A resin composition has a viscosity of equal to or less than about 20 mPa.Math.s at a temperature in a range of about 30° C. to about 50° C. as measured according to JIS Z8803, a storage modulus in a range of about 1.7×10.sup.5 Pa to about 3×10.sup.5 Pa at about −20° C., and a storage modulus in a range of about 1.5×10.sup.4 Pa to about 6×10.sup.4 Pa at about 25° C. An adhesive member formed of the resin composition is also provided.

Provided are a curable resin composition containing a compound represented by General Formula (1) and a component (B); and a cemented lens using the composition. Component (B): a polymer including a structural unit (bi) having an aromatic ring and a structural unit (b2) having a hydrogen bonding group, in which a proportion of the structural unit (b1) in all structural units constituting the polymer is 10% by mass or more and a proportion of the structural unit (b2) in all structural units constituting the polymer is 3% by mass or more, where the structural unit (bi) has no hydrogen bonding group.

Pol.sup.1-Sp.sup.a-L.sup.1-Ar-L.sup.2-Sp.sup.b-Pol.sup.2  General Formula (1)

Ar represents an aromatic ring group represented by a specific formula, L.sup.1, L.sup.2, Sp.sup.a, and Sp.sup.b represent a single bond or a specific group, and Pol.sup.1 and Pol.sup.2 represent a polymerizable group.

This disclosure relates to modified polyurethanes, specifically polyurethanes modified with one or more lipophilic groups, and tough organogels comprising such modified polyurethanes.

Polymerizable liquids are described herein which, in some embodiments, can produce 3D printed articles of high resolution and desirable mechanical properties. In one aspect, a polymerizable liquid comprises an acrylate component, a polymeric additive, and a monomeric curing agent, wherein the acrylate component and monomeric curing agent are copolymerizable upon exposure to light. In being copolymerizable, the acrylate component and monomeric curing agent can form a copolymer. As described father herein, the monomeric curing agent can enable further reaction of the copolymer with one or more crosslinking species to link the copolymer with one more polymeric networks.

The present invention relates to a curable composition comprising a curable cyanoacrylate component and at least one thermoplastic polyurethane (TPU) component. The compositions of the invention are non-flowable at room temperature (25° C.) and are suitable for use as adhesive compositions, for example in a tape form.

Methods and formulations for manufacturing polishing articles used in polishing processes are provided. In one implementation, a UV curable resin precursor composition is provided. The UV curable resin precursor comprises a precursor formulation. The precursor formulation comprises a first resin precursor component that comprises a semi-crystalline radiation curable oligomeric material, wherein the semi-crystalline radiation curable oligomeric material is selected from a semi-crystalline aliphatic polyester urethane acrylate, a semi-crystalline aliphatic polycarbonate urethane acrylate, a semi-crystalline aliphatic polyether urethane acrylate, or combinations thereof. The precursor formulation further comprises a second resin precursor component that comprises a monofunctional or multifunctional acrylate monomer. The resin precursor formulation further comprises a photoinitiator, wherein the precursor formulation has a viscosity that enables the precursor formulation to be dispensed to form a portion of a polishing article by an additive manufacturing process.

The present invention relates to an aromatic poly(amide-imide) copolymer film having high retardation in the thickness direction and exhibiting a low moisture absorption rate, and a method for preparing the same.

The present invention relates to an aromatic poly(amide-imide) copolymer film having high retardation in the thickness direction and exhibiting a low moisture absorption rate, and a method for preparing the same.

A prepolymer is prepared by subjecting a compound of Formula (I) and a vinyl-containing compound to a prepolymerization reaction, and a resin composition includes the prepolymer. The vinyl-containing compound includes bis(vinylphenyl) ethane, divinylbenzene, modification of divinylbenzene or a combination thereof. A ratio in part by weight of the compound of Formula (I) to the vinyl-containing compound in the prepolymerization reaction is 8:2 to 6:4. The resin composition includes the prepolymer and an additive, and an article made from the resin composition may include a resin film, a prepreg, a laminate or a printed circuit board.

A prepolymer is prepared by subjecting a compound of Formula (I) and a vinyl-containing compound to a prepolymerization reaction, and a resin composition includes the prepolymer. The vinyl-containing compound includes bis(vinylphenyl) ethane, divinylbenzene, modification of divinylbenzene or a combination thereof. A ratio in part by weight of the compound of Formula (I) to the vinyl-containing compound in the prepolymerization reaction is 8:2 to 6:4. The resin composition includes the prepolymer and an additive, and an article made from the resin composition may include a resin film, a prepreg, a laminate or a printed circuit board.