The present invention relates to a hydrochromic polydiacetylene composite composition, a hydrochromic thin film using same, and a use thereof, and more specifically, to a hydrochromic polydiacetylene composite composition reacting sensitively to moisture, providing the hydrochromic thin film using same, and to applying same to biorecognition or fingerprint recognition. According to the present invention, moisture secreted from a fingerprint or pores on the skin can be detected with high sensitivity. Thus, the position of pores unique to a fingerprint of an organism can be amplified and displayed through selective color change and fluorescent change patterns exhibited when moisture is absorbed.

A lacquer composition is provided, comprising 20%-79.9% by weight, based on the total weight of the composition, of a thiol compound having two or more thiol groups, 20%-79.9% by weight, based on the total weight of the composition, of a compound having two or more carbon-carbon double bonds and 0.1%-10% by weight, based on the total weight of the composition, of a separating agent having an alkyl radical having 4-20 carbon atoms, where the alkyl radical is unsubstituted or fluorine-substituted and the alkyl radical is bonded to a functional group. Also provided are the use of this lacquer composition as a protective lacquer on an optical surface of an optical element in the production of the optical element, and an optical element comprising the protective lacquer.

A compound including two or more partial structures shown by the following general formula (1-1) in the molecule,

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wherein each Ar independently represents an aromatic ring optionally having a substituent or an aromatic ring that contains at least one nitrogen atom optionally having a substituent, and two Ars are optionally bonded with each other to form a ring structure; the broken line represents a bond with an organic group; B represents an anionic leaving group that is capable of forming a reactive cation due to effect of either or both of heat and acid. This provides a compound that is capable of curing under the film forming conditions in air or an inert gas without forming byproducts, and forming an organic under layer film that has good dry etching durability during substrate processing not only excellent characteristics of gap filling and planarizing a pattern formed on a substrate.

A new class of cost-effective carbon fiber precursors that comprise both hydrocarbon polymer and Pitch structural features in the same polymer structure to exhibit complementary advantages of both PAN- and Pitch-based carbon fiber precursors. The new class of carbon fiber precursors comprise a polymeric pitch copolymer, wherein the polymeric pitch copolymer includes a polymer chain and several pitch polycyclic aromatic hydrocarbon (PAH) molecules grafted or chemically bonded to the polymer chain. Method and processes for the creation of the new class of carbon fiber precursors are also presented, wherein said methods may comprise a thermally-induced coupling and extrusion step.

A resist underlayer film material used in multilayer resist method contains (A) compound shown by following general formula (1), and (B) organic solvent, where X independently represents monovalent organic group shown by following general formula (2); W contains an m number of partial structures each independently shown by following formula (3); m and n each represent an integer of 1 to 10; broken lines represent bonding arms; Z represents aromatic group; A represents single bond or O(CH.sub.2).sub.p; k represents integer of 1 to 5; p represents integer of 1 to 10; R.sup.01 represents hydrogen atom or monovalent organic group having 1 to 10 carbon atoms. Material is capable of forming resist underlayer film excellent in planarizing property in fine patterning process by multilayer resist method in semiconductor-device manufacturing process; and patterning processes and methods for forming resist underlayer film use material. ##STR00001##

A resist underlayer film material used in multilayer resist method contains (A) compound shown by following general formula (1), and (B) organic solvent, where X independently represents monovalent organic group shown by following general formula (2); W contains an m number of partial structures each independently shown by following formula (3); m and n each represent an integer of 1 to 10; broken lines represent bonding arms; Z represents aromatic group; A represents single bond or O(CH.sub.2).sub.p; k represents integer of 1 to 5; p represents integer of 1 to 10; R.sup.01 represents hydrogen atom or monovalent organic group having 1 to 10 carbon atoms. Material is capable of forming resist underlayer film excellent in planarizing property in fine patterning process by multilayer resist method in semiconductor-device manufacturing process; and patterning processes and methods for forming resist underlayer film use material. ##STR00001##

Embodiments of the invention relate to a resin composition, in particular suitable for printing, a kit comprising components of the resin composition, printing methods, a polymer obtained by the printing methods, an article comprising or formed from the polymer, uses thereof, and a composition. The resin composition comprises at least one compound C1 having at least one terminal alkyne functional group; at least one compound C2 having at least two thiol functional groups; at least one compound C3 having at least one carbon-carbon double bond; at least one photoinitiator; and at least one stabilizer.

Embodiments of the invention relate to a resin composition, in particular suitable for printing, a kit comprising components of the resin composition, printing methods, a polymer obtained by the printing methods, an article comprising or formed from the polymer, uses thereof, and a composition. The resin composition comprises at least one compound C1 having at least one terminal alkyne functional group; at least one compound C2 having at least two thiol functional groups; at least one compound C3 having at least one carbon-carbon double bond; at least one photoinitiator; and at least one stabilizer.

Provided are a novel water-soluble diacetylene monomer, a composition for photolithography including the novel water-soluble diacetylene monomer and a conductive polymer, and a method of forming micropatterns using the composition. The water-soluble diacetylene monomer may not aggregate even when mixed with a water-soluble conductive polymer. Accordingly, a uniform composition for photolithography can be prepared by mixing a water-soluble conductive polymer with the diacetylene monomer, and micropatterns can be formed using the composition. More particularly, when the composition is formed into a thin film and then is irradiated with light, only light-irradiated portions of the diacetylene monomer are selectively crosslinked due to photopolymerization, thereby resulting in insoluble negative-type micropatterns.

Disclosed are saturated cyclic monopolymers derived from hexyne, octyne, nonyne, pentadecyne and saturated cyclic copolymers derived from acetylene and a second alkyne monomer that is hexyne, octyne, nonyne, or pentadecyne.