Disclosed is a graft copolymer containing a polyfluorene-based polymer as a main chain and a polyvinylidene fluoride (PVDF) as a side chain, and an element including the same. The graft copolymer contains both the polyfluorene-based polymer and the PVDF, so that the graft copolymer may increase miscibility between polymers to prepare a composite having excellent performance, prepare an uniform thin film through a solution process, and be used as a single material that exhibits both piezoelectric properties and luminescence properties.

A composition and a method for manufacturing the composition are provided that includes a thermoplastic polyurethane (TPU) and a second component in an amount in the range of about 3% to about 60% by weight of the composition. The second component includes at least one reactive diluent, monomer, or oligomer (RDMO). The RDMO and/or the TPU may be cross-linked to form a semi-interpenetrating polymer network or an interpenetrating polymer network. The RDMO provides improved physical properties, such as rigidity, durability and strength, to the TPU. The polymer network may be bonded to other layers for certain applications, such as windows and flooring, to improve flexibility and strength, inhibit shattering and/or resist scratching and staining.

The present invention relates to a polymerisable composition for bonding fibre units, in particular linear textiles such as filaments, yarns, twines or ropes, comprising at least one prepolymer having at least two polymerisable vinylidene groups, such as a polyurethane having at least two (meth)acrylate groups, at least one photoinitiator and at least one compound having at least one polymerisable vinylidene group with a weight average molecular weight of 70-800 g/mol. In addition, the present invention relates to a process for bonding fibre units, comprising applying the composition according to the invention to at least one fibre unit such as a filament, yarn, twine or rope and irradiation of the fibre unit thus obtained with radiation having a wavelength in the range of, for example, 100-450 nm.

A prepolymer is prepared by subjecting a compound of Formula (I) and a vinyl-containing compound to a prepolymerization reaction, and a resin composition includes the prepolymer. The vinyl-containing compound includes bis(vinylphenyl) ethane, divinylbenzene, modification of divinylbenzene or a combination thereof. A ratio in part by weight of the compound of Formula (I) to the vinyl-containing compound in the prepolymerization reaction is 8:2 to 6:4. The resin composition includes the prepolymer and an additive, and an article made from the resin composition may include a resin film, a prepreg, a laminate or a printed circuit board.

A prepolymer is prepared by subjecting a compound of Formula (I) and a vinyl-containing compound to a prepolymerization reaction, and a resin composition includes the prepolymer. The vinyl-containing compound includes bis(vinylphenyl) ethane, divinylbenzene, modification of divinylbenzene or a combination thereof. A ratio in part by weight of the compound of Formula (I) to the vinyl-containing compound in the prepolymerization reaction is 8:2 to 6:4. The resin composition includes the prepolymer and an additive, and an article made from the resin composition may include a resin film, a prepreg, a laminate or a printed circuit board.

A resin composition has a viscosity of equal to or less than about 20 mPa.Math.s at a temperature in a range of about 30° C. to about 50° C. as measured according to JIS Z8803, a storage modulus in a range of about 1.7×10.sup.5 Pa to about 3×10.sup.5 Pa at about −20° C., and a storage modulus in a range of about 1.5×10.sup.4 Pa to about 6×10.sup.4 Pa at about 25° C. An adhesive member formed of the resin composition is also provided.

A resin composition has a viscosity of equal to or less than about 20 mPa.Math.s at a temperature in a range of about 30° C. to about 50° C. as measured according to JIS Z8803, a storage modulus in a range of about 1.7×10.sup.5 Pa to about 3×10.sup.5 Pa at about −20° C., and a storage modulus in a range of about 1.5×10.sup.4 Pa to about 6×10.sup.4 Pa at about 25° C. An adhesive member formed of the resin composition is also provided.

Polymerizable liquids are described herein which, in some embodiments, can produce 3D printed articles of high resolution and desirable mechanical properties. In one aspect, a polymerizable liquid comprises an acrylate component, a polymeric additive, and a monomeric curing agent, wherein the acrylate component and monomeric curing agent are copolymerizable upon exposure to light. In being copolymerizable, the acrylate component and monomeric curing agent can form a copolymer. As described father herein, the monomeric curing agent can enable further reaction of the copolymer with one or more crosslinking species to link the copolymer with one more polymeric networks.

Polymerizable liquids are described herein which, in some embodiments, can produce 3D printed articles of high resolution and desirable mechanical properties. In one aspect, a polymerizable liquid comprises an acrylate component, a polymeric additive, and a monomeric curing agent, wherein the acrylate component and monomeric curing agent are copolymerizable upon exposure to light. In being copolymerizable, the acrylate component and monomeric curing agent can form a copolymer. As described father herein, the monomeric curing agent can enable further reaction of the copolymer with one or more crosslinking species to link the copolymer with one more polymeric networks.

The present invention relates to a polymer complex obtained by inverse emulsion polymerization of water-soluble monomers: in the presence of a cationic water-soluble host polymer comprising amine functions.