An underwater pelletizing method for pelletizing brittle hydrocarbon resins with low melt viscosity. A feed material comprising the hydrocarbon resin is formed into a melt, extruded through a die into a water bath below the Tg of the hydrocarbon resin to form a plurality of extrudates and cut adjacent the die surface to form a slurry of resin pellets. A graft monomer and/or other reactants, such as a hydrosilylation agent, may be introduced into the resin melt to chemically modify the hydrocarbon resin.

A polymer compound represented by formula (1). In formula (1), R.sub.1 and R.sub.2 each independently represent a hydrogen atom or a methyl group. In formula (1), m and n are average numbers of repeating units, and each independently represent a real number within the range of 1 to 2000. The polymer compound has sufficient flexibility to be able to form a film, exhibits high adhesion to a low roughness copper foil, and has a low dielectric constant and dielectric loss tangent. ##STR00001##

A polymer compound represented by formula (1). In formula (1), R.sub.1 and R.sub.2 each independently represent a hydrogen atom or a methyl group. In formula (1), m and n are average numbers of repeating units, and each independently represent a real number within the range of 1 to 2000. The polymer compound has sufficient flexibility to be able to form a film, exhibits high adhesion to a low roughness copper foil, and has a low dielectric constant and dielectric loss tangent. ##STR00001##

A prepolymer and a resin composition containing the prepolymer are provided. The prepolymer is obtained from a prepolymerization reaction of a mixture, the mixture at least including dicyclopentadiene-ethylidenenorbornene copolymer and acenaphthylene in a weight ratio of between 1:1 and 5:1. The resin composition may be used to make various articles, including a resin film, a prepreg, a laminate or a printed circuit board, and at least one of the following properties can be improved, including dielectric constant, dissipation factor, copper foil peeling strength, X-axis coefficient of thermal expansion and glass transition temperature.

A prepolymer and a resin composition containing the prepolymer are provided. The prepolymer is obtained from a prepolymerization reaction of a mixture, the mixture at least including dicyclopentadiene-ethylidenenorbornene copolymer and acenaphthylene in a weight ratio of between 1:1 and 5:1. The resin composition may be used to make various articles, including a resin film, a prepreg, a laminate or a printed circuit board, and at least one of the following properties can be improved, including dielectric constant, dissipation factor, copper foil peeling strength, X-axis coefficient of thermal expansion and glass transition temperature.

A prepolymer and a resin composition containing the prepolymer are provided. The prepolymer is obtained from a prepolymerization reaction of a mixture, the mixture at least including dicyclopentadiene-ethylidenenorbornene copolymer and acenaphthylene in a weight ratio of between 1:1 and 5:1. The resin composition may be used to make various articles, including a resin film, a prepreg, a laminate or a printed circuit board, and at least one of the following properties can be improved, including dielectric constant, dissipation factor, copper foil peeling strength, X-axis coefficient of thermal expansion and glass transition temperature.

The disclosure provides small molecule compounds, polymers, and compositions thereof, as well as methods for preparing such polymers and compositions. Also provided is a method of using the polymers or compositions thereof for binding uric acid or precursor thereof, and/or for treating hyperuricemia, gout, and/or diseases caused by hyperuricemia.

The disclosure provides small molecule compounds, polymers, and compositions thereof, as well as methods for preparing such polymers and compositions. Also provided is a method of using the polymers or compositions thereof for binding uric acid or precursor thereof, and/or for treating hyperuricemia, gout, and/or diseases caused by hyperuricemia.

There is provided a photosensitive resin composition that contains (A) a photopolymerizable compound having an ethylenically unsaturated group, (X) organic particles, and (B) a photopolymerization initiator, in which the photopolymerizable compound (A) having an ethylenically unsaturated group contains (A1) a photopolymerizable compound having an acidic substituent and an alicyclic structure together with an ethylenically unsaturated group. There is provided a photosensitive resin film and a photosensitive resin film for interlayer insulating layer, each of which contains the photosensitive resin composition. There is provided a multilayer printed wiring board and a semiconductor package. There is further provided a method for producing the multilayer printed wiring board.

There is provided a photosensitive resin composition that contains (A) a photopolymerizable compound having an ethylenically unsaturated group, (X) organic particles, and (B) a photopolymerization initiator, in which the photopolymerizable compound (A) having an ethylenically unsaturated group contains (A1) a photopolymerizable compound having an acidic substituent and an alicyclic structure together with an ethylenically unsaturated group. There is provided a photosensitive resin film and a photosensitive resin film for interlayer insulating layer, each of which contains the photosensitive resin composition. There is provided a multilayer printed wiring board and a semiconductor package. There is further provided a method for producing the multilayer printed wiring board.