Patent classifications
C04B38/00
MEMBER FOR OPTICAL GLASS MANUFACTURING APPARATUS
Provided is a member for optical glass manufacturing apparatus. The member is used for optical glass manufacturing apparatus and exposed to a gas containing a halogen element in a high temperature environment of 1100° C. or higher. The member includes dense ceramics containing silicon nitride as a main component, and a porosity of a surface layer of the member is smaller than a porosity of the inside of the member.
MEMBER FOR OPTICAL GLASS MANUFACTURING APPARATUS
Provided is a member for optical glass manufacturing apparatus. The member is used for optical glass manufacturing apparatus and exposed to a gas containing a halogen element in a high temperature environment of 1100° C. or higher. The member includes dense ceramics containing silicon nitride as a main component, and a porosity of a surface layer of the member is smaller than a porosity of the inside of the member.
METHODS FOR FORMING A UNITIZED CRUCIBLE ASSEMBLY
Methods for forming a unitized crucible assembly for holding a melt of silicon for forming a silicon ingot are disclosed. In some embodiments, the methods involve a porous crucible mold having a channel network with a bottom channel, an outer sidewall channel that extends from the bottom channel, and a central weir channel that extends from the bottom channel. A slip slurry may be added to the channel network and the liquid carrier of the slip slurry may be drawn into the mold. The resulting green body may be sintered to form the crucible assembly.
METHODS FOR FORMING A UNITIZED CRUCIBLE ASSEMBLY
Methods for forming a unitized crucible assembly for holding a melt of silicon for forming a silicon ingot are disclosed. In some embodiments, the methods involve a porous crucible mold having a channel network with a bottom channel, an outer sidewall channel that extends from the bottom channel, and a central weir channel that extends from the bottom channel. A slip slurry may be added to the channel network and the liquid carrier of the slip slurry may be drawn into the mold. The resulting green body may be sintered to form the crucible assembly.
SILICON CARBON COMPOSITES COMPRISING ULTRA LOW Z
Silicon-carbon composite materials and related processes are disclosed that overcome the challenges for providing amorphous nano-sized silicon entrained within porous carbon. Compared to other, inferior materials and processes described in the prior art, the materials and processes disclosed herein find superior utility in various applications, including energy storage devices such as lithium ion batteries.
SILICON CARBON COMPOSITES COMPRISING ULTRA LOW Z
Silicon-carbon composite materials and related processes are disclosed that overcome the challenges for providing amorphous nano-sized silicon entrained within porous carbon. Compared to other, inferior materials and processes described in the prior art, the materials and processes disclosed herein find superior utility in various applications, including energy storage devices such as lithium ion batteries.
SILICON CARBON COMPOSITES COMPRISING ULTRA LOW Z
Silicon-carbon composite materials and related processes are disclosed that overcome the challenges for providing amorphous nano-sized silicon entrained within porous carbon. Compared to other, inferior materials and processes described in the prior art, the materials and processes disclosed herein find superior utility in various applications, including energy storage devices such as lithium ion batteries.
MATCHED CHEMISTRY COMPONENT BODY AND COATING FOR SEMICONDUCTOR PROCESSING CHAMBER
A component for use in a semiconductor processing chamber is provided. A component body of a dielectric material has a semiconductor processing facing surface. A coating of a dielectric material is on at least the semiconductor processing facing surface, wherein the dielectric material of the component body has a same stoichiometry as the dielectric material of the coating.
MATCHED CHEMISTRY COMPONENT BODY AND COATING FOR SEMICONDUCTOR PROCESSING CHAMBER
A component for use in a semiconductor processing chamber is provided. A component body of a dielectric material has a semiconductor processing facing surface. A coating of a dielectric material is on at least the semiconductor processing facing surface, wherein the dielectric material of the component body has a same stoichiometry as the dielectric material of the coating.
System and method for detecting defects in a honeycomb body
Defect detection systems include at least one nozzle for delivering a CO.sub.2 particulate fluid to an inlet end of a plugged honeycomb body. Defects in the honeycomb, if any, are determined by monitoring CO.sub.2 particulate flow at the outlet end of the honeycomb body. Methods for detecting defects in plugged honeycomb bodies are also disclosed.