The invention relates to strong hydrogen-bond acidic sorbents. The sorbents may be provided in a form that limits or eliminates intramolecular bonding of the hydrogen-bond acidic site between neighboring sorbent molecules, for example, by providing steric groups adjacent to the hydrogen-bond acidic site. The hydrogen bond site may be a phenolic structure based on a bisphenol architecture. The sorbents of the invention may be used in methods for trapping or detecting hazardous chemicals or explosives.

The invention relates to strong hydrogen-bond acidic sorbents. The sorbents may be provided in a form that limits or eliminates intramolecular bonding of the hydrogen-bond acidic site between neighboring sorbent molecules, for example, by providing steric groups adjacent to the hydrogen-bond acidic site. The hydrogen bond site may be a phenolic structure based on a bisphenol architecture. The sorbents of the invention may be used in methods for trapping or detecting hazardous chemicals or explosives.

The invention relates to strong hydrogen-bond acidic sorbents. The sorbents may be provided in a form that limits or eliminates intramolecular bonding of the hydrogen-bond acidic site between neighboring sorbent molecules, for example, by providing steric groups adjacent to the hydrogen-bond acidic site. The hydrogen bond site may be a phenolic structure based on a bisphenol architecture. The sorbents of the invention may be used in methods for trapping or detecting hazardous chemicals or explosives.

The present invention provides a solvent-free varnish composition, including: a thermosetting resin (A) having two or more (meth)acryloyl groups in a molecule thereof; a thermosetting resin (B) having one or more epoxy groups in a molecule thereof; a monofunctional vinyl-based monomer having an ether bond or an ester bond; an organic peroxide having a 10-hour half-life temperature of 40° C. or more; and a curing catalyst for an epoxy resin, in which a mixed resin of the thermosetting resin (A) and the thermosetting resin (B) has an epoxy equivalent of from 500 to 5,000. The solvent-free varnish composition can be used as an insulating varnish that shows a small energy loss and requires a short curing time in its curing treatment step, and that provides a cured product that barely causes the precipitation of an oligomer or the like even when exposed to a refrigerant-based environment containing a refrigerant and a refrigerating machine oil under high temperature and high pressure.

The present invention provides a solvent-free varnish composition, including: a thermosetting resin (A) having two or more (meth)acryloyl groups in a molecule thereof; a thermosetting resin (B) having one or more epoxy groups in a molecule thereof; a monofunctional vinyl-based monomer having an ether bond or an ester bond; an organic peroxide having a 10-hour half-life temperature of 40° C. or more; and a curing catalyst for an epoxy resin, in which a mixed resin of the thermosetting resin (A) and the thermosetting resin (B) has an epoxy equivalent of from 500 to 5,000. The solvent-free varnish composition can be used as an insulating varnish that shows a small energy loss and requires a short curing time in its curing treatment step, and that provides a cured product that barely causes the precipitation of an oligomer or the like even when exposed to a refrigerant-based environment containing a refrigerant and a refrigerating machine oil under high temperature and high pressure.

An ink composition including an epoxy resin, and an amine curing agent. The epoxy resin is formed by reacting a bifunctional epoxy monomer, an adipic acid, and a polyisocyanate. The ink composition is formed by mixing the epoxy resin and the amine curing agent. The preparing of the epoxy resin includes mixing an epoxy functional monomer and an adipic acid to form an epoxy intermediate, and mixing the epoxy intermediate with a polyisocyanate to form the epoxy resin.

An ink composition including an epoxy resin, and an amine curing agent. The epoxy resin is formed by reacting a bifunctional epoxy monomer, an adipic acid, and a polyisocyanate. The ink composition is formed by mixing the epoxy resin and the amine curing agent. The preparing of the epoxy resin includes mixing an epoxy functional monomer and an adipic acid to form an epoxy intermediate, and mixing the epoxy intermediate with a polyisocyanate to form the epoxy resin.

Compositions including a thermosetting polymer network and a mechanophore covalently bonded to the thermosetting polymer network are provided. Substrates including the compositions are provided. In addition, methods of making the compositions and methods of monitoring stress on a substrate comprising the compositions are provided.

Provided is a maleimide resin with superior solution stability. Also provided is a cured product with a superior dielectric characteristic that is obtained by curing a curable resin composition in which said maleimide resin is used. The maleimide resin expressed in formula (1). (In formula (1), each of the plurality of Rs independently represents a C1-5 alkyl group, n is the number of repetitions, and the average value thereof is 1<n<5.)

Low molecular weight, high Tg resins, with applications including tire additives and adhesives. An oligomer is obtained by ring opening metathesis polymerization (ROMP) of a sterically encumbered cyclic monomer with an olefinic chain transfer agent. The sterically encumbered cyclic monomer and the olefinic chain transfer agent are present in the polymerization at a molar ratio of from 2:1 to about 40:1. Also, methods for making the oligomer by ROMP.