C08G64/00

Low shear process for polycarbonate purification

In another embodiment, a process of purifying an interfacially polymerized polycarbonate from a feed comprising an aqueous phase and an organic phase comprising an organic solvent, the interfacially polymerized polycarbonate, a catalyst, and ions, can comprise: separating the aqueous phase and the organic phase from the feed, wherein during the separating the feed is subjected to at least one of: energy of less than or equal to 0.5 kJ/kg of feed, a shear rate of less than 150,000 S.sup.1, and centrifugal forces of 100 to 2,000 g-force; to form a purified aqueous phase and a purified organic phase comprising a purified polycarbonate.

Decorative sheet, and decorative resin-molded article employing same

The invention provides a decorative sheet including at least a surface protective layer on a substrate, in which the surface protective layer includes a cured material of an ionizing radiation curable resin composition at least containing a polycarbonate(meth)acrylate (A) and a multi-functional (meth)acrylate (B) in a mass ratio (A)/(B) of (98/2)-(70/30). The invention also provides a decorative sheet including at least a surface protective layer on a substrate, in which the surface protective layer includes a cured material of an ionizing radiation curable resin composition at least containing an acrylic silicone (meth)acrylate (C) and a multi-functional (meth)acrylate (B) in a mass ratio (C)/(B) of (50/50)-(95/5). The present invention provides a decorative sheet with a surface protective layer having scratch resistance as well as three-dimensional formability.

ADHESIVE COMPOSITION AND ARTICLE

The present invention provides an adhesive composition excellent in adhesiveness to resin materials, and an article containing a cured product of the adhesive composition. The adhesive composition of the present invention includes a polyether polycarbonate diol that has a number average molecular weight of 500 to 10000, and has no specific reactive silicon group, or a polyether polycarbonate polymer (A) having the specific reactive silicon group.

High temperature resistance, radiation curable maskant for metal substrates

A method for shielding a metal substrate surface during the application of heat to the surroundings of the substrate which comprises. A liquid maskant composition is formed which comprises: a) at least one of a polycarbonate urethane diacrylate oligomer, a polycarbonate urethane dimethacrylate oligomer, a polycarbonate caprolactone urethane diacrylate oligomer, or a polycarbonate caprolactone urethane dimethacrylate oligomer; b) a reactive diluent capable of free radical polymerization; and c) a photoinitiator capable of generating free radicals when exposed to actinic radiation. The maskant composition is applied onto a surface of the substrate. The maskant composition is then exposed to sufficient actinic radiation to polymerize or crosslink the composition into a dried maskant. In use the dried maskant is heated on the substrate to a temperature of from about 400 F. to about 600 F. for from about 20 minutes to about 30 minutes, and then the maskant is removed.

High temperature resistance, radiation curable maskant for metal substrates

A method for shielding a metal substrate surface during the application of heat to the surroundings of the substrate which comprises. A liquid maskant composition is formed which comprises: a) at least one of a polycarbonate urethane diacrylate oligomer, a polycarbonate urethane dimethacrylate oligomer, a polycarbonate caprolactone urethane diacrylate oligomer, or a polycarbonate caprolactone urethane dimethacrylate oligomer; b) a reactive diluent capable of free radical polymerization; and c) a photoinitiator capable of generating free radicals when exposed to actinic radiation. The maskant composition is applied onto a surface of the substrate. The maskant composition is then exposed to sufficient actinic radiation to polymerize or crosslink the composition into a dried maskant. In use the dried maskant is heated on the substrate to a temperature of from about 400 F. to about 600 F. for from about 20 minutes to about 30 minutes, and then the maskant is removed.

Method of producing polycarbonate-based polymer microparticles comprising contacting an emulsion with a poor solvent, and polycarbonate-based polymer microparticles
09567443 · 2017-02-14 · ·

A method of producing polycarbonate-based polymer microparticles including forming an emulsion in a system in which a polycarbonate-based polymer (A), a polymer (B) different from the polycarbonate-based polymer (A) and an organic solvent (C) are dissolved and mixed together and which causes phase separation into two phases of a solution phase having the polycarbonate-based polymer (A) as its main component and a solution phase having the polymer (B) different from the polycarbonate-based polymer (a) as its main component, and contacting a poor solvent for the polycarbonate-based polymer (A) with the emulsion at a temperature of 80 C. or higher to thereby precipitate microparticles of the polycarbonate-based polymer (A).

Method of producing polycarbonate-based polymer microparticles comprising contacting an emulsion with a poor solvent, and polycarbonate-based polymer microparticles
09567443 · 2017-02-14 · ·

A method of producing polycarbonate-based polymer microparticles including forming an emulsion in a system in which a polycarbonate-based polymer (A), a polymer (B) different from the polycarbonate-based polymer (A) and an organic solvent (C) are dissolved and mixed together and which causes phase separation into two phases of a solution phase having the polycarbonate-based polymer (A) as its main component and a solution phase having the polymer (B) different from the polycarbonate-based polymer (a) as its main component, and contacting a poor solvent for the polycarbonate-based polymer (A) with the emulsion at a temperature of 80 C. or higher to thereby precipitate microparticles of the polycarbonate-based polymer (A).

POLYMERIC LAPPING MATERIALS, MEDIA AND SYSTEMS INCLUDING POLYMERIC LAPPING MATERIAL, AND METHODS OF FORMING AND USING SAME

A polymeric material suitable for use in lapping processes, media including the polymeric material, systems including the media, and methods of forming and using the polymeric material are disclosed. The polymeric material can be used to lap hard surfaces, such as sapphire surfaces. The lapping process can be performed after a grinding process and before a polishing process.

METHODS USEFUL FOR RECOVERING POLYMERS FROM ELECTRONIC AND OTHER WASTES

Systems and methods for purifying or recycling polymeric materials such as polycarbonates are disclosed. Such methods may include performing two or more extractions using differing solvent media to remove non-target materials and attain a purified composition of a target polymer. Other steps including dissolution, precipitation, filtration, and/or centrifugation may also be performed in the methods of the present invention.

METHODS USEFUL FOR RECOVERING POLYMERS FROM ELECTRONIC AND OTHER WASTES

Systems and methods for purifying or recycling polymeric materials such as polycarbonates are disclosed. Such methods may include performing two or more extractions using differing solvent media to remove non-target materials and attain a purified composition of a target polymer. Other steps including dissolution, precipitation, filtration, and/or centrifugation may also be performed in the methods of the present invention.