article includes heating a green portion of a tape of polycrystalline ceramic and/or minerals in organic binder at a binder removal zone to a temperature sufficient to pyrolyze the binder; horizontally conveying the portion of tape with organic binder removed from the binder removal zone to a sintering zone; and sintering polycrystalline ceramic and/or minerals of the portion of tape at the sintering zone, wherein the tape simultaneously extends through the removal and sintering zones.
SYSTEM, PROCESS AND RELATED SINTERED ARTICLE
A process of forming a sintered article includes heating a green portion of a tape of polycrystalline ceramic and/or minerals in organic binder at a binder removal zone to a temperature sufficient to pyrolyze the binder; horizontally conveying the portion of tape with organic binder removed from the binder removal zone to a sintering zone; and sintering polycrystalline ceramic and/or minerals of the portion of tape at the sintering zone, wherein the tape simultaneously extends through the removal and sintering zones.
GLASS FRIT, CRYSTALLIZED GLASS, METHOD FOR PRODUCING CRYSTALLIZED GLASS, SOLID ELECTROLYTE, AND LITHIUM ION SECONDARY BATTERY
A glass frit includes a glass which contains: Li; at least one selected from the group consisting of B, Si, P, Ge, and Te; O; and at least one selected from the group consisting of F, Cl, Br, and I. The glass is to turn into a crystallized glass including an amorphous phase and a crystalline phase, the crystalline phase precipitated by a heat treatment at a temperature equal to or higher than a glass transition temperature and equal to or lower than a glass crystallization temperature. The crystallized glass shows diffraction peaks at 2θ=22.8±0.5°, 2θ=32.1±0.5° and 2θ=39.6±0.5° in a powder X-ray diffraction pattern using Cu—Kα radiation.