A curative system comprising a combination of adipic acid dihydrazide and/or isophthalic dihydrazide and a clathrate in which the guest compound of the clathrate comprises an imidazole, an imidazoline or diazabicycloalkanes (DBCA).

Compositions including a thermosetting polymer network and a mechanophore covalently bonded to the thermosetting polymer network are provided. Substrates including the compositions are provided. In addition, methods of making the compositions and methods of monitoring stress on a substrate comprising the compositions are provided.

A one-component thermosetting epoxy resin includes compositions that are particularly suitable for the bonding of substrates having different coefficients of thermal expansion, especially in the shell construction of modes of transport or white goods. The one-component thermosetting epoxy resin composition includes a) at least one epoxy resin A having an average of more than one epoxy group per molecule; b) at least one 2,4-diamino-1,3,5-triazine GU containing, in the 6 position, —an alkyl radical having 1 to 20 carbon atoms, in which one hydrogen atom in the α position has been replaced by a 2,4-diamino-1,3,5-triazin-6-yl radical, a cycloalkyl radical having 5 to 12 carbon atoms or -an aryl radical having 6 to 12 carbon atoms; and c) at least one toughness improver D, which is a terminally blocked polyurethane polymer D1.

An epoxy composition, a composite thereof, and an article including the same, in which the reactivity of the epoxy resin having an alkoxysilyl group is improved by a specific acrylic-based polymer resin, are provided. According to the present disclosure, an epoxy composition comprising an epoxy resin having an alkoxysilyl group, an acrylic-based polymer resin, and an inorganic filler, a composite thereof, and an article including the same are provided. The epoxy composition of the present disclosure shows an excellent thermal expansion property in a composite, and may be used in manufacture of semiconductor packaging and/or electrical and electronic components.

An epoxy composition, a composite thereof, and an article including the same, in which the reactivity of the epoxy resin having an alkoxysilyl group is improved by a specific acrylic-based polymer resin, are provided. According to the present disclosure, an epoxy composition comprising an epoxy resin having an alkoxysilyl group, an acrylic-based polymer resin, and an inorganic filler, a composite thereof, and an article including the same are provided. The epoxy composition of the present disclosure shows an excellent thermal expansion property in a composite, and may be used in manufacture of semiconductor packaging and/or electrical and electronic components.

An outdoor electrical apparatus (10) and methodology for manufacturing such apparatus are provided. The apparatus includes an electrical device (12), and an encapsulation housing system including a main encapsulant (11a) and an outer housing (11b). The main encapsulant may be arranged to encapsulate the electrical device, and the outer housing may be arranged to selectively encase surfaces of the main encapsulant based on an extent to which the surfaces of the main encapsulant otherwise would be subject to outdoor exposure. The main encapsulant comprises a bisphenol epoxy resin, and the outer housing comprises a cycloaliphatic epoxy resin to provide weatherability and resistance to ultraviolet (UV) radiation. This approach of selectively encasing surfaces of the main encapsulant with the outer housing, based on a relatively lower cost epoxy resin, is effective to balance competing demands, such as reducing a total monetary cost of the encapsulation housing system while meeting requisites regarding weatherability and UV radiation resistance.

An outdoor electrical apparatus (10) and methodology for manufacturing such apparatus are provided. The apparatus includes an electrical device (12), and an encapsulation housing system including a main encapsulant (11a) and an outer housing (11b). The main encapsulant may be arranged to encapsulate the electrical device, and the outer housing may be arranged to selectively encase surfaces of the main encapsulant based on an extent to which the surfaces of the main encapsulant otherwise would be subject to outdoor exposure. The main encapsulant comprises a bisphenol epoxy resin, and the outer housing comprises a cycloaliphatic epoxy resin to provide weatherability and resistance to ultraviolet (UV) radiation. This approach of selectively encasing surfaces of the main encapsulant with the outer housing, based on a relatively lower cost epoxy resin, is effective to balance competing demands, such as reducing a total monetary cost of the encapsulation housing system while meeting requisites regarding weatherability and UV radiation resistance.

A durable but thin-film conductive composition of increased flexibility comprises about 90 parts by weight to about 110 parts by weight of a thermosetting resin, about 900 parts by weight to about 1100 parts by weight of a conductive agent, about 10 parts by weight to about 15 parts by weight of a hardener, and about 0 part by weight to about 50 parts by weight of a thixotropic agent. The disclosure further provides a conductive film formed by heating and curing the conductive composition and a circuit board with several circuit layers joined by the conductive film.

A durable but thin-film conductive composition of increased flexibility comprises about 90 parts by weight to about 110 parts by weight of a thermosetting resin, about 900 parts by weight to about 1100 parts by weight of a conductive agent, about 10 parts by weight to about 15 parts by weight of a hardener, and about 0 part by weight to about 50 parts by weight of a thixotropic agent. The disclosure further provides a conductive film formed by heating and curing the conductive composition and a circuit board with several circuit layers joined by the conductive film.

Disclosed herein are a black photosensitive resin composition and a black column spacer prepared therefrom. The black photosensitive resin composition may form a cured film exhibiting good adhesion to a substrate, good height difference property, good surface roughness and high light shielding property (optical density), and may be effectively used for the formation of a cured film, particularly a black column spacer, of a liquid crystal display (LCD) or an organic light-emitting diode (OLED) display.