A polymer composition that operates as a polymer compatibilizer is provided. The polymer composition includes a plurality of polymer backbones cross-linked by cross-links that are Diels-Alder reaction products of at least one dienophile-containing moiety and at least one diene-containing moiety.

A polymer composition that operates as a polymer compatibilizer is provided. The polymer composition includes a plurality of polymer backbones cross-linked by cross-links that are Diels-Alder reaction products of at least one dienophile-containing moiety and at least one diene-containing moiety.

The present invention relates to a fluorescently-tagged (co)polymer useful as a scale inhibitor in industrial water systems. Said (co)polymer comprises a (i) reactive fluorescent compound selected from a diazole compound (ii) at least one monoethylenically unsaturated acid monomer, and (iii) optionally, at least one monoethylenically unsaturated acid-free monomer.

The present application relates to a circularly polarizing plate and a use thereof. The present application can provide a circularly polarizing plate, which can be applied to a display device such as an organic light emitting display device to minimize blocking of light in the visible light region affecting image quality while blocking harmful ultraviolet rays appropriately and also has excellent durability. In addition, the present application can provide a circularly polarizing plate having excellent compensation characteristics at a viewing angle while ensuring process simplification and cost competitiveness.

A resin composition includes 100 parts by weight of a fluorine-containing compound and 1 part by weight to 15 parts by weight of a compound of Formula (1); in Formula (1), m and n are individually an integer of 10 to 100; and the fluorine-containing compound includes tetrafluoroethylene homopolymer, perfluoroalkoxy alkane or a combination thereof. Moreover, also provided is an article made from the resin composition, which comprises a prepreg, a resin film, a laminate or a printed circuit board, wherein the article achieves improvement in at least one of the following properties: dielectric constant, dissipation factor, Z-axis coefficient of thermal expansion, MIT bending resistance and tensile strength.

##STR00001##

A resin composition includes 100 parts by weight of a fluorine-containing compound and 1 part by weight to 15 parts by weight of a compound of Formula (1); in Formula (1), m and n are individually an integer of 10 to 100; and the fluorine-containing compound includes tetrafluoroethylene homopolymer, perfluoroalkoxy alkane or a combination thereof. Moreover, also provided is an article made from the resin composition, which comprises a prepreg, a resin film, a laminate or a printed circuit board, wherein the article achieves improvement in at least one of the following properties: dielectric constant, dissipation factor, Z-axis coefficient of thermal expansion, MIT bending resistance and tensile strength.

##STR00001##

Disclosed are a photosensitive polymer including a repeating unit of Chemical Formula 1 or Chemical Formula 2 derived from a vinyl heteroaromatic compound and a resist composition including the same.

##STR00001##

In Chemical Formula 1 or 2, R.sup.1 and R.sup.2 are hydrogen or a methyl group, X is a carbon, sulfur, or a nitrogen atom, and n is 1 or 2.

Disclosed are a photosensitive polymer including a repeating unit of Chemical Formula 1 or Chemical Formula 2 derived from a vinyl heteroaromatic compound and a resist composition including the same.

##STR00001##

In Chemical Formula 1 or 2, R.sup.1 and R.sup.2 are hydrogen or a methyl group, X is a carbon, sulfur, or a nitrogen atom, and n is 1 or 2.

A resin composition includes 100 parts by weight of a fluorine-containing compound and 1 part by weight to 15 parts by weight of a compound of Formula (1); in Formula (1), m and n are individually an integer of 10 to 100; and the fluorine-containing compound includes tetrafluoroethylene homopolymer, perfluoroalkoxy alkane or a combination thereof. Moreover, also provided is an article made from the resin composition, which comprises a prepreg, a resin film, a laminate or a printed circuit board, wherein the article achieves improvement in at least one of the following properties: dielectric constant, dissipation factor, Z-axis coefficient of thermal expansion, MIT bending resistance and tensile strength. ##STR00001##

A resin composition includes 100 parts by weight of a fluorine-containing compound and 1 part by weight to 15 parts by weight of a compound of Formula (1); in Formula (1), m and n are individually an integer of 10 to 100; and the fluorine-containing compound includes tetrafluoroethylene homopolymer, perfluoroalkoxy alkane or a combination thereof. Moreover, also provided is an article made from the resin composition, which comprises a prepreg, a resin film, a laminate or a printed circuit board, wherein the article achieves improvement in at least one of the following properties: dielectric constant, dissipation factor, Z-axis coefficient of thermal expansion, MIT bending resistance and tensile strength. ##STR00001##