Patent classifications
C04B35/00
MANUFACTURING SYSTEMS AND METHODS FOR THREE-DIMENSIONAL PRINTING
A three-dimensional (3D) printing system may comprise a frame; and an additive component(s) configured to couple to the frame. The additive component(s) may comprise a first extrusion unit, a second extrusion unit, and/or a third extrusion unit. The 3D printing system may be a portion of a hybrid computer numerical control (CNC) machining/3D printing system and configured to manufacture a 3D component autonomously from start to finish. The additive component(s) may comprise a heating system including a hot-air blower.
Fabrication of high heat capacity ceramic matrix composite aircraft brakes using spark plasma sintering
A method of fabricating a brake component made from a ceramic matrix composite is disclosed. In various embodiments, the method includes infiltrating a carbon fabric with a slurry containing a ceramic powder and a sintering aid; laying up the carbon fabric in a desired geometry to form a raw component; warm pressing the raw component to form a green component; and sintering the green component via a spark plasma sintering process to form a sintered component.
Three-dimensional printing
In an example of a method for three-dimensional (3D) printing, a build material composition is applied to form a build material layer. The build material composition includes a polymeric or polymeric composite build material, and a precipitating agent. Based on a 3D object model, a fusing agent is selectively applied on at least a portion of the build material composition. The fusing agent includes a radiation absorber, which the precipitating agent precipitates. The build material composition is exposed to radiation to fuse the at least the portion to form a layer of a 3D part.
Honeycomb structure
A honeycomb structure includes a pillar-shaped honeycomb structure body having a porous partition wall disposed to surround a plurality of cells, which serving as fluid through channels extending from a first end face to a second end face, wherein the plurality of cells includes: large opening cells having a large opening area on the first end face and the second end face; and small opening cells having an opening area smaller than that of the large opening cells on the first end face and the second end face, a ratio of an opening diameter of the large opening cells to an opening diameter of the small opening cells is larger than 1.11 and smaller than 1.28, and the opening diameter of the small opening cells is larger than 0.78 mm, and a cell density of the honeycomb structure body is larger than 93 pcs/cm.sup.2 and smaller than 104 pcs/cm.sup.2.
Honeycomb structure
A honeycomb structure includes a pillar-shaped honeycomb structure body having a porous partition wall disposed to surround a plurality of cells, which serving as fluid through channels extending from a first end face to a second end face, wherein the plurality of cells includes: large opening cells having a large opening area on the first end face and the second end face; and small opening cells having an opening area smaller than that of the large opening cells on the first end face and the second end face, a ratio of an opening diameter of the large opening cells to an opening diameter of the small opening cells is larger than 1.11 and smaller than 1.28, and the opening diameter of the small opening cells is larger than 0.78 mm, and a cell density of the honeycomb structure body is larger than 93 pcs/cm.sup.2 and smaller than 104 pcs/cm.sup.2.
Electronic component
An electronic component that has fewer cracks during production is provided. The electronic component includes an outer electrode on a multilayer body, which includes an inner glass layer, a magnetic material layer on top and bottom surfaces of the inner glass layer, and an outer glass layer on top and bottom surfaces of the magnetic material layer. The insulating layers of the inner glass layer and the outer glass layers contain a dielectric glass material that contains a glass material containing at least K, B, and Si, quartz, and alumina. The glass material content of each insulating layer of the inner glass layer ranges from approximately 60%-65% by weight, the quartz content of each insulating layer of the inner glass layer ranges from approximately 34%-37% by weight, and the alumina content of each insulating layer of the inner glass layer ranges from approximately 0.5%-4% by weight.
Electronic component
An electronic component that has fewer cracks during production is provided. The electronic component includes an outer electrode on a multilayer body, which includes an inner glass layer, a magnetic material layer on top and bottom surfaces of the inner glass layer, and an outer glass layer on top and bottom surfaces of the magnetic material layer. The insulating layers of the inner glass layer and the outer glass layers contain a dielectric glass material that contains a glass material containing at least K, B, and Si, quartz, and alumina. The glass material content of each insulating layer of the inner glass layer ranges from approximately 60%-65% by weight, the quartz content of each insulating layer of the inner glass layer ranges from approximately 34%-37% by weight, and the alumina content of each insulating layer of the inner glass layer ranges from approximately 0.5%-4% by weight.
CERAMIC COMPOSITE MATERIAL
A process for manufacturing ceramic-metal composite material, comprises dissolving ceramic powder into water to obtain an aqueous solution of ceramic; mixing metal powder having a multimodal particle size where largest particle size is one fourth of the minimum dimension of a device, with the aqueous solution of ceramic to obtain a powder containing ceramic precipitated on the surface of metal particles; mixing the powder containing ceramic precipitated on the surface of the metal particles, with ceramic powder having a particle size below 50 μm, to obtain a powder mixture; adding saturated aqueous solution of ceramic to the powder mixture to obtain an aqueous composition containing ceramic and metal; compressing the aqueous composition to form a disc of ceramic-metal composite material containing ceramic and metal; and removing water from the ceramic-metal composite material; wherein ceramic content of the disc is 10 vol-% to 35 vol-%. Alternatively, ceramic-ceramic composite material may be manufactured.
CERAMIC COMPOSITE MATERIAL
A process for manufacturing ceramic-metal composite material, comprises dissolving ceramic powder into water to obtain an aqueous solution of ceramic; mixing metal powder having a multimodal particle size where largest particle size is one fourth of the minimum dimension of a device, with the aqueous solution of ceramic to obtain a powder containing ceramic precipitated on the surface of metal particles; mixing the powder containing ceramic precipitated on the surface of the metal particles, with ceramic powder having a particle size below 50 μm, to obtain a powder mixture; adding saturated aqueous solution of ceramic to the powder mixture to obtain an aqueous composition containing ceramic and metal; compressing the aqueous composition to form a disc of ceramic-metal composite material containing ceramic and metal; and removing water from the ceramic-metal composite material; wherein ceramic content of the disc is 10 vol-% to 35 vol-%. Alternatively, ceramic-ceramic composite material may be manufactured.
SINTERED BODY AND ELECTROSTATIC CHUCK
A sintered body includes a ceramic substrate including sintered oxide particles, a through-hole formed in the ceramic substrate such that the side surfaces of the oxide particles exposed from an inner wall of the through-hole form a flat surface, and a porous body disposed in the through-hole, the porous body including spherical oxide ceramic particles and a mixed oxide configured to bind the spherical oxide ceramic particles.