Patent classifications
C08F224/00
Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device
An actinic ray-sensitive or radiation-sensitive resin composition includes a resin having a repeating unit having a group in which a phenolic hydroxyl group is protected with an acid-leaving group; a first photoacid generator that generates an acid having a pKa of ?2.00 to 2.00, in which in a case where the acid thus generated is a carboxylic acid, a pKa of the carboxylic acid is ?2.00 or more and less than 1.00; and a second photoacid generator that generates a carboxylic acid having a pKa of 1.00 or more.
Organic additives and compositions containing the same
Compositions are provided which may comprise a plurality of organic additive particles, the particles comprising a polymerization product of reactants comprising a dioxane/dioxolane monomer and a vinyl co-monomer, wherein the dioxane/dioxolane monomer is an ester of (meth)acrylic acid with an alcohol comprising a dioxane moiety, an ester of (meth)acrylic acid with an alcohol comprising a dioxolane moiety, or both. Toner and additive manufacturing compositions comprising the organic additive particles are also provided.
Organic additives and compositions containing the same
Compositions are provided which may comprise a plurality of organic additive particles, the particles comprising a polymerization product of reactants comprising a dioxane/dioxolane monomer and a vinyl co-monomer, wherein the dioxane/dioxolane monomer is an ester of (meth)acrylic acid with an alcohol comprising a dioxane moiety, an ester of (meth)acrylic acid with an alcohol comprising a dioxolane moiety, or both. Toner and additive manufacturing compositions comprising the organic additive particles are also provided.
Latexes with pH responsive resin particles
Latexes are provided which may comprise water and resin particles comprising a polymerization product of reactants comprising a dioxane/dioxolane monomer and an additional monomer, wherein the dioxane/dioxolane monomer is an ester of (meth)acrylic acid with an alcohol comprising a dioxane moiety, an ester of (meth)acrylic acid with an alcohol comprising a dioxolane moiety, or both.
Latexes with pH responsive resin particles
Latexes are provided which may comprise water and resin particles comprising a polymerization product of reactants comprising a dioxane/dioxolane monomer and an additional monomer, wherein the dioxane/dioxolane monomer is an ester of (meth)acrylic acid with an alcohol comprising a dioxane moiety, an ester of (meth)acrylic acid with an alcohol comprising a dioxolane moiety, or both.
Polymer, resist composition, and pattern forming process
A polymer comprising recurring units having an acid generator bound to the backbone, and recurring units having an optionally acid labile group-substituted carboxyl group and/or recurring units having an optionally acid labile group-substituted hydroxyl group is obtained by polymerizing corresponding monomers under such illumination that the quantity of light of wavelength up to 400 nm is up to 0.05 mW/cm.sup.2. The polymer avoids photo-decomposition of the acid generator during polymerization and concomitant deprotection reaction of the acid labile group when used in positive resist compositions. A pattern with high dissolution contrast and rectangularity is formed after development.
Polymer, resist composition, and pattern forming process
A polymer comprising recurring units having an acid generator bound to the backbone, and recurring units having an optionally acid labile group-substituted carboxyl group and/or recurring units having an optionally acid labile group-substituted hydroxyl group is obtained by polymerizing corresponding monomers under such illumination that the quantity of light of wavelength up to 400 nm is up to 0.05 mW/cm.sup.2. The polymer avoids photo-decomposition of the acid generator during polymerization and concomitant deprotection reaction of the acid labile group when used in positive resist compositions. A pattern with high dissolution contrast and rectangularity is formed after development.
METHOD FOR PRODUCING RESIN AND METHOD FOR PRODUCING ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE COMPOSITION
By a method for producing a resin, a resin containing a repeating unit represented by General Formula (1) and a repeating unit containing a group that decomposes by the action of an acid to generate a polar group is produced, and the method includes a first step of obtaining a resin precursor containing a repeating unit represented by General Formula (2) and the repeating unit containing a group that decomposes by the action of an acid to generate a polar group, and a second step of obtaining the repeating unit represented by General Formula (1) by deprotecting a group represented by OY in the repeating unit represented by General Formula (2) in the resin precursor with an acid or a base.
Chemically amplified resist composition and patterning process
A chemically amplified resist composition comprising a quencher containing an iodonium iodide and an acid generator exhibits a sensitizing effect and an acid diffusion suppressing effect and forms a pattern having improved resolution, LWR and CDU.
Chemically amplified resist composition and patterning process
A chemically amplified resist composition comprising a quencher containing an iodonium iodide and an acid generator exhibits a sensitizing effect and an acid diffusion suppressing effect and forms a pattern having improved resolution, LWR and CDU.