A dual curable composition is provided, comprising a compound represented by formula (I):
(acrylate).sub.a-(A)-(silane).sub.b(I)
in which a and b are identical or different and are each represented by an integer greater than or equal to 1; and wherein the dual curable composition is radiation curable and/or moisture curable. The moiety A comprises at least one of an aliphatic hydrocarbon, a cycloaliphatic hydrocarbon, an aryl moiety, an ether, an ester, an amide, a urethane, a urea, a hydroxyl group-containing organic moiety, an acrylic oligomer, an epoxy oligomer, a urethane oligomer, a polyester oligomer, or mixtures thereof, and the dual curable composition has a molecular weight greater than or equal to 300.

The present disclosure provides a curable casting resin precursor, comprising (a) a first part (A) comprising: (a1) at least one epoxy resin; (b) a second part (B) comprising: (b1) at least one first amine-based epoxy curing agent; (b2) optionally, at least one second amine-based epoxy curing agent; (b3) at least one mineral filler; (b4) at least one phenolic lipid; wherein part (A) and/or part (B) comprise at least one triphenylmethane dye. The curable casting resin precursor is suited for encapsulating metal parts such as cable joints and the like.

A curative system comprising a combination of adipic acid dihydrazide and/or isophthalic dihydrazide and a clathrate in which the guest compound of the clathrate comprises an imidazole, an imidazoline or diazabicycloalkanes (DBCA).

A curative system comprising a combination of adipic acid dihydrazide and/or isophthalic dihydrazide and a clathrate in which the guest compound of the clathrate comprises an imidazole, an imidazoline or diazabicycloalkanes (DBCA).

Low molecular weight, high Tg resins, with applications including tire additives and adhesives. An oligomer is obtained by ring opening metathesis polymerization (ROMP) of a sterically encumbered cyclic monomer with an olefinic chain transfer agent. The sterically encumbered cyclic monomer and the olefinic chain transfer agent are present in the polymerization at a molar ratio of from 2:1 to about 40:1. Also, methods for making the oligomer by ROMP.

A curable epoxy composition comprises 100 parts by weight of an epoxy resin composition comprising one or more epoxy resins, each independently having an epoxy equivalent weight of at least 2; 30 to 200 parts by weight of an aromatic dianhydride curing agent of the formula

##STR00001##

wherein T and y are as provided herein; and 0.1 to 5 parts by weight of a heterocyclic accelerator, based on the total parts by weight of the epoxy resin composition and the aromatic dianhydride curing agent, wherein the heterocyclic accelerator comprises a substituted or unsubstituted C.sub.3-6 heterocycle comprising 1 to 4 ring heteroatoms, wherein each heteroatom is independently the same or different, and is nitrogen, oxygen, phosphorus, silicon, or sulfur, wherein the composition does not contain a monoanhydride curing agent.

A thermoset epoxy composition, comprising the cured product of a thermosetting epoxy composition comprising: 100 parts by weight of an epoxy resin composition comprising one or more epoxy resins, each independently having an epoxy equivalent weight of at least 2; 30-200 parts by weight of an aromatic dianhydride curing agent of the formula

##STR00001##

wherein T is as provided herein; and 0.1-5 parts by weight of a heterocyclic accelerator, based on the total parts by weight of the epoxy resin composition and the aromatic dianhydride curing agent, wherein the heterocyclic accelerator comprises a substituted or unsubstituted C.sub.3-6 heterocycle comprising 1-4 ring heteroatoms, wherein each heteroatom is independently the same or different, and is nitrogen, oxygen, phosphorus, silicon, or sulfur, wherein the aromatic dianhydride curing agent is soluble in the epoxy resin composition, and the curable epoxy composition does not contain a monoanhydride.

The present invention addresses the problem of providing a cationically curable resin composition having storage stability while maintaining photocurability and low-temperature (less than 100 C.) curability. The cationically curable resin composition can include component (A): a cationically polymerizable compound, component (B): a photo-cationic polymerization initiator, component (C): a thermal cationic polymerization initiator, and component (D): a compound having an isocyanuric ring. Also, the content of the component (D) can be 0.01 to 7 parts by mass per 100 parts by mass of the component (A).

The present invention addresses the problem of providing a cationically curable resin composition having storage stability while maintaining photocurability and low-temperature (less than 100 C.) curability. The cationically curable resin composition can include component (A): a cationically polymerizable compound, component (B): a photo-cationic polymerization initiator, component (C): a thermal cationic polymerization initiator, and component (D): a compound having an isocyanuric ring. Also, the content of the component (D) can be 0.01 to 7 parts by mass per 100 parts by mass of the component (A).

An exotherm stopper mixture for controlling the exotherm between epoxy-amine thermosetting resins and a hardener, comprising water, at least one high-boiling solvent, at least one exothermicity stopping reactant, and an excipient mixture comprising a surfactant, an emulsifier, a disperser, a co-solvent or a combination thereof.