The subject matter of the present application is a thermally expandable preparation that can be pumped at application temperatures below 70° C., containing (a) at least one first epoxy resin E1 that has an epoxy equivalent weight of at most 280 g/eq and a viscosity of at most 1250 Pa*s at 25° C., (b) at least one second epoxy resin E2 that has an epoxy equivalent weight of at least 300 g/eq and a viscosity of at most 250 Pa*s at 25° C., (c) at least one hardener that can be thermally activated, (d) at least one propellant that can be thermally activated, and (e) at least 1 wt. % of organic fibres having a fibre length of 0.2 mm to 10 mm.

Disclosed is a thermoplastic resin composition. Due to addition of the epoxy-based resin, the phosphorous-based flame retardant, the silicon-based compound and the calcium carbonate to the basic resin according to the present invention, a thermoplastic resin composition having superior flame retardancy and excellent rigidity, heat resistance and processability, and a molded article manufactured therefrom may be provided.

A method for manufacturing a semiconductor substrate that, even when a substrate which has, on a surface thereof, a three-dimensional structure having nanometer-scale microvoids on a surface thereof is used, can allow an impurity diffusion ingredient to be uniformly diffused into the substrate at the whole area thereof where the diffusion agent composition is coated, including the whole inner surfaces of the microvoids, while suppressing the occurrence of defects in the substrate. A coating film having a thickness of not more than 30 nm is formed on a surface of a substrate under such conditions that an atmosphere around the substrate has a relative humidity of not more than 40%, using a diffusion agent composition comprising an impurity diffusion ingredient and a Si compound that is hydrolyzable to produce a silanol group.

Provided is an epoxy-amine adduct that offers high reactivity, contributes to better adhesion between a resin and a reinforcing fiber in a fiber-reinforced composite material, and can be easily blended with another component such as a resin. The epoxy-amine adduct has two or more amino groups per molecule and is obtained by a reaction of an epoxy compound (A) having two or more alicyclic epoxy groups per molecule with an amine compound (B) having two or more amino groups per molecule. The epoxy compound (A) is preferably a compound represented by Formula (a): ##STR00001##

The present invention is directed to a novel complex synthesized from a Salen-type ligand. The novel complex contains a quaternary ammonium salt. The present invention is also directed to a preparation method of a copolymer of carbon dioxide and epoxide using the complex synthesized from a Salen-type ligand as a catalyst.

A photocurable polymer composition for use with a three dimensional printing process and a method of manufacture of such composition. The composition includes a photocurable resin and a filler and can be tunable to a desired dielectric constant. The filler comprises about 0 to about 30 weight percent of the composition.

Disclosed is a method for producing a biphenyl-skeleton-containing epoxy resin represented by Formula (1) described below including a step of allowing polyvalent hydroxy biphenyl obtained by a production step including a regioselective cross-coupling reaction to react with epihalohydrin. ##STR00001##
(In the formula, k1 and l1 each represent an integer of 0 to 4, m and n each represent an integer of 1 to 5, R.sup.1 and R.sup.2 each independently represent a hydrocarbon group having 1 to 10 carbon atoms which may have a substituent group, and R.sup.1 and R.sup.2 may be identical to each other or different from each other. (Provided that left and right phenyl structures of a biphenyl skeleton are different from each other.)

The invention relates to strong hydrogen-bond acidic sorbents. The sorbents may be provided in a form that limits or eliminates intramolecular bonding of the hydrogen-bond acidic site between neighboring sorbent molecules, for example, by providing steric groups adjacent to the hydrogen-bond acidic site. The hydrogen bond site may be a phenolic structure based on a bisphenol architecture. The sorbents of the invention may be used in methods for trapping or detecting hazardous chemicals or explosives.

The invention relates to strong hydrogen-bond acidic sorbents. The sorbents may be provided in a form that limits or eliminates intramolecular bonding of the hydrogen-bond acidic site between neighboring sorbent molecules, for example, by providing steric groups adjacent to the hydrogen-bond acidic site. The hydrogen bond site may be a phenolic structure based on a bisphenol architecture. The sorbents of the invention may be used in methods for trapping or detecting hazardous chemicals or explosives.

The present disclosure provides a curable casting resin precursor, comprising (a) a first part (A) comprising: (a1) at least one epoxy resin; (b) a second part (B) comprising: (b1) at least one first amine-based epoxy curing agent; (b2) optionally, at least one second amine-based epoxy curing agent; (b3) at least one mineral filler; (b4) at least one phenolic lipid; wherein part (A) and/or part (B) comprise at least one triphenylmethane dye. The curable casting resin precursor is suited for encapsulating metal parts such as cable joints and the like.